IR082H4C10U-P2

IR082H4C10U-P2 Datasheet


IR062HD4C10U-P2 IR082HD4C10U-P2

Part Datasheet
IR082H4C10U-P2 IR082H4C10U-P2 IR082H4C10U-P2 (pdf)
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Preliminary Data Sheet No. PD60171-C

IR062HD4C10U-P2 IR082HD4C10U-P2

HIGH VOLTAGE HALF BRIDGE
• Output Power IGBT’s in half-bridge configuration
• 600V rated breakdown voltage
• High side gate drive designed for bootstrap
operation
• Matched propagation delay for both channels
• Independent high and low side output channels

IR062HD4C10U-P2 or cross-conduction prevention logic IR082HD4C10U-P2
• Undervoltage lockout
• 5V Schmitt-triggered input logic
• Metal heatsink back for improved PD

The IR062HD4C10U-P2 / IR082HD4C10U-P2 are high voltage, high speed half bridges. Proprietary HVIC and latch immune CMOS technologies, along with the power IGBT technology, enable ruggedized single package construction. The logic inputs are compatible with standard CMOS or LSTTL outputs. The front-end features an independent high and low side driver in phase with the logic compatible input signals. The output features two IGBT’s in a halfbridge configuration. Propagation delays for the high and low side power IGBT’s are matched to simplify use. The device can operate up to 600 volts.

Product Summary VIN max

PD TA = 25°C VCE ON typ

Package
600V 3.0W 3.0V
7 Pin

IR062HD4C10U-P2 IR082HD4C10U-P2

Typical Connections

Vcc HIN L IN

HV DC Bus

IR062HD4C10U-P2
1 Vcc VB 6
2 HIN

VIN 9
3 L IN

COM 4

TO LOAD

Please note this info sheet contains advance information which may change before the product is released to production.

Vcc HIN L IN

HV DC Bus

IR082HD4C10U-P2
1 Vcc VB 6
2 HIN

VIN 9
3 L IN

COM 4

TO LOAD

Please note this info sheet contains advance information which may change before the product is released to production.

IR062HD4C10U-P2 IR082HD4C10U-P2

Absolute Maximum Ratings

Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air conditions.

VIN VB VO VIH/VIL VCC dV/dt PD RthJA RthJc TJ TS TL

Definition

High voltage supply High side floating supply absolute voltage Half-bridge output voltage Logic input voltage HIN & LIN Low side and logic fixed supply voltage Peak diode recovery dv/dt Package power dissipation TA +25°C Thermal resistance, junction to ambient Thermal resistance, junction to case metal Junction temperature Storage temperature Lead temperature soldering, 10 seconds

Min.
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Datasheet ID: IR082H4C10U-P2 639008