430891-404

430891-404 Datasheet

Part	Datasheet
430891-404	430891-404 (pdf)

Related Parts	Information
430891-403	430891-403
430891-414	430891-414
430891-415	430891-415

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eTEC Series HV37,48,F2,0202,GG Thin Film Thermoelectric Module Americas +1 Europe Asia: The eTEC Series is a thin film thermoelectric module TEM with high heat flux density. Due to its size, input power requirements and heat pumping capacity this device is suited for use in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries. The eTEC HV37 can produce Watts of cooling capacity at 25°C ambient in a 9 mm2 footprint. Assembled with thin film semiconductor material and thermally conductive Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies. • Micro Footprint • High Heat Pumping Density • Precise Temperature Control • Reliable Solid State Operation • <2 ms Response Time • RoHS Compliant • Laser Diodes • Photodiodes • Infrared IR Sensors • Pump Lasers • Crystal Oscillators • Optical Transceivers PERFORMANCE SPECIFICATIONS Hot Side Temperature °C 25°C 50°C Qmax Watts Delta Tmax °C Imax Amps Vmax Volts Qmax / area W/cm2 Electrical Resistance Ohms Thermal Resistance K/W PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C Peak Assembly Temperature TEMPERATURE CONDITIONS Max Operating Temperature OPERATING CONDITIONS Max rate of change of current 60 sec 325°C 150°C Amps/sec eTEC Series HV37,48,F2,0202,GG Thin Film Thermoelectric Module PERFORMANCE CURVES COEFFICIENT OF PERFORMANCE ISOMETRIC DRAWING Standard Au metallization on exterior ceramic substrate surfaces wire bondable pads side ceramic for lead attachment DIMENSIONS ARE IN INCHES NAME TOLERANCES: DRAWN FRACTIONAL ANGULAR MACH BEND

PDF Datasheet Preview

eTEC Series HV37,48,F2,0202,GG

Thin Film Thermoelectric Module

Americas +1 Europe Asia:

The eTEC Series is a thin film thermoelectric module TEM with high heat flux density. Due to its size, input power requirements and heat pumping capacity this device is suited for use in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries.

The eTEC HV37 can produce Watts of cooling capacity at 25°C ambient in a 9 mm2 footprint. Assembled with thin film semiconductor material and thermally conductive Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies.
• Micro Footprint
• High Heat Pumping Density
• Precise Temperature Control
• Reliable Solid State Operation
• <2 ms Response Time
• RoHS Compliant
• Laser Diodes
• Photodiodes
• Infrared IR Sensors
• Pump Lasers
• Crystal Oscillators
• Optical Transceivers

PERFORMANCE SPECIFICATIONS

Hot Side Temperature °C
25°C
50°C

Qmax Watts

Delta Tmax °C

Imax Amps

Vmax Volts

Qmax / area W/cm2

Electrical Resistance Ohms

Thermal Resistance K/W

PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C Peak Assembly Temperature

TEMPERATURE CONDITIONS Max Operating Temperature

OPERATING CONDITIONS Max rate of change of current
60 sec 325°C
150°C

Amps/sec
eTEC Series HV37,48,F2,0202,GG

Thin Film Thermoelectric Module

PERFORMANCE CURVES

COEFFICIENT OF PERFORMANCE

ISOMETRIC DRAWING

Standard

Au metallization on exterior ceramic substrate surfaces
wire
bondable
pads
side
ceramic for lead attachment DIMENSIONS ARE IN INCHES

NAME

TOLERANCES:

DRAWN

FRACTIONAL ANGULAR MACH

BEND

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Datasheet ID: 430891-404 645188