CKC
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CKC33C224KCGACAUTO (pdf) |
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Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs KC-Link for Fast Switching Semiconductor Applications DC-Link, Snubber, Resonator Capacitor Commercial & Automotive Grade Overview KEMET's KC-Link surface mount capacitors are designed to meet the growing demand for fast switching semiconductors that operate at higher voltages, temperatures, and frequencies. By utilizing KEMET's robust and proprietary C0G/NPO base metal electrode BME dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern. With extremely low effective series resistance ESR and very low thermal resistance, KC-Link capacitors can operate at very high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. With an operating temperature of 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications which require minimal cooling. KC-Link C0G dielectric technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of lead frames. This provides extremely low effective series inductance ESL increasing the operating frequency range allowing for further miniaturization. In addition to commercial grade, automotive grade devices are available and meet the demanding Automotive Electronics Council’s qualification requirements. • Very high ripple current capability • Extremely low Effective Series Resistance ESR • Extremely low Effective Series Inductance ESL • Operating temperature range of −55°C to +150°C • High frequency operation >10 MHz • No capacitance shift with voltage • No piezoelectric noise • High thermal stability • RoHS Pb-free Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality • Wide bandgap WBG , silicon carbide SiC and gallium nitride GaN systems • Hybrid electrical vehicles drive systems, charging • Photovoltaic systems • Power conversion • Inverters • DC link • LLC resonators • Snubber KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • One world. One KEMET C1039_KC-Link_C0G • 1/4/2018 1 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs High Voltage C0G Dielectric, 500 3,000 VDC Commercial & Automotive Grade Typical Performance - 3640, 220 nF, 500 V Capacitance change % Capacitance Change vs Temperature −5 −10 −55 −35 −15 5 25 45 65 85 105 125 145 Temperature °C Capacitance change % Capacitance Change vs DC Voltage −5 −10 0 DC Voltage V |Z|/ESR Ohms Impedance |Z| Ohm s 1,000 10,000 Frequency kHz 100,000 |Z|/ESR Ohms ESR Ohms 1,000 10,000 Frequency kHz 100,000 Frequency Typical ESR Typical ESL at 25°C Ordering Information Series CKC = KC-LINK Case Size L"x W" 33 = 3640 Specification/ Series C = Standard Capacitance Code pF Two single digits and number of zeros. Use 9 for pF e.g. pF = Capacitance Tolerance Rated Voltage V Dielectric Subclass Designation Termination Finish F = ±1% G = ±2% J = ±5% K = ±10% C = 500 V G = C0G A = N/A C = 100% matte Sn Packaging Suffix/C-Spec See "Packaging C-Spec Ordering Options Table" below KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1039_KC-Link_C0G • 1/4/2018 3 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs High Voltage C0G Dielectric, 500 3,000 VDC Commercial & Automotive Grade Packaging C-Spec Ordering Options Table Packaging Type Packaging/Grade Ordering Code C-Spec Commercial Grade 7" Reel/Unmarked 13" Reel Embossed Plastic Tape / Unmarked Automotive Grade1 7" Reel 13" Reel Embossed Plastic Tape / Unmarked TU 7210 AUTO AUTO7210 1 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". Dimensions Millimeters Inches EIA Size Code 3640 Metric Size Code 9210 L Length W Width T Thickness B Bandwidth S Separation Minimum Mounting Technique Solder Reflow Only Environmental Compliance Lead Pb -free, RoHS, and REACH compliant without exemptions. KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1039_KC-Link_C0G • 1/4/2018 4 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs High Voltage C0G Dielectric, 500 3,000 VDC Commercial & Automotive Grade Table 1 Product Ordering Codes & Ratings Capacitance 220 nF Capacitance Code Case Size Voltage Code Rated Voltage VDC Capacitance Tolerance FGJK 3640 Table 2 Performance & Reliability Test Methods and Conditions Stress Terminal Strength Board Flex Reference JIS-C-6429 JIS-C-6429 Solderability J-STD-002 Temperature Cycling JESD22 Method JA-104 Biased Humidity MIL-STD-202 Method 103 Moisture Resistance Thermal Shock High Temperature Life Storage Life Vibration Mechanical Shock Resistance to Solvents MIL-STD-202 Method 106 MIL-STD-202 Method 107 MIL-STD-202 Method 108/EIA-198 MIL-STD-202 Method 108 MIL-STD-202 Method 204 MIL-STD-202 Method 213 MIL-STD-202 Method 215 Test or Inspection Method Appendix 1, Note Force of 1.8kg for 60 seconds. Appendix 2, Note mm minimum . Magnification 50X. Conditions: a Method B, 4 hours at 155°C, dry heat at 235°C b Method B at 215°C category 3 c Method D, category 3 at 260°C 1,000 Cycles −55°C to +125°C , Measurement at 24 hours ±4 hours after test conclusion. Load Humidity 1,000 hours 85°C/85% RH and 200 VDC maximum. Add 100K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. Low Volt Humidity 1,000 hours 85C°/85%RH and 1.5V. Add 100K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours ±4 hours after test conclusion. −55°C/+150°C. Note Number of cycles required - 300, Maximum transfer time - 20 seconds, Dwell time - 15 minutes. Air - Air. 1,000 hours at 150°C with X rated voltage applied. 150°C, 0 VDC, for 1,000 Hours. 5 g's for 20 minutes, 12 cycles each of 3 orientations. Note Use 8" X 5" PCB thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 2,000 Hz Figure 1 of Method 213, Condition F. Add Aqueous wash chemical, OKEM Clean or equivalent. KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • Product Change Notification PCN The KEMET Product Change Notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence KEMET Automotive C-Spec Customer Notification due to: Process/Product change Obsolescence* Days prior to implementation KEMET assigned1 Yes with approval and sign off 180 days minimum AUTO Yes without approval 90 days minimum Production Part Approval Process PPAP The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design record and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. KEMET Automotive C-Spec PPAP Product Part Approval Process Level KEMET assigned1 AUTO ● Part number specific PPAP available Product family PPAP only KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1039_KC-Link_C0G • 1/4/2018 6 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs High Voltage C0G Dielectric, 500 3,000 VDC Commercial & Automotive Grade Table 3 Chip Capacitor Land Pattern Design Recommendations per EIA Size Code 3640 Metric Size Code 9210 Density Level A Maximum Most Land Protrusion mm X V1 V2 Density Level B Median Nominal Land Protrusion mm X V1 V2 Density Level C Minimum Least Land Protrusion mm X V1 V2 Density Level A For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 Image below based on Density Level B for an EIA 1210 case size. Grid Placement Courtyard KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • C1039_KC-Link_C0G • 1/4/2018 7 Surface Mount Multilayer Ceramic Chip Capacitors SMD MLCCs High Voltage C0G Dielectric, 500 3,000 VDC Commercial & Automotive Grade Soldering Process |
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