A15322-01

A15322-01 Datasheet

Part	Datasheet
A15322-01	A15322-01 (pdf)

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Laird Technologies Web site: Tflex 300 Series Gap Filler Material Ultra Compliant, Thermal Gap Filler for High-Speed Computing and Telecommunications Applications Results 1 - 20 of 20 Item # Tflex 320 Tflex 330 Tflex 340-FG Tflex 340 Tflex 350 Tflex 360 Tflex 370 Tflex 380 Tflex 390 Tflex 3100 Tflex 3110 Tflex 3120 Tflex 3130 Tflex 3140 Tflex 3150 Tflex 3160 Tflex 3170 Tflex 3180 Tflex 3190 Tflex 300 is a silicone gel combined with a ceramic powder to offer an unique combination of compliancy, thermal resistance and price. Tflex 300, at pressures of 50 psi, deflect over 50% the original thickness. This high rate of compliancy allows the material to "totally blanket" the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of W/m-K, low thermal resistances can be achieved at low pressures. Tflex 300 is offered with a hard, metallized liner option for easy handling and improved rework. This metallized liner offers better thermal transfer than other silicone based liners found on comparable products. The metallized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. Color Mint Thickness inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm inches mm Density g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc Hardness 56 Shore OO 56 Shore OO 56 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO Thermal Resistance Thermal Resistance at 10 psi at 69 KPa ºC-in2/W ºC-cm2/W ºC-in2/W ºC-cm2/W ºC-in2/W ºC-cm2/W ºC-in2/W ºC-cm2/W

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Laird Technologies Web site:

Tflex 300 Series Gap Filler Material Ultra Compliant, Thermal Gap Filler for High-Speed Computing and Telecommunications Applications

Results 1 - 20 of 20

Item # Tflex 320 Tflex 330 Tflex 340-FG Tflex 340 Tflex 350 Tflex 360 Tflex 370 Tflex 380 Tflex 390 Tflex 3100 Tflex 3110 Tflex 3120 Tflex 3130 Tflex 3140 Tflex 3150 Tflex 3160 Tflex 3170 Tflex 3180 Tflex 3190

Tflex 300 is a silicone gel combined with a ceramic powder to offer an unique combination of compliancy, thermal resistance and price.

Tflex 300, at pressures of 50 psi, deflect over 50% the original thickness. This high rate of compliancy allows the material to "totally blanket" the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times.

Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of W/m-K, low thermal resistances can be achieved at low pressures. Tflex 300 is offered with a hard, metallized liner option for easy handling and improved rework. This metallized liner offers better thermal transfer than other silicone based liners found on comparable products. The metallized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.

Color Mint

Thickness
inches mm
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inches mm
inches mm
inches mm
inches mm
inches mm
inches mm
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inches mm
inches mm
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inches mm

Density g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc g/cc

Hardness 56 Shore OO 56 Shore OO 56 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO 27 Shore OO

Thermal Resistance Thermal Resistance
at 10 psi
at 69 KPa
ºC-in2/W
ºC-cm2/W
ºC-in2/W
ºC-cm2/W
ºC-in2/W
ºC-cm2/W
ºC-in2/W
ºC-cm2/W

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Datasheet ID: A15322-01 645333