CA052X473K5RAC3123

CA052X473K5RAC3123 Datasheet

1 All previous reference to metric case dimension "1632" has been replaced with an inch standard reference of Please reference all new designs using the "0612" nomenclature. "CA064" replaces "C1632" in the ordering code.

Part	Datasheet
CA052X473K5RAC3123	CA052X473K5RAC3123 (pdf)

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CA052X473K5RAC7536	CA052X473K5RAC7536
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CA052X104K8RAC3810	CA052X104K8RAC3810
CA052X104M5RAC3810	CA052X104M5RAC3810
CA052X153K5RAC7536	CA052X153K5RAC7536
CA052X223K5RAC7536	CA052X223K5RAC7536
CA052X683K5RAC7536	CA052X683K5RAC7536
CA052X154K8RAC3810	CA052X154K8RAC3810
CA052X104K5RAC7536	CA052X104K5RAC7536
CA052X104K5RAC3810	CA052X104K5RAC3810
CA052X683K5RAC7800	CA052X683K5RAC7800
CA052X472K5RAC7536	CA052X472K5RAC7536
CA052X224K8RAC3810	CA052X224K8RAC3810
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CA052X333K5RAC7536	CA052X333K5RAC7536
CA052X103K5RAC7536	CA052X103K5RAC7536

PDF Datasheet Preview
Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade Overview KEMET’s Ceramic Chip Capacitor Array in X7R dielectric is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. Array technology promotes reduced placement costs and increased throughput. This is achieved by alternatively placing one device rather than two or four discrete devices. Use of capacitor arrays also saves board space which translates into increased board density and more functions per board. Arrays consume only a portion of the space required for standard chips resulting in savings in inventory and pick/place machine positions. For added reliability, KEMET's Flexible Termination technology has been incorporated in order to provides superior flex performance. This technology was developed to address flex cracks, which are the primary failure mode of MLCCs and typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Flexible Termination technology inhibits the transfer of board stress to the rigid body of the MLCC, therefore mitigating flex cracks which can result in low IR or short circuit failures. KEMET’s X7R dielectric features a 125°C maximum operating temperature and is considered “temperature stable.” The Electronics Industries Alliance EIA characterizes X7R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X7R exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from −55°C to +125°C. KEMET automotive grade array capacitors meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements. Ordering Information Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality CA 06 Ceramic Case Size Number of Specification/ Capacitance Array L" x W" 1 Capacitors Series Code pF Tolerance 05 = 0508 2 = 2 X = Flexible J = ±5% 06 = 0612 4 = 4 Termination significant K = ±10% digits + M = ±20% number of zeros Rated Voltage VDC 8 = 10 4 = 16 3 = 25 5 = 50 1 = 100 2 = 200 Dielectric R = X7R Failure Rate/ Design A = N/A Termination Finish2 Packaging/ Grade C-Spec C = 100% Matte Sn L = SnPb 5% minimum Pb content See "Packaging C-Spec Ordering Options Table" below 1 All previous reference to metric case dimension "1632" has been replaced with an inch standard reference of Please reference all new designs using the "0612" nomenclature. "CA064" replaces "C1632" in the ordering code. 2 Additional termination finish options may be available. Contact KEMET for details. 2 SnPb termination finish option is not available on automotive grade product. One world. One KEMET KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1017_X7R_ARRAY_SMD • 1/9/2017 1 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade Packaging C-Spec Ordering Options Table Packaging Type Packaging/Grade Ordering Code C-Spec Commercial Grade1 Bulk Bag 7" Reel/Unmarked 13" Reel Embossed Plastic Tape /Unmarked Automotive Grade2 7" Reel 13" Reel/Embossed Plastic/Unmarked Not Required Blank TU 7210 AUTO AUTO7210 1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging. 1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". 2 Reeling tape options Paper or Plastic are dependent on capacitor case size L" x W" and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information". 2 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". 2 All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". • −55°C to +125°C operating temperature range • Superior flex performance up to 5 mm • Saves both circuit board and inventory space • Reduces placement costs and increases throughput • Lead Pb -free, RoHS and REACH compliant • EIA 0508 2-element and 0612 4-element case sizes • DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 200 V • Capacitance offerings ranging from 330 pF µF • Available capacitance tolerances of ±5%, ±10%, and ±20% • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated termination finish allowing for excellent solderability • SnPb termination finish option available upon request 5% Pb minimum • Commercial and Automotive grades available Typical applications include those that can benefit from board area savings, cost savings and overall volumetric reduction such as telecommunications, computers, handheld devices and automotive. Flexible termination technology benefits applications subject to high levels of board flexure or temperature cycling. KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1017_X7R_ARRAY_SMD • 1/9/2017 2 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade Automotive C-Spec Information KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification PCN and Production Part Approval Process warrant PPAP . Product Change Notification PCN The KEMET Product Change Notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence KEMET Automotive C-Spec KEMET assigned1 AUTO Customer Notification due to: Process/Product change Yes with approval and sign off Yes without approval Obsolescence* Yes Days prior to implementation 180 days Minimum 90 days Minimum Production Part Approval Process PPAP The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design record and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part KEMET Automotive C-Spec KEMET assigned1 AUTO PPAP Product Part Approval Process Level ● Part Number specific PPAP available Product family PPAP only KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1017_X7R_ARRAY_SMD • 1/9/2017 3 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade Dimensions Millimeters Inches 0612 4-CAP Top View Profile View P Ref 0508 2-CAP Top View Profile View EIA Size Metric Size Code Code Length W Width Bandwidth Bandlength Thickness P Pitch P Reference 0508 0612 1220 1632 See Table 2 for Thickness Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. 1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products. 2 A packaging C-Spec see note 1 above is not required for "Bulk Bag" packaging excluding Anti-Static Bulk Bag and Automotive Grade products . The 15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1017_X7R_ARRAY_SMD • 1/9/2017 7 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade Table 3 Chip Capacitor Array Land Pattern Design Recommendations per EIA SIZE CODE METRIC SIZE CODE Density Level A Maximum Most Land Protrusion mm C Y X P V1 V2 Density Level B Median Nominal Land Protrusion mm C Y X P V1 V2 Density Level C Minimum Least Land Protrusion mm C Y X P V1 V2 0508/CA052 1220 0612/CA064 1632 Density Level A For low-density product applications. Provides a wider process window for reflow solder processes. Density Level B For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 Image below based on Density Level B for an EIA 0612 case size. Grid Placement Courtyard KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1017_X7R_ARRAY_SMD • 1/9/2017 8 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade Soldering Process Recommended Soldering Technique • Solder reflow only Recommended Reflow Soldering Profile KEMET’s families of surface mount multilayer ceramic capacitors SMD MLCCs are compatible with wave single or dual , convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Profile Feature Termination Finish SnPb 100% Matte Sn Preheat/Soak Temperature Minimum TSmin Temperature Maximum TSmax Time tS from TSmin to TSmax Ramp-Up Rate TL to TP 100°C 150°C 60 120 seconds 3°C/second maximum 150°C 200°C 60 120 seconds 3°C/second maximum Liquidous Temperature TL 183°C These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices but must be requested using the correct ordering code identifier s . If this option is requested, two sides of the ceramic body will be laser marked with a “K” to identify KEMET, followed by two characters per - see table below to identify the capacitance value. EIA 0603 case size devices are limited to the “K” character only. Laser marking option is not available on • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive Grade stacked devices. • X7R dielectric products in capacitance values outlined below Marking appears in legible contrast. Illustrated below is an example of an MLCC with laser marking of “KA8”, which designates a KEMET device with rated capacitance of 100 µF. Orientation of marking is vendor optional. KEMET ID 2-Digit Capacitance Code EIA Case Size 0603 0805 1206 1210 1808 1812 1825 2220 2225 Metric Size Code 1608 2012 3216 3225 4520 4532 4564 5650 5664 Capacitance 170 pF 150 pF 910 pF 2,000 pF 3,900 pF 6,700 pF µF µF µF KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1017_X7R_ARRAY_SMD • 1/9/2017 12 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade Capacitor Marking Optional cont’d Alpha Character A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y Capacitance pF For Various Alpha/Numeral Identifiers Numeral Capacitance pF 1,000 10,000 100,000 1,000,000 10,000,000 1,100 11,000 110,000 1,100,000 11,000,000 1,200 12,000 120,000 1,200,000 12,000,000 1,300 13,000 130,000 1,300,000 13,000,000 1,500 15,000 150,000 1,500,000 15,000,000 1,600 16,000 160,000 1,600,000 16,000,000 1,800 18,000 180,000 1,800,000 18,000,000 200 2,000 20,000 200,000 2,000,000 20,000,000 220 2,200 22,000 220,000 2,200,000 22,000,000 240 2,400 24,000 240,000 2,400,000 24,000,000 270 2,700 27,000 270,000 2,700,000 27,000,000 300 3,000 30,000 300,000 3,000,000 30,000,000 330 3,300 33,000 330,000 3,300,000 33,000,000 360 3,600 36,000 360,000 3,600,000 36,000,000 3,900 39,000 390,000 3,900,000 39,000,000 430 4,300 43,000 430,000 4,300,000 43,000,000 4,700 47,000 470,000 4,700,000 47,000,000 5,100 51,000 510,000 5,100,000 51,000,000 Packaging Ordering Code C-Spec Packaging Type/Options C-3190 C-3191 C-7081 C-7082 Automotive grade 7" reel unmarked Automotive grade 13" reel unmarked Commercial grade 7" reel unmarked Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefits of Changing from 4 mm to 2 mm Pitching Spacing • Lower placement costs • Double the parts on each reel results in fewer reel changes and increased efficiency • Fewer reels result in lower packaging, shipping and storage costs, reducing waste KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1017_X7R_ARRAY_SMD • 1/9/2017 14 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade Figure 1 Embossed Plastic Carrier Tape Dimensions ØDo Po [10 pitches cumulative tolerance on tape ± mm] Ko B1 Ao Bo Center Lines of Cavity Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. User Direction of Unreeling ØD 1 Embossment For cavity size, see Note 1 Table 4 Table 6 Embossed Plastic Carrier Tape Dimensions Metric will govern Tape Size 8 mm 12 mm 16 mm Constant Dimensions Millimeters Inches D1 Minimum Note 1 R Reference S1 Minimum Note 2 Note 3 Maximum T1 Maximum Tape Size 8 mm 12 mm 16 mm Pitch Single 4 mm Single 4 mm & Double 8 mm Triple 12 mm Variable Dimensions Millimeters Inches B1 Maximum Note 4 E2 Minimum T2 Maximum W Maximum

PDF Datasheet Preview

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs

Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade

Overview

KEMET’s Ceramic Chip Capacitor Array in X7R dielectric is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. Array technology promotes reduced placement costs and increased throughput. This is achieved by alternatively placing one device rather than two or four discrete devices. Use of capacitor arrays also saves board space which translates into increased board density and more functions per board. Arrays consume only a portion of the space required for standard chips resulting in savings in inventory and pick/place machine positions.

For added reliability, KEMET's Flexible Termination technology has been incorporated in order to provides superior flex performance. This technology was developed to address flex cracks, which are the primary failure mode of MLCCs and typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Flexible Termination technology inhibits the transfer of board stress to the rigid body of the MLCC, therefore mitigating flex cracks which can result in low IR or short circuit failures.

KEMET’s X7R dielectric features a 125°C maximum operating temperature and is considered “temperature stable.” The Electronics Industries Alliance EIA characterizes X7R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X7R exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from −55°C to +125°C.

KEMET automotive grade array capacitors meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements.
Ordering Information

Click image above for interactive 3D content

Open PDF in Adobe Reader for full functionality

CA 06

Ceramic Case Size Number of Specification/ Capacitance Array L" x W" 1 Capacitors Series Code pF Tolerance
05 = 0508 2 = 2 X = Flexible

J = ±5%
06 = 0612 4 = 4 Termination significant K = ±10%
digits +

M = ±20%
number of
zeros

Rated Voltage VDC
8 = 10 4 = 16 3 = 25 5 = 50 1 = 100 2 = 200

Dielectric R = X7R

Failure Rate/ Design

A = N/A

Termination Finish2

Packaging/ Grade C-Spec

C = 100% Matte Sn L = SnPb 5% minimum Pb content

See "Packaging
C-Spec Ordering Options Table"
below
1 All previous reference to metric case dimension "1632" has been replaced with an inch standard reference of Please reference all new designs using the "0612" nomenclature. "CA064" replaces "C1632" in the ordering code.
2 Additional termination finish options may be available. Contact KEMET for details. 2 SnPb termination finish option is not available on automotive grade product.

One world. One KEMET

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300
•

C1017_X7R_ARRAY_SMD
• 1/9/2017 1

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade
Packaging C-Spec Ordering Options Table

Packaging Type
Packaging/Grade Ordering Code C-Spec

Commercial Grade1

Bulk Bag 7" Reel/Unmarked 13" Reel Embossed Plastic Tape /Unmarked

Automotive Grade2
7" Reel 13" Reel/Embossed Plastic/Unmarked

Not Required Blank TU 7210

AUTO AUTO7210
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging. 1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". 2 Reeling tape options Paper or Plastic are dependent on capacitor case size L" x W" and thickness dimension. See "Chip Thickness/Tape & Reel

Packaging Quantities" and "Tape & Reel Packaging Information". 2 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". 2 All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For
more information see "Capacitor Marking".
• −55°C to +125°C operating temperature range
• Superior flex performance up to 5 mm
• Saves both circuit board and inventory space
• Reduces placement costs and increases throughput
• Lead Pb -free, RoHS and REACH compliant
• EIA 0508 2-element and 0612 4-element case sizes
• DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V,
and 200 V
• Capacitance offerings ranging from 330 pF µF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb termination finish option available upon request
5% Pb minimum
• Commercial and Automotive grades available

Typical applications include those that can benefit from board area savings, cost savings and overall volumetric reduction such as telecommunications, computers, handheld devices and automotive. Flexible termination technology benefits applications subject to high levels of board flexure or temperature cycling.

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300
•

C1017_X7R_ARRAY_SMD
• 1/9/2017 2

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade

Automotive C-Spec Information

KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification PCN and Production Part Approval Process warrant PPAP .
Product Change Notification PCN The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence

KEMET Automotive C-Spec

KEMET assigned1 AUTO

Customer Notification due to:

Process/Product change Yes with approval and sign off

Yes without approval

Obsolescence* Yes

Days prior to implementation
180 days Minimum 90 days Minimum

Production Part Approval Process PPAP The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part

KEMET Automotive C-Spec

KEMET assigned1 AUTO

PPAP Product Part Approval Process Level
● Part Number specific PPAP available Product family PPAP only

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300
•

C1017_X7R_ARRAY_SMD
• 1/9/2017 3

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade

Dimensions Millimeters Inches
0612 4-CAP

Top View

Profile View

P Ref
0508 2-CAP

Top View

Profile View

EIA Size Metric Size

Code

Code

Length

W Width

Bandwidth Bandlength Thickness

P Pitch

P Reference
0508 0612
1220 1632

See Table 2 for Thickness

Qualification/Certification

Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability.
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products.
2 A packaging C-Spec see note 1 above is not required for "Bulk Bag" packaging excluding Anti-Static Bulk Bag and Automotive Grade products . The 15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging.

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300
•

C1017_X7R_ARRAY_SMD
• 1/9/2017 7

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade

Table 3 Chip Capacitor Array Land Pattern Design Recommendations per

EIA SIZE CODE

METRIC SIZE CODE

Density Level A Maximum Most Land

Protrusion mm

C Y X P V1 V2

Density Level B Median Nominal Land

Protrusion mm

C Y X P V1 V2

Density Level C Minimum Least Land

Protrusion mm

C Y X P V1 V2
0508/CA052 1220
0612/CA064 1632

Density Level A For low-density product applications. Provides a wider process window for reflow solder processes. Density Level B For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351

Image below based on Density Level B for an EIA 0612 case size.

Grid Placement Courtyard

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300
•

C1017_X7R_ARRAY_SMD
• 1/9/2017 8

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade

Soldering Process

Recommended Soldering Technique
• Solder reflow only

Recommended Reflow Soldering Profile KEMET’s families of surface mount multilayer ceramic capacitors SMD MLCCs are compatible with wave single or dual , convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.

Profile Feature

Termination Finish

SnPb
100% Matte Sn

Preheat/Soak Temperature Minimum TSmin Temperature Maximum TSmax Time tS from TSmin to TSmax

Ramp-Up Rate TL to TP
100°C
150°C
60 120 seconds 3°C/second maximum
150°C
200°C
60 120 seconds 3°C/second maximum

Liquidous Temperature TL
183°C
These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices but must be requested using the correct ordering code identifier s . If this option is requested, two sides of the ceramic body will be laser marked with a “K” to identify KEMET, followed by two characters per - see table below to identify the capacitance value. EIA 0603 case size devices are limited to the “K” character only.

Laser marking option is not available on
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination
option.
• KPS Commercial and Automotive Grade stacked devices.
• X7R dielectric products in capacitance values outlined below

Marking appears in legible contrast. Illustrated below is an example of an MLCC with laser marking of “KA8”, which designates a KEMET device with rated capacitance of 100 µF. Orientation of marking is vendor optional.

KEMET ID
2-Digit Capacitance

Code

EIA Case Size
0603 0805 1206 1210 1808 1812 1825 2220 2225

Metric Size Code
1608 2012 3216 3225 4520 4532 4564 5650 5664

Capacitance
170 pF 150 pF 910 pF 2,000 pF 3,900 pF 6,700 pF µF µF µF

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300
•

C1017_X7R_ARRAY_SMD
• 1/9/2017 12

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade

Capacitor Marking Optional cont’d

Alpha Character

A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y

Capacitance pF For Various Alpha/Numeral Identifiers

Numeral

Capacitance pF
1,000 10,000 100,000 1,000,000 10,000,000
1,100 11,000 110,000 1,100,000 11,000,000
1,200 12,000 120,000 1,200,000 12,000,000
1,300 13,000 130,000 1,300,000 13,000,000
1,500 15,000 150,000 1,500,000 15,000,000
1,600 16,000 160,000 1,600,000 16,000,000
1,800 18,000 180,000 1,800,000 18,000,000
200 2,000 20,000 200,000 2,000,000 20,000,000
220 2,200 22,000 220,000 2,200,000 22,000,000
240 2,400 24,000 240,000 2,400,000 24,000,000
270 2,700 27,000 270,000 2,700,000 27,000,000
300 3,000 30,000 300,000 3,000,000 30,000,000
330 3,300 33,000 330,000 3,300,000 33,000,000
360 3,600 36,000 360,000 3,600,000 36,000,000
3,900 39,000 390,000 3,900,000 39,000,000
430 4,300 43,000 430,000 4,300,000 43,000,000
4,700 47,000 470,000 4,700,000 47,000,000
5,100 51,000 510,000 5,100,000 51,000,000
Packaging Ordering Code

C-Spec

Packaging Type/Options

C-3190 C-3191 C-7081 C-7082

Automotive grade 7" reel unmarked Automotive grade 13" reel unmarked Commercial grade 7" reel unmarked Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development.

Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased efficiency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300
•

C1017_X7R_ARRAY_SMD
• 1/9/2017 14

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs Capacitor Array, X7R Dielectric, 10 200 VDC Commercial & Automotive Grade

Figure 1 Embossed Plastic Carrier Tape Dimensions
ØDo

Po [10 pitches cumulative
tolerance on tape ± mm]

Ko B1

Ao Bo

Center Lines of Cavity

Cover Tape

B 1 is for tape feeder reference only, including draft concentric about B o.

User Direction of Unreeling
ØD 1

Embossment For cavity size, see Note 1 Table 4

Table 6 Embossed Plastic Carrier Tape Dimensions

Metric will govern

Tape Size 8 mm 12 mm 16 mm

Constant Dimensions Millimeters Inches

D1 Minimum Note 1

R Reference S1 Minimum

Note 2

Note 3 Maximum

T1 Maximum

Tape Size 8 mm 12 mm 16 mm

Pitch

Single 4 mm Single 4 mm & Double 8 mm Triple 12 mm

Variable Dimensions Millimeters Inches

B1 Maximum Note 4

E2 Minimum

T2 Maximum

W Maximum

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived CA052X473K5RAC3123 Datasheet file may be downloaded here without warranties.

Datasheet ID: CA052X473K5RAC3123 644824