67SLG030030050PI00
67SLG030030050PI00 Datasheet
| Part | Datasheet |
|---|---|
67SLG030030050PI00 |
67SLG030030050PI00 (pdf) |
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| PDF Datasheet Preview |
|---|
| Soft SMD Grounding Contacts Metallized Film-over-Foam SMD METALLIZED FILM-OVER-FOAM GROUNDING CONTACT Laird’s SMD Surface Mount Device Grounding Contact is a foam cored contact with a metalized polyimide film outer covering. It is used for circuit grounding of SMT Surface Mount Technology devices. These contacts are designed to be solder reflow compatible, and are suitable for automatic processing. • Sn / Cu Plated PI Film outer layer • Polymeric Foam Core • Soft SMD contacts are RoHS compliant • Halogen-free per IEC-61249-2-21 standard • Reflow tunnel compatible to 260° C • Patent Pending • UL94 HB Flammability Rating MARKETS • Cabinet applications • LCD and Plasma TV • Medical equipment • Servers • Printers • Automotive • Laptop computers and tablets • Networking equipment • Desktop computers • Telecommunications cabinets Item Unit Z-Axis Resistance Before Reflow After Reflow Flammability Solder Adhesion Strength Contact to PCB Hardness Shore A durometer Compression Set Operation Temperature Restricted Substances * UL file number E170327, UL designation code HB 026 Value PASS Test Method Laird Internal UL 94 HB* Laird Internal ASTM D 2240 ASTM D3574 Test D -40° to 70° RoHS Compliant Halogen Free Force/Displacement/Resistance Graph of Laird Soft SMD Contact 7 mm x 7 mm rectangle shape Americas Europe Asia: Soft SMD Grounding Contacts Metallized Film-over-Foam PRODUCT COMPOSITION PRODUCT APPLICATION Sn/Cu Plated PI Film Foam SMD Contact Solder Paste Pad Printed Circuit Board PART NUMBER STRUCTURE Rectangular Shape SMD Ground Contacts |
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