IS93C66A-2GRLI

IS93C66A-2GRLI Datasheet


IS93C56A IS93C66A

Part Datasheet
IS93C66A-2GRLI IS93C66A-2GRLI IS93C66A-2GRLI (pdf)
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IS93C56A IS93C66A
2K-BIT/4K-BIT SERIAL ELECTRICALLY ERASABLE PROM

AUGUST 2007
• Industry-standard Microwire Interface Non-volatile data storage Wide voltage operation Vcc = 1.8V to 5.5V Auto increment for efficient data dump
• User Configured Memory Organization By 16-bit or by 8-bit
• Hardware and software write protection Defaults to write-disabled state at power-up Software instructions for write-enable/disable
• Enhanced low voltage CMOS E2PROM technology
• Versatile, easy-to-use Interface Self-timed programming cycle Automatic erase-before-write Programming status indicator Word and chip erasable Chip select enables power savings
• Durable and reliable 40-year data retention after 1M write cycles 1 million write cycles Unlimited read cycles Schmitt-trigger inputs
• Industrial and Automotive Temperature Grade
• Lead-free available

The IS93C56A/66A are 2kb/4kb non-volatile, ISSI serial EEPROMs. They are fabricated using an enhanced CMOS design and process. The IS93C56A/66A contain power-efficient read/write memory, and organization of either 256/512 bytes of 8 bits or 128/256 words of 16 bits. When the ORG pin is connected to Vcc or left unconnected, x16 is selected when it is connected to ground, x8 is selected. The IS93C56A/66A are fully backward compatible with IS93C56/66.

An instruction set defines the operation of the devices, including read, write, and mode-enable functions. To protect against inadvertent data modification, all erase and write instructions are accepted only while the devices are write-enabled. A selected x8 byte or x16 word can be modified with a single WRITE or ERASE instruction. Additionally, the two instructions WRITE ALL or ERASE ALL can program an entire array. Once a device begins its self-timed program procedure, the data out pin Dout can indicate the READY/ BUSY status by raising chip select CS . The selftimed write cycle includes an automatic erasebefore-write capability. The devices can output any number of consecutive bytes/words using a single READ instruction.

FUNCTIONAL BLOCK DIAGRAM

INSTRUCTION REGISTER

CS SK

INSTRUCTION DECODE, CONTROL, AND CLOCK

GENERATION

DATA REGISTER

ADDRESS REGISTER

WRITE ENABLE

DUMMY BIT

R/W AMPS

ADDRESS DECODER

HIGH VOLTAGE GENERATOR

DOUT

EEPROM ARRAY 256/512x8 128/256x16

Copyright 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.

Integrated Silicon Solution, Inc.
08/15/07

IS93C56A IS93C66A

PIN CONFIGURATIONS
8-Pin DIP, 8-Pin TSSOP 8-Pin JEDEC SOIC “GR”
8-pad DFN
8-Pin JEDEC SOIC “G”

CS 1 SK 2 DIN 3 DOUT 4
8 VCC 7 NC 6 ORG 5 GND

CS 1 SK 2 DIN 3 DOUT 4
8 VCC 7 NC 6 ORG 5 GND

CS 1 SK 2 DIN 3 DOUT 4
8 VCC 7 NC 6 ORG 5 GND

Top View
ORDERING INFORMATION

Industrial Range -40ºC to +85ºC

Voltage Range 1.8V to 5.5V
1.8V to 5.5V

Order Part No. IS93C56A-2PI IS93C56A-2GRI IS93C56A-2ZI IS93C66A-2PI IS93C66A-2GRI IS93C66A-2ZI

Package 300-mil Plastic DIP SOIC JEDEC 169-mil TSSOP 300-mil Plastic DIP SOIC JEDEC 169-mil TSSOP

Automotive Range -40ºC to +125ºC, Lead-free

Voltage Range 2.5V to 5.5V
2.5V to 5.5V

Order Part No. IS93C56A-3PLA3 IS93C56A-3GRLA3 IS93C56A-3ZLA3 IS93C66A-3PLA3 IS93C66A-3GRLA3 IS93C66A-3ZLA3

Package 300-mil Plastic DIP SOIC JEDEC 169-mil TSSOP 300-mil Plastic DIP SOIC JEDEC 169-mil TSSOP

Industrial Range -40ºC to +85ºC, Lead-free

Voltage Range 1.8V to 5.5V
1.8V to 5.5V

Order Part No.

IS93C56A-2PLI IS93C56A-2DLI IS93C56A-2GLI

IS93C56A-2GRLI IS93C56A-2ZLI

IS93C66A-2PLI IS93C66A-2DLI

IS93C66A-2GRLI IS93C66A-2ZLI

Package
300-mil Plastic DIP 8-pad DFN SOIC JEDEC

SOIC JEDEC 169-mil TSSOP
300-mil Plastic DIP 8-pad DFN

SOIC JEDEC 169-mil TSSOP

Integrated Silicon Solution, Inc.
08/15/07

PACKAGING INFORMATION
300-mil Plastic DIP Package Code N,P

SEATING PLANE

FOR 32-PIN ONLY

MILLIMETERS

Sym. Min.

Max.

Leads

INCHES

Min.

Max.

Notes Controlling dimension inches, unless otherwise specified. BSC = Basic lead spacing between centers. Dimensions D and E1 do not include mold flash protrusions and should
be measured from the bottom of the package. Formed leads shall be planar with respect to one another within
inches at the seating plane.

Copyright 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
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Datasheet ID: IS93C66A-2GRLI 639330