C0603C225K9PALTU

C0603C225K9PALTU Datasheet

Part	Datasheet
C0603C225K9PALTU	C0603C225K9PALTU (pdf)

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CERAMIC CHIP/CAPACITORS Tin Lead L Termination KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the electronics industry marches to RoHS compliance it is important that KEMET provide the Tin/Lead terminated products for our valued high reliability and military customers. KEMET Tin/Lead MLCC surface mount capacitors are available in standard EIA case sizes from 0402 to 2225 and standard CAPACITOR OUTLINE DRAWINGS Sn/Pb PLATE ELECTRODES NICKEL PLATE CONDUCTIVE METALLIZATION Ceramic Surface Mount AND INCHES EIA SIZE CODE 0402* 0603* 0805* 1206* 1210* 1812 METRIC SIZE CODE Ref only 1005 1608 2012 3216 3225 4532 L# LENGTH ± ± ± ± ± ± W# WIDTH ± ± ± ± ± ± See page 78 for thickness dimensions. B BANDWIDTH 1825* 2220 2225 4564 5650 5664 ± ± ± ± ± ± * Note Indicates EIA Preferred Case Sizes Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page † For extended value 1210 case size solder reflow only. S MIN. SEPARATION N/A N/A N/A N/A N/A N/A MOUNTING TECHNIQUE Solder Reflow Solder Wave † or Solder Reflow Solder Reflow CAPACITOR ORDERING INFORMATION Standard Chips - For C 0805 C 103 K 5 R A L* Military see page 87 CERAMIC SIZE CODE SPECIFICATION C - Standard CAPACITANCE CODE Expressed in Picofarads pF First two digits represent significant figures. Third digit specifies number of zeros. Use 9 for through 9.9pF. Use 8 for through 0.99pF Example 2.2pF = 229 or pF = 508 CAPACITANCE TOLERANCE B ±0.10pF J ±5% C ±0.25pF K ±10% D ±0.5pF M ±20% F ±1% G ±2% * Part Number Example C0805C103K5RAL END METALLIZATION L - SnPb plated nickel barrier SnPb 5% minimum FAILURE RATE LEVEL A- Not Applicable TEMPERATURE CHARACTERISTIC Designated by Capacitance Change Over Temperature Range G C0G NP0 ±30 PPM/°C R X7R ±15% -55°C + 125°C P X5R ±15% -55°C + 85°C VOLTAGE 1 - 100V 3 - 25V 2 - 200V 4 - 16V 5 - 50V 8 - 10V 14 digits - no spaces 9 - 6.3V Refer to pages 73-76 for NP0/C0G, X7R and X5R dielectric capacitance ranges available. KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, 864 963-6300 CERAMIC CHIP CAPACITORS Thickness Code Reference Chart Packaging Quantity Based on Finished Chip Thickness Specifications Thickness Code Chip Size Chip Thickness Range mm Qty per Reel 7" Plastic Qty per Reel 13" Plastic 0201 0402 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805

PDF Datasheet Preview

CERAMIC CHIP/CAPACITORS

Tin Lead L Termination

KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the electronics industry marches to RoHS compliance it is important that KEMET provide the Tin/Lead terminated products for our valued high reliability and military customers. KEMET Tin/Lead MLCC surface mount capacitors are available in standard EIA case sizes from 0402 to 2225 and standard

CAPACITOR OUTLINE DRAWINGS

Sn/Pb PLATE

ELECTRODES

NICKEL PLATE CONDUCTIVE METALLIZATION

Ceramic Surface Mount

AND INCHES

EIA SIZE CODE
0402* 0603* 0805* 1206* 1210* 1812

METRIC SIZE CODE Ref only
1005
1608
2012
3216
3225
4532

L# LENGTH
± ± ± ± ± ±

W# WIDTH
± ± ± ± ± ±

See page 78 for thickness
dimensions.

B BANDWIDTH
1825* 2220 2225
4564 5650 5664
± ± ±
± ± ±
* Note Indicates EIA Preferred Case Sizes Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page † For extended value 1210 case size solder reflow only.

S MIN. SEPARATION

N/A N/A N/A N/A N/A N/A

MOUNTING TECHNIQUE

Solder Reflow

Solder Wave † or

Solder Reflow

Solder Reflow
CAPACITOR ORDERING INFORMATION Standard Chips - For

C 0805 C 103 K 5 R A L*

Military see page 87

CERAMIC SIZE CODE SPECIFICATION C - Standard CAPACITANCE CODE Expressed in Picofarads pF First two digits represent significant figures. Third digit specifies number of zeros. Use 9 for through 9.9pF. Use 8 for through 0.99pF Example 2.2pF = 229 or pF = 508 CAPACITANCE TOLERANCE B ±0.10pF J ±5% C ±0.25pF K ±10% D ±0.5pF M ±20% F ±1% G ±2%
* Part Number Example C0805C103K5RAL

END METALLIZATION L - SnPb plated nickel barrier

SnPb 5% minimum FAILURE RATE LEVEL

A- Not Applicable

TEMPERATURE CHARACTERISTIC Designated by Capacitance

Change Over Temperature Range

G C0G NP0 ±30 PPM/°C

R X7R ±15% -55°C + 125°C

P X5R ±15% -55°C + 85°C

VOLTAGE
1 - 100V 3 - 25V
2 - 200V 4 - 16V
5 - 50V
8 - 10V
14 digits - no spaces
9 - 6.3V

Refer to pages 73-76 for NP0/C0G, X7R and X5R dielectric capacitance ranges available.

KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, 864 963-6300

CERAMIC CHIP CAPACITORS

Thickness Code Reference Chart Packaging Quantity Based on Finished Chip Thickness Specifications

Thickness Code

Chip Size

Chip Thickness Range mm

Qty per Reel 7" Plastic

Qty per Reel 13" Plastic
0201
0402
0603
0603
0603
0805
0805
0805
0805
0805
0805
0805

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Datasheet ID: C0603C225K9PALTU 644729