MX29GL512E H/L
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MX29GL512EHXFI-10Q (pdf) |
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MX29GL512ELXFI-10Q |
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MX29GL512ELT2I-10Q |
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MX29GL512EHT2I-10Q |
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MX29GL512E H/L MX29GL512E H/L DATASHEET The MX29GL512E product family is not recommended for new designs. The MX29GL512F family is the recommended replacement. Please refer to MX29GL512F datasheet for full specifications and ordering information, or contact your local sales representative for additional support. P/N:PM1524 MX29GL512E H/L SINGLE VOLTAGE 3V ONLY FLASH MEMORY The MX29GL512E product family is not recommended for new designs. The MX29GL512F family is the recommended replacement. Please refer to MX29GL512F datasheet for full specifications and ordering information, or contact your local sales representative for additional support. GENERAL FEATURES • to volt for read, erase, and program operations • Byte/Word mode switchable - 67,108,864 x 8 / 33,554,432 x 16 • 64KW/128KB uniform sector architecture - 512 equal sectors • 16-byte/8-word page read buffer • 64-byte/32-word write buffer • Extra 128-word sector for security - Features factory locked and identifiable, and customer lockable • Advanced sector protection function Solid and Password Protect • Compatible with JEDEC standard - Pinout and software compatible to single power supply Flash PERFORMANCE • High Performance - Fast access time 110ns VCC=2.7~3.6V , 100ns VCC=3.0~3.6V - Page access time 25ns - Fast program time 10us/word - Fast erase time 0.5s/sector • Low Power Consumption - Low active read current 10mA typical at 5MHz - Low standby current 40uA typical • Typical 100,000 erase/program cycle • 20 years data retention SOFTWARE FEATURES • Program/Erase Suspend & Program/Erase Resume • Status Reply - Data# Polling & Toggle bits provide detection of program and erase operation completion • Support Common Flash Interface CFI HARDWARE FEATURES • Ready/Busy# RY/BY# Output - Provides a hardware method of detecting program and erase operation completion • Hardware Reset# Input - Provides a hardware method to reset the internal state machine to read mode • WP#/ACC input pin - Hardware write protect pin/Provides accelerated program capability PACKAGE • 56-Pin TSOP • 64-Ball LFBGA 11mm x 13mm • 70-Pin SSOP • All devices are RoHS Compliant and Halogen-free P/N:PM1524 PIN CONFIGURATION 56 TSOP RESET# WP#/ACC RY/BY# MX29GL512E H/L BYTE# Q15/A-1 VI/O 64 LFBGA P/N:PM1524 BYTE# Q15/ RES- WP#/ MX29GL512E H/L 70 SSOP BYTE# WP#/ACC RESET# Q15/A-1 Note "*" Do not connect to Vih or Vcc PIN DESCRIPTION SYMBOL PIN NAME A0~A24 Q0~Q14 Q15/A-1 ORDERING INFORMATION PART NO. MX29GL512EHMC-10Q ** MX29GL512EHXFI-10Q MX29GL512ELXFI-10Q MX29GL512EHT2I-10Q MX29GL512ELT2I-10Q ACCESS TIME ns 100 Note * 10Q covers 2.7V~3.6V for 110ns and 3.0V~3.6V for 100ns. ** 70-pin SSOP only for Pachinko Socket. PACKAGE 70 Pin SSOP 64 LFBGA 64 LFBGA 56 Pin TSOP 56 Pin TSOP Remark VI/O=VCC VI/O=VCC VI/O=VCC VI/O=VCC VI/O=VCC P/N:PM1524 MX29GL512E H/L PART NAME DESCRIPTION MX 29 GL 512 E H T2 I OPTION Q RoHS Compliant & Halogen-free with restricted Vcc 3.0V~3.6V Note 1 SPEED 10 100ns TEMPERATURE RANGE I Industrial -40° C to 85° C C Commercial 0° C to 70° C PACKAGE T2 56-TSOP M 70SSOP XF LFBGA 11mm x 13mm BOOT BLOCK TYPE H VI/O=VCC=2.7 to 3.6V, Highest Address Sector Protected L VI/O=VCC=2.7 to 3.6V, Lowest Address Sector Protected DENSITY & MODE 512 512Mb x8/x16 Architecture TYPE GL 3V Page Mode DEVICE 29:Flash Note 1 10Q covers 2.7V~3.6V for 110ns and 3.0V~3.6V for 100ns P/N:PM1524 PACKAGE INFORMATION MX29GL512E H/L P/N:PM1524 MX29GL512E H/L P/N:PM1524 MX29GL512E H/L P/N:PM1524 MX29GL512E H/L Removed "Advanced Information" Added "Note "*" Do not connect to Vih or Vcc" Page P2 P4 Corrected content error Added notes for Status Polling Figure 15 & 16 P53,54 Added "After enter Security .....lock region" into Security Sector P28 Flash Memory Region Modified "PIN CAPACITANCE" table Modified description for RoHS compliance P2,63 |
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