57-0000-1553
57-0000-1553 Datasheet
| Part | Datasheet |
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57-0000-1553 |
57-0000-1553 (pdf) |
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| SEMICONDUCTOR MATERIALS TSF-6522 No-Clean Tacky Soldering Flux Product Description Kester TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. Kester TSF-6522 can also be used in dot dispensing for BGA/PGA sites or in a rework application for surface mount packages. Kester TSF-6522 maintains its activity and dispensing characteristics for up to 8 hours and can be used in a wide range of temperature and humidity conditions. Kester maintains the highest standards by manufacturing TSF-6522 under a vacuum environment. Performance Characteristics • High tack values and long tack life • Leaves bright/shiny solder joints after reflow • Can reflow in air or nitrogen environments • Classified as ROL0 per J-STD-004 • Compliant to Bellcore GR-78 Physical Properties Viscosity typical 285 poise Malcom Viscometer 10rpm and 25°C Initial Tackiness typical 100 grams Tested to J-STD-005, IPC-TM-650, Method Acid Number mg KOH/g of flux Tested to J-STD-004, IPC-TM-650, Method Reliability Properties Copper Mirror Corrosion Low Tested to J-STD-004, IPC-TM-650, Method Corrosion Test Low Tested to J-STD-004, IPC-TM-650, Method Silver Chromate Pass Tested to J-STD-004, IPC-TM-650, Method Chloride and Bromides None Detected Tested to J-STD-004, IPC-TM-650, Method Fluorides by Spot Test Pass Tested to J-STD-004, IPC-TM-650, Method SIR, IPC typical Pass Tested to J-STD-004, IPC-TM-650, Method Day 1 Day 4 Day 7 Blank x1010 x109 TSF-6522 x 108 x 108 x 108 Application Notes TSF-6522 Standard Applications: TSF-6522 was designed for pin transfer, dot dispensing and/or syringe applications. This flux can be used as a tack and flux vehicle for soldering components to a solid solder deposit SSD , or precision pad technology PPT board surfaces. TSF-6522 is great for rework applications on all PCB packages. TSF-6522 can be used in BGA/PGA sphere/pin attachment vehicle or for repair and reballing/repinning. This flux works on flip chip, chip scale package and flip chip bumping sites assemblies as a soldering flux. Printing Parameters Temperature/Humidity Optimal ranges are 21-25°C 70-77°F and 35-65% RH Recommended Reflow Profiles Optimal activation temperatures are 130°-185°C 266-365°F . See "Soak Zone" in diagrams below. Reflow Zone 45-60 sec. Reflow Zone |
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