57-3201-4815

57-3201-4815 Datasheet

Part	Datasheet
57-3201-4815	57-3201-4815 (pdf)

PDF Datasheet Preview
Easy 256 No-Clean Solderpaste Product Description Easy 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solderpaste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning. • Stable wetting behavior over a wide range of profiles • Capable of 90 minute break times in printing • High print speeds to 200+ mm/sec 8+ in/sec • Compatible with enclosed print head systems • Excellent printing characteristics to 0.4mm 16 mil pitch with Type 3 powder • High activity on all substrates, including OSPs • Capable of off-pad printing with no solderballs after reflow • Stencil life 8+ hours process dependent • Scrap is reduced due to less paste dry out • Stable tack over 8+ hours • Classified as ROL0 per J-STD-004 • Compliant to Bellcore GR-78 Standard Applications 90% Metal - Stencil Printing 90% Metal - Enclosed Head Printing Physical Properties Data given for Sn63Pb37 90% metal, -325+500 mesh Viscosity typical :1400 poise Malcom Viscometer 10rpm and 25°C Initial Tackiness typical 40 grams Tested to Kester Method 1W-QC-3-04 Slump Test Pass Tested to J-STD-005, IPC-TM-650, Method Solder Ball Test Pass Tested to J-STD-005, IPC-TM-650, Method Wetting Test Pass Tested to J-STD-005, IPC-TM-650, Method Reliability Properties Copper Mirror Corrosion Low Tested to J-STD-004, IPC-TM-650, Method Corrosion Test Low Tested to J-STD-004, IPC-TM-650, Method Silver Chromate Pass Tested to J-STD-004, IPC-TM-650, Method Chloride and Bromides None Detected Tested to J-STD-004, IPC-TM-650, Method Fluorides by Spot Test Pass Tested to J-STD-004, IPC-TM-650, Method SIR, IPC typical Pass Tested to J-STD-004, IPC-TM-650, Method Day 1 Day 4 Day 7 Blank x1010 EP256 x 108 x 109 x 109 EP256 Application Notes Availability Easy 256 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine pitch applications. For specific packaging information, see Kester's Solder Paste Chart for available sizes. The appropriate combination depends on process variables and the specific application. Printing Parameters Squeegee Blade Squeegee Speed Stencil Material Temperature/Humidity

PDF Datasheet Preview

Easy 256 No-Clean Solderpaste

Product Description

Easy 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solderpaste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.
• Stable wetting behavior over a wide range of profiles
• Capable of 90 minute break times in printing
• High print speeds to 200+ mm/sec 8+ in/sec
• Compatible with enclosed print head systems
• Excellent printing characteristics to 0.4mm
16 mil pitch with Type 3 powder
• High activity on all substrates, including OSPs
• Capable of off-pad printing with no solderballs
after reflow
• Stencil life 8+ hours process dependent
• Scrap is reduced due to less paste dry out
• Stable tack over 8+ hours
• Classified as ROL0 per J-STD-004
• Compliant to Bellcore GR-78

Standard Applications
90% Metal - Stencil Printing 90% Metal - Enclosed Head Printing

Physical Properties

Data given for Sn63Pb37 90% metal, -325+500 mesh

Viscosity typical :1400 poise

Malcom Viscometer 10rpm and 25°C

Initial Tackiness typical 40 grams

Tested to Kester Method 1W-QC-3-04

Slump Test Pass

Tested to J-STD-005, IPC-TM-650, Method

Solder Ball Test Pass

Tested to J-STD-005, IPC-TM-650, Method

Wetting Test Pass

Tested to J-STD-005, IPC-TM-650, Method

Reliability Properties

Copper Mirror Corrosion Low

Tested to J-STD-004, IPC-TM-650, Method

Corrosion Test Low

Tested to J-STD-004, IPC-TM-650, Method

Silver Chromate Pass

Tested to J-STD-004, IPC-TM-650, Method

Chloride and Bromides None Detected

Tested to J-STD-004, IPC-TM-650, Method

Fluorides by Spot Test Pass

Tested to J-STD-004, IPC-TM-650, Method

SIR, IPC typical Pass

Tested to J-STD-004, IPC-TM-650, Method

Day 1 Day 4 Day 7

Blank x1010

EP256 x 108 x 109 x 109

EP256

Application Notes

Availability Easy 256 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine pitch applications. For specific packaging information, see Kester's Solder Paste Chart for available sizes. The appropriate combination depends on process variables and the specific application.

Printing Parameters Squeegee Blade Squeegee Speed Stencil Material Temperature/Humidity

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 57-3201-4815 Datasheet file may be downloaded here without warranties.

Datasheet ID: 57-3201-4815 644833