RTP200HR010SA

RTP200HR010SA Datasheet

PRODUCT RTP200HR010SA

Part	Datasheet
RTP200HR010SA	RTP200HR010SA (pdf)

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High Current Reflowable Thermal Protection Device PRODUCT RTP200HR010SA Specification Status Released PIN CONFIGURATION AND DESCRIPTION: Note D2 is product code xxxx is Batch code P Arm TABLE DIMENSIONS: MIN MAX C MIN MAX MIN MAX E MAX High Current Reflowable Thermal Protection Device PRODUCT RTP200HR010SA TABLE ABSOLUTE MAX RATINGS: Absolute Max Ratings Max DC Open Voltage 1 Max DC Interrupt Current 1 ESD rating Human Body Model Max Reflow Temperature pre-arming Operating temperature limits, Junction Pth and Storage Temperature 16 500 25 260 -55 150 Units VDC A KV °C Conditions 16 VDC 10A, 100 h Performance capability at these conditions can be influenced by board design. Performance should be verified in the user’s system. TABLE PERFORMANCE CHARACTERISTICS Typical unless otherwise specified : Resistance and Open Characteristics P1 to PTH Min Typ Max RPP Resistance from P1 to PTH 23+/-3°C 150+/-3°C 100 150 250 Operating Voltage Open Temperature, post-arming Installation dependent Operating Current, postarming 2 Moisture Sensitivity Level Rating 3 IPP = 0 23+/-3°C 140+/-3°C 202 210 218 90 45 Units µΩ VDC °C A Results obtained on 44.4mm x 57.2mm x 1.6mm of 2-sided FR4 board T4350 with oz Copper trace. RTP device pad connection of - 283 sq. mm oz copper heat spreader connected to I P1 pad. - 237 sq. mm oz copper heat spreader connected to I PTH pad. Results are highly installation-dependent. Users should confirm for their own applications.

PDF Datasheet Preview

High Current Reflowable Thermal Protection Device

PRODUCT RTP200HR010SA

Specification Status Released

PIN CONFIGURATION AND DESCRIPTION:

Note D2 is product code xxxx is Batch code

P Arm

TABLE DIMENSIONS:

MIN MAX

C MIN MAX

MIN MAX

E MAX

High Current Reflowable Thermal Protection Device

PRODUCT RTP200HR010SA

TABLE ABSOLUTE MAX RATINGS:

Absolute Max Ratings

Max DC Open Voltage 1 Max DC Interrupt Current 1 ESD rating Human Body Model Max Reflow Temperature pre-arming

Operating temperature limits, Junction Pth and Storage Temperature
16 500 25 260
-55 150

Units

VDC A KV °C

Conditions
16 VDC
10A, 100 h

Performance capability at these conditions can be influenced by board design. Performance should be verified in the user’s system.

TABLE PERFORMANCE CHARACTERISTICS Typical unless otherwise specified :

Resistance and Open Characteristics P1 to PTH

Min Typ Max

RPP Resistance from P1 to PTH
23+/-3°C 150+/-3°C
100 150 250

Operating Voltage

Open Temperature, post-arming

Installation dependent Operating Current, postarming 2 Moisture Sensitivity Level Rating 3

IPP = 0
23+/-3°C 140+/-3°C
202 210 218
90 45

Units µΩ VDC °C A

Results obtained on 44.4mm x 57.2mm x 1.6mm of 2-sided FR4 board T4350 with oz Copper trace. RTP device pad connection of - 283 sq. mm oz copper heat spreader connected to I P1 pad. - 237 sq. mm oz copper heat spreader connected to I PTH pad.

Results are highly installation-dependent. Users should confirm for their own applications.

More datasheets: M2004-02-622.0800T | M2004-02-644.5313 | M2004-02I400.0000 | M2004-02-622.0800 | M2004-02-644.5313T | M2004-02I622.0800 | M2004-02-400.0000T | M2004-02I622.0800T | M2004-02-400.0000 | DAM3W3PF225

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived RTP200HR010SA Datasheet file may be downloaded here without warranties.

Datasheet ID: RTP200HR010SA 646569