A13717-01
A13717-01 Datasheet
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2011 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. A13850-00 Rev I, 11/2011
| Part | Datasheet |
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A13717-01 |
A13717-01 (pdf) |
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| PDF Datasheet Preview |
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| Innovative Technology for a Connected World TputtyTM 504 Series Soft, Silicone Gel Tputty 504 is a soft silicone gel thermal gap filler ideal for applications where large gap tolerances are present. The silicone gel is filled with a complex matrix of ceramic fillers to yield superior thermal performance. Tputty 504 is soft and compliant transferring little to no pressure between interfaces. Because Tputty 504 has a higher viscosity than grease, it eliminates the bleed and pump-out usually associated with grease. Bond line variances can also be more easily controlled than with traditional thermal pads. Tputty 504 can be applied like grease and is easily dispensable from a wide range of commercially available equipment including screen print, syringe and automated equipment. • Soft and compliant transferring little to no pressure between interfaces • W/mK thermal conductivity • Available in 10cc, 30cc and 55cc syringes • Available in 100cc,170cc and 305cc auto dispense cartridges • Available in bulk containers from sample jars through 20 kg pails • Applies like grease and is easily dispensable from a wide range of commercially available equipment including screen print, syringe and automated equipment • Flip chip microprocessors • PPGAs, micro BGAs, BGAs • DSP chips, graphic accelerator chips • Other high-wattage electronic components • LED lighting global solutions local support TM Americas Europe Asia: Innovative Technology for a Connected World TputtyTM 504 Series Construction & Composition Color Viscocity 23ºC, mPa.s cP Brookfield RV, TC spindle, Helipath rpm Temperature Range Thermal Conductivity Density Thermal Impendance Final Thickness Thermal Impendance Final Thickness Dielectric Strength Volume Resistivity MSDS Outgassing TML, wt% / vol% Outgassing CVCM, wt% / vol% TputtyTM 504 Ceramic-filled dispensable silicone gel Light Grey 4,000,000 to 8,000,000 -45ºC to 200ºC W/mK g/cc 500 VAC/mil >1014 ohm-cm Available upon request TEST METHOD Visual ASTM D5470 ASTM D5470 modified ASTM D5470 modified ASTM D149 ASTM D2240 ASTM E595 ASTM E595 Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. THR-DS-Tputty-504 1111 |
| More datasheets: MIKROE-2148 | MIKROE-2146 | MIKROE-2149 | MIKROE-2147 | TCAD002 | A15638-01 | A13926-02 | A13717-05 | A15685-00 | A13926-04 |
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