CKC33C224KCGACAUTO

CKC33C224KCGACAUTO Datasheet


CKC

Part Datasheet
CKC33C224KCGACAUTO CKC33C224KCGACAUTO CKC33C224KCGACAUTO (pdf)
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Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs

KC-Link for Fast Switching Semiconductor Applications DC-Link, Snubber, Resonator Capacitor Commercial & Automotive Grade

Overview

KEMET's KC-Link surface mount capacitors are designed to meet the growing demand for fast switching semiconductors that operate at higher voltages, temperatures, and frequencies. By utilizing KEMET's robust and proprietary C0G/NPO base metal electrode BME dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern. With extremely low effective series resistance ESR and very low thermal resistance, KC-Link capacitors can operate at very high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. With an operating temperature of 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications which require minimal cooling. KC-Link C0G dielectric
technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of lead frames. This provides extremely low effective series inductance ESL increasing the operating frequency range allowing for further miniaturization.

In addition to commercial grade, automotive grade devices are available and meet the demanding Automotive Electronics Council’s qualification requirements.
• Very high ripple current capability
• Extremely low Effective Series Resistance ESR
• Extremely low Effective Series Inductance ESL
• Operating temperature range of −55°C to +150°C
• High frequency operation >10 MHz
• No capacitance shift with voltage
• No piezoelectric noise
• High thermal stability
• RoHS Pb-free

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• Wide bandgap WBG , silicon carbide SiC and gallium nitride GaN systems
• Hybrid electrical vehicles drive systems, charging
• Photovoltaic systems
• Power conversion
• Inverters
• DC link
• LLC resonators
• Snubber

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300


One world. One KEMET C1039_KC-Link_C0G
• 1/4/2018 1

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs High Voltage C0G Dielectric, 500 3,000 VDC Commercial & Automotive Grade

Typical Performance - 3640, 220 nF, 500 V

Capacitance change %

Capacitance Change vs Temperature
−5
−10 −55 −35 −15 5
25 45 65 85 105 125 145 Temperature °C

Capacitance change %

Capacitance Change vs DC Voltage
−5
−10 0

DC Voltage V
|Z|/ESR Ohms

Impedance
|Z| Ohm s
1,000
10,000

Frequency kHz
100,000
|Z|/ESR Ohms

ESR Ohms
1,000
10,000

Frequency kHz
100,000

Frequency

Typical ESR Typical ESL
at 25°C
Ordering Information

Series

CKC = KC-LINK

Case Size L"x W" 33 = 3640

Specification/ Series

C = Standard

Capacitance

Code pF

Two single digits and number of
zeros. Use 9 for pF e.g. pF =

Capacitance Tolerance

Rated Voltage V

Dielectric

Subclass Designation

Termination Finish

F = ±1% G = ±2% J = ±5% K = ±10%

C = 500 V G = C0G A = N/A C = 100% matte Sn

Packaging

Suffix/C-Spec

See "Packaging
C-Spec Ordering Options Table"
below

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300


C1039_KC-Link_C0G
• 1/4/2018 3

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs High Voltage C0G Dielectric, 500 3,000 VDC Commercial & Automotive Grade
Packaging C-Spec Ordering Options Table

Packaging Type
Packaging/Grade Ordering Code C-Spec

Commercial Grade
7" Reel/Unmarked 13" Reel Embossed Plastic Tape /

Unmarked Automotive Grade1
7" Reel 13" Reel Embossed Plastic Tape /

Unmarked

TU 7210

AUTO AUTO7210
1 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".

Dimensions Millimeters Inches

EIA Size Code
3640

Metric Size Code
9210

L Length

W Width

T Thickness

B Bandwidth

S Separation Minimum

Mounting Technique

Solder Reflow Only

Environmental Compliance

Lead Pb -free, RoHS, and REACH compliant without exemptions.

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300


C1039_KC-Link_C0G
• 1/4/2018 4

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs High Voltage C0G Dielectric, 500 3,000 VDC Commercial & Automotive Grade
Table 1 Product Ordering Codes & Ratings

Capacitance
220 nF

Capacitance Code

Case Size

Voltage Code

Rated Voltage VDC

Capacitance Tolerance

FGJK
3640

Table 2 Performance & Reliability Test Methods and Conditions

Stress

Terminal Strength Board Flex

Reference

JIS-C-6429 JIS-C-6429

Solderability

J-STD-002

Temperature Cycling

JESD22 Method JA-104

Biased Humidity

MIL-STD-202 Method 103

Moisture Resistance Thermal Shock

High Temperature Life Storage Life Vibration

Mechanical Shock Resistance to Solvents

MIL-STD-202 Method 106

MIL-STD-202 Method 107 MIL-STD-202 Method 108/EIA-198 MIL-STD-202 Method 108

MIL-STD-202 Method 204

MIL-STD-202 Method 213 MIL-STD-202 Method 215

Test or Inspection Method

Appendix 1, Note Force of 1.8kg for 60 seconds.

Appendix 2, Note mm minimum .

Magnification 50X. Conditions:
a Method B, 4 hours at 155°C, dry heat at 235°C
b Method B at 215°C category 3
c Method D, category 3 at 260°C
1,000 Cycles −55°C to +125°C , Measurement at 24 hours ±4 hours after test conclusion.

Load Humidity 1,000 hours 85°C/85% RH and 200 VDC maximum. Add 100K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. Low Volt Humidity 1,000 hours 85C°/85%RH and 1.5V. Add 100K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours ±4 hours after test conclusion. −55°C/+150°C. Note Number of cycles required - 300, Maximum transfer time - 20 seconds, Dwell time - 15 minutes. Air - Air.
1,000 hours at 150°C with X rated voltage applied.
150°C, 0 VDC, for 1,000 Hours. 5 g's for 20 minutes, 12 cycles each of 3 orientations. Note Use 8" X 5" PCB thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 2,000 Hz Figure 1 of Method 213, Condition F.

Add Aqueous wash chemical, OKEM Clean or equivalent.

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300

Product Change Notification PCN The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence

KEMET Automotive C-Spec

Customer Notification due to:

Process/Product change

Obsolescence*

Days prior to implementation

KEMET assigned1

Yes with approval and sign off
180 days minimum

AUTO

Yes without approval
90 days minimum

Production Part Approval Process PPAP The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.

KEMET Automotive C-Spec

PPAP Product Part Approval Process Level

KEMET assigned1

AUTO
● Part number specific PPAP available Product family PPAP only

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300


C1039_KC-Link_C0G
• 1/4/2018 6

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs High Voltage C0G Dielectric, 500 3,000 VDC Commercial & Automotive Grade

Table 3 Chip Capacitor Land Pattern Design Recommendations per

EIA Size Code
3640

Metric Size Code
9210

Density Level A Maximum Most Land Protrusion mm

X V1 V2

Density Level B Median Nominal Land Protrusion mm

X V1 V2

Density Level C Minimum Least Land Protrusion mm

X V1 V2

Density Level A For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351

Image below based on Density Level B for an EIA 1210 case size.

Grid Placement Courtyard

KEMET Electronics Corporation
• P.O. Box 5928
• Greenville, SC 29606
• 864-963-6300


C1039_KC-Link_C0G
• 1/4/2018 7

Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs High Voltage C0G Dielectric, 500 3,000 VDC Commercial & Automotive Grade

Soldering Process
More datasheets: R101-H-R | R101-TQW | R101-B | R101-MLJ | R101-M | R101-HSC | R101-BTL | R101-SHG | 760600020 | SIL05-1A85-76D3K


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Datasheet ID: CKC33C224KCGACAUTO 644734