A16339-08

A16339-08 Datasheet

Part	Datasheet
A16339-08	A16339-08 (pdf)

Related Parts	Information
A16344-10	A16344-10
A16344-08	A16344-08
A16339-10	A16339-10

PDF Datasheet Preview
Innovative Technology for a Connected World TpcmTM 670 TpcmTM 670DF Tpcm 670 is a high performance, inherently tacky, easy to rework phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of mobile processors. Tpcm 670 is optimized for multi-core and general CPU and GPU processors including Intel’s Penryn Quad-Core mobile processor. contact thermal resistance by filling the microscopic irregularities of the components it contacts. Begins to soften and flow at approximately 48ºC. to minimize migration pump out at CPU operating temperatures using a unique material formulation that softens, but does not fully change phase. • Naturally tacky at room temperature, requiring no adhesive. • Heat sink preheating not required. • Supplied on tabbed liners for easy manual or automatic application. • Exceptionally high reliability. • Available with Laird Technologies easy release DF patent pending layer. DF patent pending minimizes the force required to disassemble after burn-in while still maintaining the highest possible thermal performance and exceptional reliability. PROPERTIES Color Thickness, inches mm Thickness Tolerance, inches mm Construction & Composition Specific Gravity, g/cc Shelf Life Operating Temperature Range, °C Phase Change Softening Range,°C Thermal Conductivity, W/mK Thermal Resistance Outer core, 25 micron die height offset, °C-cm2/W, °C-mm2/W 50 psi °C-in2/ W 345 Kpa, °C-cm2/W * patent pending TpcmTM 670 *TpcmTM 670DF Grey Non-reinforced Film 1 year -40 to 125°C 45 to 70°C TEST METHOD Visual Helium Pycnometer Hot Disk Thermal Constants Analyzer Intel Mobile TIM Tester ASTM D5470 modified ASTM D5470 modified global solutions local support TM Americas Europe Asia: THR-DS-Tpcm-670-670DF 0910 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.

PDF Datasheet Preview

Innovative Technology for a Connected World

TpcmTM 670 TpcmTM 670DF

Tpcm 670 is a high performance, inherently tacky, easy to rework phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of mobile processors. Tpcm 670 is optimized for multi-core and general CPU and GPU processors including Intel’s Penryn Quad-Core mobile processor.
contact thermal resistance by filling the microscopic irregularities of the components it contacts. Begins to soften and flow at approximately 48ºC.
to minimize migration pump out at CPU operating temperatures using a unique material formulation that softens, but does not fully change phase.
• Naturally tacky at room temperature, requiring no adhesive.
• Heat sink preheating not required.
• Supplied on tabbed liners for easy manual or automatic application.
• Exceptionally high reliability.
• Available with Laird Technologies easy release DF patent pending layer. DF patent pending minimizes the force required to disassemble after burn-in while still maintaining the highest possible thermal performance and exceptional reliability.

PROPERTIES Color Thickness, inches mm

Thickness Tolerance, inches mm Construction & Composition Specific Gravity, g/cc Shelf Life Operating Temperature Range, °C Phase Change Softening Range,°C Thermal Conductivity, W/mK

Thermal Resistance Outer core, 25 micron die height offset,
°C-cm2/W, °C-mm2/W 50 psi °C-in2/ W
345 Kpa, °C-cm2/W
* patent pending

TpcmTM 670
*TpcmTM 670DF

Grey

Non-reinforced Film
1 year
-40 to 125°C
45 to 70°C

TEST METHOD Visual

Helium Pycnometer

Hot Disk Thermal Constants Analyzer Intel Mobile TIM Tester ASTM D5470 modified ASTM D5470 modified
global solutions local support TM Americas Europe Asia:

THR-DS-Tpcm-670-670DF 0910

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived A16339-08 Datasheet file may be downloaded here without warranties.

Datasheet ID: A16339-08 645337