IS45S16100C1-7TLA1

IS45S16100C1-7TLA1 Datasheet

IS45S16100C1

Part	Datasheet
IS45S16100C1-7TLA1	IS45S16100C1-7TLA1 (pdf)

Related Parts	Information
IS45S16100C1-7BLA1-TR	IS45S16100C1-7BLA1-TR
IS45S16100C1-7BLA1	IS45S16100C1-7BLA1
IS45S16100C1-7TLA1-TR	IS45S16100C1-7TLA1-TR

PDF Datasheet Preview
IS45S16100C1 512K Words x 16 Bits x 2 Banks 16-MBIT SYNCHRONOUS DYNAMIC RAM JANUARY 2006 • Clock frequency 143 MHz • Fully synchronous all signals referenced to a positive clock edge • Two banks can be operated simultaneously and independently • Dual internal bank controlled by A11 bank select • Single 3.3V power supply • LVTTL interface • Programmable burst length 1, 2, 4, 8, full page • Programmable burst sequence: Sequential/Interleave • 4096 refresh cycles every 64 ms • Random column address every clock cycle • Programmable CAS latency 2, 3 clocks • Burst read/write and burst read/single write operations capability • Burst termination by burst stop and precharge command • Byte controlled by LDQM and UDQM • Automotive Temperature Range Option A 0oC to +70oC Option A1 -40oC to +85oC • Packages 400-mil 50-pin TSOP-II, 60-ball fBGA • Lead-free package option ISSI’s 16Mb Synchronous DRAM IS45S16100C1 is organized as a 524,288-word x 16-bit x 2-bank for improved performance. The synchronous DRAMs achieve high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. PIN CONFIGURATIONS 50-Pin TSOP Type II GNDQ VDDQ GNDQ VDDQ LDQM DQ15 IDQ14 GNDQ DQ13 DQ12 VDDQ DQ11 DQ10 GNDQ VDDQ UDQM PIN DESCRIPTIONS A0-A11 A0-A10 A11 A0-A7 DQ0 to DQ15 CLK CKE CS RAS Address Input Row Address Input Bank Select Address Column Address Input Data DQ System Clock Input Clock Enable Chip Select Row Address Strobe Command CAS WE LDQM UDQM VDD GND VDDQ GNDQ NC Column Address Strobe Command Write Enable Lower Bye, Input/Output Mask Upper Bye, Input/Output Mask Power Ground Power Supply for DQ Pin Ground for DQ Pin No Connection Copyright 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. 1-800-379-4774 01/03/06 IS45S16100C1 ISSI ORDERING INFORMATION Automotive Range 0°C to +70°C Frequency 143MHz Speed ns 7 Automotive Range -40°C to +85°C Frequency 143MHz Speed ns 7 ISSI Order Part No. IS45S16100C1-7TLA IS45S16100C1-7BLA Package 400-mil TSOP II, Lead-free 60-ball fBGA, Lead-free Order Part No. IS45S16100C1-7TA1 IS45S16100C1-7TLA1 IS45S16100C1-7BLA1 Package 400-mil TSOP II 400-mil TSOP II, Lead-free 60-ball fBGA, Lead-free Integrated Silicon Solution, Inc. 1-800-379-4774 01/03/06 PACKAGING INFORMATION Mini Ball Grid Array Package Code B 60-Ball 1234567 A B C D E F G H J K L M N P R SEATING PLANE mBGA - 10.1mm x 6.4mm MILLIMETERS INCHES Sym. Min. No. Leads Typ. Max. 60 Min. Typ. Max. e D D1 + 60X 7654321 A B C D E F G H J K L M N P R e E1 E Notes Controlling dimensions are in millimeters. mm Ball Pitch Copyright 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. 1-800-379-4774 PACKAGING INFORMATION Plastic TSOP Package Code T Type II N/2+1 E1 E Notes Controlling dimension millimieters, unless otherwise specified. BSC = Basic lead spacing between centers. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. Formed leads shall be planar with respect to one another within inches at the seating plane. SEATING PLANE

PDF Datasheet Preview

IS45S16100C1
512K Words x 16 Bits x 2 Banks 16-MBIT SYNCHRONOUS DYNAMIC RAM

JANUARY 2006
• Clock frequency 143 MHz
• Fully synchronous all signals referenced to a
positive clock edge
• Two banks can be operated simultaneously and
independently
• Dual internal bank controlled by A11
bank select
• Single 3.3V power supply
• LVTTL interface
• Programmable burst length
1, 2, 4, 8, full page
• Programmable burst sequence:

Sequential/Interleave
• 4096 refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable CAS latency 2, 3 clocks
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and
precharge command
• Byte controlled by LDQM and UDQM
• Automotive Temperature Range

Option A 0oC to +70oC Option A1 -40oC to +85oC
• Packages 400-mil 50-pin TSOP-II, 60-ball fBGA
• Lead-free package option

ISSI’s 16Mb Synchronous DRAM IS45S16100C1 is
organized as a 524,288-word x 16-bit x 2-bank for improved performance. The synchronous DRAMs achieve high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input.

PIN CONFIGURATIONS 50-Pin TSOP Type II

GNDQ

VDDQ

GNDQ

VDDQ

LDQM

DQ15

IDQ14

GNDQ

DQ13

DQ12

VDDQ

DQ11

DQ10

GNDQ

VDDQ

UDQM

PIN DESCRIPTIONS

A0-A11 A0-A10 A11 A0-A7 DQ0 to DQ15 CLK CKE CS RAS

Address Input Row Address Input Bank Select Address Column Address Input Data DQ System Clock Input Clock Enable Chip Select Row Address Strobe Command

CAS WE LDQM UDQM VDD GND VDDQ GNDQ NC

Column Address Strobe Command Write Enable Lower Bye, Input/Output Mask Upper Bye, Input/Output Mask Power Ground Power Supply for DQ Pin Ground for DQ Pin No Connection

Copyright 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.

Integrated Silicon Solution, Inc. 1-800-379-4774
01/03/06

IS45S16100C1

ISSI
ORDERING INFORMATION Automotive Range 0°C to +70°C

Frequency 143MHz

Speed ns 7

Automotive Range -40°C to +85°C

Frequency 143MHz

Speed ns 7

ISSI

Order Part No. IS45S16100C1-7TLA IS45S16100C1-7BLA

Package 400-mil TSOP II, Lead-free 60-ball fBGA, Lead-free

Order Part No. IS45S16100C1-7TA1 IS45S16100C1-7TLA1 IS45S16100C1-7BLA1

Package 400-mil TSOP II 400-mil TSOP II, Lead-free 60-ball fBGA, Lead-free

Integrated Silicon Solution, Inc. 1-800-379-4774
01/03/06

PACKAGING INFORMATION

Mini Ball Grid Array Package Code B 60-Ball
1234567 A B C D E F G H J K L M N P R

SEATING PLANE
mBGA - 10.1mm x 6.4mm

MILLIMETERS

INCHES

Sym. Min.

No. Leads

Typ. Max. 60

Min. Typ. Max.
e D D1
+ 60X
7654321 A B C D E F G H J K L M N P R
e E1 E

Notes Controlling dimensions are in millimeters. mm Ball Pitch

Copyright 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.

Integrated Silicon Solution, Inc. 1-800-379-4774

PACKAGING INFORMATION

Plastic TSOP Package Code T Type II

N/2+1 E1 E

Notes Controlling dimension millimieters,
unless otherwise specified. BSC = Basic lead spacing
between centers. Dimensions D and E1 do not
include mold flash protrusions and should be measured from the
bottom of the package. Formed leads shall be planar with
respect to one another within inches at the seating plane.

SEATING PLANE

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived IS45S16100C1-7TLA1 Datasheet file may be downloaded here without warranties.

Datasheet ID: IS45S16100C1-7TLA1 639301