83-1000-0186
83-1000-0186 Datasheet
| Part | Datasheet |
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83-1000-0186 |
83-1000-0186 (pdf) |
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| 186 Mildly Activated Rosin Liquid Flux For Lead-bearing and Lead-free alloys Product Description Kester 186 Flux is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Kester 186 under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. Kester 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 186 possess high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant. Performance Characteristics • High thermal stability • Improves soldering performance • Eliminates the need and expense of cleaning • Classified as ROL0 per J-STD-004 RoHS Compliance This product meets the requirements of the RoHS Restriction of Hazardous Substances Directive, 2002/95/EC Article 4 for the stated banned substances. Physical Properties Specific Gravity ± Antoine Paar DMA 35 25°C Percent Solids typical 36 Tested to J-STD-004, IPC-TM-650, Method Acid Number typical mg KOH/g of flux Tested to J-STD-004, IPC-TM-650, Method Reliability Properties Copper Mirror Corrosion Low Tested to J-STD-004, IPC-TM-650, Method Corrosion Test Low Tested to J-STD-004, IPC-TM-650, Method Silver Chromate Pass Tested to J-STD-004, IPC-TM-650, Method Chloride and Bromides: Tested to J-STD-004, IPC-TM-650, Method Fluorides by Spot Test Pass Tested to J-STD-004, IPC-TM-650, Method SIR, IPC typical Pass Tested to J-STD-004, IPC-TM-650, Method Day 1 Day 4 Day 7 Blank x109 186 x 109 x 109 x 109 Application Notes Flux Application Kester 186 is applied to circuit boards via Flux for rework of printed wire assemblies. 186 Flux Process Considerations Kester 186 should only be applied to areas that will be fully heated by the soldering iron or other reflow tool. Care should be taken to avoid flooding the assembly. The surface tension has been adjusted to help the flux form a thin film on the board surface allowing rapid solvent evaporation. Cleaning Kester 186 flux residues are non-conductive, non-corrosive and do not require removal in most applications. Storage and Shelf Life Kester 186 is flammable. Store away from sources of ignition. Shelf life is 2 years from date of manufacture when handled properly and held at 10-25°C 50-77°F . Health & Safety This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product. World Headquarters 800 W. Thorndale Avenue, Itasca, Illinois, 60143 USA Phone +1 847-297-1600 • Website: Asia Pacific Headquarters 500 Chai Chee Lane Singapore 469024 +65 6449-1133 European Headquarters Zum Plom 5 08541 Neuensalz Germany |
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