SPW0430HR5HB-B
SPW0430HR5HB-B Datasheet
| Part | Datasheet |
|---|---|
SPW0430HR5HB-B |
SPW0430HR5HB-B (pdf) |
| Related Parts | Information |
|---|---|
SPU0409LE5H-QB |
SPU0409LE5H-QB |
SPU0409HD5H-PB |
SPU0409HD5H-PB |
| PDF Datasheet Preview |
|---|
| Application Note SiSonic Design Guide Application Note Table of Contents MEMS MICROPHONE TECHNOLOGY 3 CHOOSING THE RIGHT SISONIC 3 PACKAGE 3 OUTPUT FORMAT 7 RF PROTECTION LEVEL 10 SISONIC PRODUCT MATRIX 12 MECHANICAL DESIGN CONSIDERATIONS 14 CHOOSING THE MIC AND PORT HOLE LOCATIONS 14 ACOUSTIC PATH DESIGN 14 WIDEBAND FREQUENCY 18 ECHO AND NOISE PROBLEMS 19 PCB LAND PATTERN AND SOLDER STENCIL PATTERN 20 ELECTRICAL DESIGN CONSIDERATIONS 21 POWER 21 GROUND 21 GAIN 21 MICROPHONE TO CODEC INTERFACE CIRCUIT 22 SISONIC 2-WIRE CIRCUIT 23 MINIMIZING NOISE 24 MANUFACTURING INFORMATION 26 PICK-AND-PLACE 26 REWORK 28 HANDLING AND STORAGE 28 QUALIFICATION 28 SENSITIVITY MEASUREMENTS 30 ADDITIONAL RESOURCES 30 SiSonic Design Guide - AN16 Confidential. Intended Customer’s Internal Use Only. 2 of 30 Application Note MEMS MICROPHONE TECHNOLOGY SiSonic MEMS microphones are on the cutting edge of acoustic technology and have gained wide acceptance in many consumer electronics products including smart phones, feature phones, entry phones, laptops, tablet PCs, netbooks, PDAs, and DSCs. The principle of operation for SiSonic microphones is similar to that for traditional Electret Condenser Microphones ECMs , but since MEMS microphones are manufactured using silicon wafer processes they have smaller form factors, improved performance in varied environmental conditions, and improved ease-ofuse in designs. Purpose This application note explains the package types, output formats, and RF protection levels available in SiSonic microphones. It also provides information on mechanical design, electrical design, and on using SiSonic microphones in a mass production environment. CHOOSING THE RIGHT SISONIC MICROPHONE SiSonic microphone models vary by package type, output format, and RF protection level. The choice of package is driven by the mechanical requirements of the design, the output format by the interface chipset and the application, and the RF protection level by the proximity to antennas and other RF noise sources. The information in this section will help you choose the right SiSonic microphone for your application. PACKAGE TYPE Top-port and Bottom-port SiSonic Diagrams of the basic construction of SiSonic microphones and port-hole locations are shown in the figures below. Diaphragm & Backplate Lid Wirebonds Acoustic Port Hole Encapsulation Wall CMOS Base MEMS Back Volume Figure 1 The construction of a top-port SiSonic microphone SiSonic Design Guide - AN16 Confidential. Intended Customer’s Internal Use Only. 3 of 30 Application Note Diaphragm & Backplate Back Volume Lid Wirebonds Encapsulation Wall CMOS Base MEMS Acoustic Port Hole Figure 2 The construction of a bottom-port Zero-Height SiSonic microphone Top-port SiSonic microphones allow for traditional microphone placement and gasket design, while bottom-port Zero-Height SiSonic microphones are particularly suited for ‘thin’ product designs. Having both package choices gives designers more options for microphone placement within the design constraints. The diagrams below show typical acoustic path mechanical designs when using top-port and bottom-port microphones, along with typical frequency responses for each package. |
| More datasheets: 87457-108HLF | 87457-220HLF | 87457-208HLF | 95654-150HLF | 88714-236HLF | 86584-130HLF | 86584-208HLF | 90824-202HLF | 90824-104HLF | 90824-102HLF |
Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived SPW0430HR5HB-B Datasheet file may be downloaded here without warranties.