0402SFF050F/24-2

0402SFF050F/24-2 Datasheet

1206/0603/0402 Series

Part	Datasheet
0402SFF050F/24-2	0402SFF050F/24-2 (pdf)

Related Parts	Information
0402SFF075F/24-2	0402SFF075F/24-2

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Surface-mount Fuses Fundamentals Surface-mount Fuses Fundamentals Overview TE Circuit Protection offers the widest selection of surface-mount fuses available for addressing a broad range of overcurrent protection applications. Helping to prevent costly damage and promote a safe environment for electronic and electrical equipment, our single-use chip fuses provide performance stability to support applications with current ratings from .5A up to 20A. TE Circuit Protection also offers the telecom FT600 fuse for telecommunications applications. This telecom fuse helps comply with North American overcurrent protection requirements, including Telcordia, GR-1089, TIA-968-A formerly FCC Part 68 , and UL60950 3rd edition. Multi-layer Design for Chip Fuses The multi-layer design has the benefit of exposing more fuse element surface area to the glass-ceramic absorption material. When the fuse elements open, there is more material for the vaporizing fuse metals to absorb into, resulting in a very efficient and effective quenching of the fuse arc. Figure 1 compared the multi-layer design of our SFF fuses with standard glass coated designs. The glass coated designs rely on the coating on only one side of the fuse element to absorb the vaporizing fuse material when it opens. Therefore, there is much less absorption material available to absorb the fuse metals. The result can be prolonged arcing and possible coating breach. Figure 2 shows how the absorption characteristics of the two designs differ. The multi-layer design indicates a clean separation with the fuse element evenly diffusing into the surrounding ceramic substrate. In the glass coated design, the element diffusion takes place in a small portion of the device and is only absorbed by the glass material directly above the area of failure. Figure 1 Glass/Ceramic Multiple Fuse Substrate Elements Substrate Single Fuse Glass Material Element Coating Multi-layer Design Single-layer Glass Coated Design Figure 2 Fault Zones Multi-layer Design Single-layer Glass Coated Design Wire-In-Air Design for 2410SFV Fuses The 2410 6125 is a Wire-In-Air SMD Fuse which is very suitable for secondary level over current protection applications. Figure 3 compared our straight wire element design 2410SFV fuses with normal corrugating wire design fuse. The straight wire element in air performs consistent fusing and cutting characteristics together with excellent inrush current withstanding capability. Introduced PCB assembly technology into 2410SFV fuses design and manufacture, we achieved on lead free completely and no end cap falling off risk comparing with traditional ceramic body with end cap fuse. Figure 3 Glass fiber enforced epoxy body Straight wire element Copper terminal plated with Ni and Tin Ceramic body Corrugate wire element End cap plated with Tin Temperature Derating A fuse is a temperature sensitive device. Therefore, operating temperature will have an effect on fuse performance and lifetime. Operating temperature should be taken into consideration when selecting the fuse current rating. The Thermal Derating Curve for surface mount fuses is presented in Figure Use it to determine the derating percentage based on operating temperature and apply it to the derated system current. Figure 4 1206/0603/0402 Series Temperature Effect on Current Rating % De-rating 105 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 -55 -35 85 105 125 145 Maximum Operating Temperature °C % De-rating 110 105 100 95 90 85 80 75 70 65 60 55 50 2410 Series Temperature Effect On Current Rating

PDF Datasheet Preview

Surface-mount Fuses Fundamentals

Surface-mount Fuses Fundamentals

Overview

TE Circuit Protection offers the widest selection of surface-mount fuses available for addressing a broad range of overcurrent protection applications. Helping to prevent costly damage and promote a safe environment for electronic and electrical equipment, our single-use chip fuses provide performance stability to support applications with current ratings from .5A up to 20A.

TE Circuit Protection also offers the telecom FT600 fuse for telecommunications applications. This telecom fuse helps comply with North American overcurrent protection requirements, including Telcordia, GR-1089, TIA-968-A formerly FCC Part 68 , and UL60950 3rd edition.

Multi-layer Design for Chip Fuses

The multi-layer design has the benefit of exposing more fuse element surface area to the glass-ceramic absorption material. When the fuse elements open, there is more material for the vaporizing fuse metals to absorb into, resulting in a very efficient and effective quenching of the fuse arc.

Figure 1 compared the multi-layer design of our SFF fuses with standard glass coated designs. The glass coated designs rely on the coating on only one side of the fuse element to absorb the vaporizing fuse material when it opens. Therefore, there is much less absorption material available to absorb the fuse metals. The result can be prolonged arcing and possible coating breach.

Figure 2 shows how the absorption characteristics of the two designs differ. The multi-layer design indicates a clean separation with the fuse element evenly diffusing into the surrounding ceramic substrate. In the glass coated design, the element diffusion takes place in a small portion of the device and is only absorbed by the glass material directly above the area of failure.

Figure 1

Glass/Ceramic Multiple Fuse

Substrate

Elements

Substrate Single Fuse Glass Material Element Coating

Multi-layer Design

Single-layer Glass Coated Design

Figure 2

Fault Zones

Multi-layer Design Single-layer Glass Coated Design

Wire-In-Air Design for 2410SFV Fuses

The 2410 6125 is a Wire-In-Air SMD Fuse which is very suitable for secondary level over current protection applications.

Figure 3 compared our straight wire element design 2410SFV fuses with normal corrugating wire design fuse. The straight wire element in air performs consistent fusing and cutting characteristics together with excellent inrush current withstanding capability.

Introduced PCB assembly technology into 2410SFV fuses design and manufacture, we achieved on lead free completely and no end cap falling off risk comparing with traditional ceramic body with end cap fuse.

Figure 3

Glass fiber enforced epoxy body Straight wire element

Copper terminal plated with Ni and Tin

Ceramic body Corrugate wire element End cap plated with Tin

Temperature Derating

A fuse is a temperature sensitive device. Therefore, operating temperature will have an effect on fuse performance and lifetime. Operating temperature should be taken into consideration when selecting the fuse current rating. The Thermal Derating Curve for surface mount fuses is presented in Figure Use it to determine the derating percentage based on operating temperature and apply it to the derated system current.

Figure 4
1206/0603/0402 Series

Temperature Effect on Current Rating
% De-rating
105 100
95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10
-55 -35
85 105 125 145

Maximum Operating Temperature °C
% De-rating
110 105 100 95 90 85 80 75 70 65 60 55 50
2410 Series Temperature Effect On Current Rating

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Datasheet ID: 0402SFF050F/24-2 646571