SRF 55V10P NB

SRF 55V10P NB Datasheet

SRF 55V10P

Part	Datasheet
SRF 55V10P NB	SRF 55V10P NB (pdf)

Related Parts	Information
SRF 55V10P C	SRF 55V10P C
SRF 55V10P MCC2	SRF 55V10P MCC2

PDF Datasheet Preview
Chip Card & Security ICs vicinity SRF 55V10P Intelligent 10 Kbit EEPROM with Contactless Interface compliant to ISO/IEC 15693 and ISO/IEC 18000-3 mode 1 Plain Mode Operation Short Product Information July 2007 SRF 55V10P Short Product Information Previous Releases 2002-07-30 Editorial changes Ref. SRF55V10P_ShortProductInfo_2007-06.doc Important: For further information please contact Infineon Technologies AG in Munich, Germany, Chip Card & Security ICs, Fax +49 0 89 / 234-955 9372 E-Mail: Published by Infineon Technologies AG, CC Applications Group D-81726 München Infineon Technologies AG 2007 All Rights Reserved. To our valued customers We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional amount of time to ensure that this document is correct. However, we realise that we may have missed a few things. If you find any information that is missing or appears in error, please use the contact section above to inform us. We appreciate your assistance in making this a better document. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives world-wide see address list . Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. vicinity plain SRF 55V10P Intelligent 10 Kbit EEPROM with Contactless Interface ISO/IEC 15693 and ISO/IEC 18000-3 mode 1 Contactless Interface • Physical Interface and Anticollision compliant to ISO/IEC 15693 and ISO/IEC 18000-3 mode 1 contactless transmission of data and supply energy carrier frequency MHz data rate up to 26 kbit/s anticollision with identification of up to 30 tags/sec read / write distance up to 150 cm depending on reader antenna configuration 10 Kbit EEPROM • ISO mode block organization of memory up to 248 blocks of user memory block size 4 bytes • Custom mode page organization of memory up to 128 pages of user memory page size 8 bytes • Unique chip identification number UID • EEPROM programming time per block/page < 4 ms • EEPROM endurance > 100,000 erase/write cycles1 • Data retention > 10 years1 Value Counters up to 65536 value range from 0 to 216-1 each page in the User Area is configurable as a Value Counter support of Anti-Tearing Electrical characteristics • ESD protection minimum 2 kV • Ambient temperature +70°C for the chip 1 Values are temperature dependent Short Product Information 2007-07-02 vicinity plain SRF 55V10P Development Tool Evaluation Kit including Manager Software Ordering and Packaging information Table 1 Ordering Information Type Package1 SRF 55V10P C Sawn wafer SRF 55V10P NB NiAu bump wafer SRF 55V10P MFCC1 S-MFCC1-2-1 2 SRF 55V10P MCC2 P-MCC2-2-1 Memory Pages Ordering Code User Admin. SP000294241 1024 bytes 256 bytes 128 SP000010035 For more ordering information wafer thickness and height of NiAu-Bump please contact your local Infineon sales office. Pin Description Figure 1 Pin Configuration Module Contactless Card MFCC1 top / bottom view Figure 2 Pin Configuration Module Contactless Card MCC2 top view 1 Available as a Module Flip Chip Contactless MFCC1 , Module Contactless Card MCC for embedding in plastic cards, as NiAu-bump version NB or as a die on sawn / unsawn wafer for customer packaging 2 FCoS Flip Chip on Substrate Short Product Information 2007-07-02 vicinity plain SRF 55V10P vicinity SRF 55V10P Figure 3 Pad Configuration Die Table 2 Symbol LA LB Pin Definitions and Functions Function Antenna connection Antenna connection Short Product Information 2007-07-02 vicinity plain SRF 55V10P product family The products are designed to meet increased demands for security and design flexibility. The family of contactless memory supplies the user with different memory sizes and incorporates security features to enable considerable flexibility in the application design. The functional architecture, meaning the memory organisation and authentication of products is the same for both, proximity ISO/IEC 14443 and vicinity ISO/IEC 18000-3 mode 1 or ISO/IEC This eases the system design and allows simple adaptation between applications. All products are available in plain mode with open memory access and in secure mode with memory access controlled by authentication procedures. Flexible controls within the my-d ICs start with plain mode operation and individual page locking for more complex applications various settings in secure mode can be set for multi user / multi application configurations. In secure mode a cryptographic algorithm based on 64-bit key is available. Mutual authentication, message authentication codes MAC and customized access conditions protect the memory against unauthorized access. Configurable value counters featuring anti-tearing functionality are suitable for value token applications, such as limited use transportation tickets. Architectural interoperability of all products enables an easy migration from simple to more demanding applications. In addition, the light ISO/IEC 18000-3 mode 1 or ISO/IEC 15693 is part of the family. Its optimized command set and memory expands the range of applications to cost sensitive segments. Short Product Information 2007-07-02 vicinity plain SRF 55V10P SRF 55V10P vicinity plain All vicinity products comply with ISO/IEC 18000-3 mode 1 or ISO/IEC 15693 standards for contactless vicinity smart cards. The power supply and data are transferred to the products via an antenna. The vicinity is designed to communicate within the operating distance of up to 1.5m depending on appropriate reader antenna configurations. Circuit Description The vicinity is made up of an EEPROM memory unit, an analog interface for contactless energy and data transmission and a control unit. Figure 4 Block diagram of the vicinity plain • Analog Contactless Interface The Analog Contactless Interface comprises the voltage rectifier, voltage regulator and system clock to supply the IC with appropriate power. Additionally the data stream is modulated and demodulated. • Operational mode The access to the memory depends on the actual mode of the vicinity. The memory is accessed according to plain or secure mode after the VICC is selected. • Memory Unit The Memory Unit consists of 1280 bytes organised in 128 pages each of 8 user and 2 administration bytes.

PDF Datasheet Preview

Chip Card & Security ICs vicinity

SRF 55V10P

Intelligent 10 Kbit EEPROM with Contactless Interface compliant to ISO/IEC 15693 and ISO/IEC 18000-3 mode 1

Plain Mode Operation

Short Product Information

July 2007

SRF 55V10P Short Product Information

Previous Releases 2002-07-30

Editorial changes

Ref. SRF55V10P_ShortProductInfo_2007-06.doc

Important:

For further information please contact Infineon Technologies AG in Munich, Germany, Chip Card & Security ICs, Fax +49 0 89 / 234-955 9372 E-Mail:

Published by Infineon Technologies AG, CC Applications Group D-81726 München Infineon Technologies AG 2007 All Rights Reserved.

To our valued customers We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional amount of time to ensure that this document is correct. However, we realise that we may have missed a few things. If you find any information that is missing or appears in error, please use the contact section above to inform us. We appreciate your assistance in making this a better document.

Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer.

Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives world-wide see address list .

Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
vicinity plain SRF 55V10P

Intelligent 10 Kbit EEPROM with Contactless Interface ISO/IEC 15693 and ISO/IEC 18000-3 mode 1

Contactless Interface
• Physical Interface and Anticollision compliant to ISO/IEC 15693 and ISO/IEC 18000-3 mode 1 contactless transmission of data and supply energy carrier frequency MHz data rate up to 26 kbit/s anticollision with identification of up to 30 tags/sec read / write distance up to 150 cm depending on reader antenna configuration
10 Kbit EEPROM
• ISO mode block organization of memory up to 248 blocks of user memory block size 4 bytes
• Custom mode page organization of memory up to 128 pages of user memory page size 8 bytes
• Unique chip identification number UID
• EEPROM programming time per block/page < 4 ms
• EEPROM endurance > 100,000 erase/write cycles1
• Data retention > 10 years1

Value Counters up to 65536 value range from 0 to 216-1
each page in the User Area is configurable as a Value Counter support of Anti-Tearing

Electrical characteristics
• ESD protection minimum 2 kV
• Ambient temperature +70°C for the chip
1 Values are temperature dependent

Short Product Information
2007-07-02
vicinity plain SRF 55V10P

Development Tool

Evaluation Kit including Manager Software
Ordering and Packaging information
Table 1 Ordering Information

Type

Package1

SRF 55V10P C

Sawn wafer

SRF 55V10P NB

NiAu bump wafer

SRF 55V10P MFCC1 S-MFCC1-2-1 2

SRF 55V10P MCC2 P-MCC2-2-1

Memory
Pages Ordering Code

User

Admin.

SP000294241 1024 bytes 256 bytes 128

SP000010035
For more ordering information wafer thickness and height of NiAu-Bump please contact your local Infineon sales office.

Pin Description

Figure 1 Pin Configuration Module Contactless Card MFCC1 top / bottom view

Figure 2 Pin Configuration Module Contactless Card MCC2 top view
1 Available as a Module Flip Chip Contactless MFCC1 , Module Contactless Card MCC for embedding in plastic cards, as NiAu-bump version NB or as a die on sawn / unsawn wafer for customer packaging
2 FCoS Flip Chip on Substrate

Short Product Information
2007-07-02
vicinity plain SRF 55V10P
vicinity SRF 55V10P

Figure 3 Pad Configuration Die

Table 2

Symbol LA LB

Pin Definitions and Functions

Function Antenna connection Antenna connection

Short Product Information
2007-07-02
vicinity plain SRF 55V10P
product family

The products are designed to meet increased demands for security and design flexibility. The family of contactless memory supplies the user with different memory sizes and
incorporates security features to enable considerable flexibility in the application design.

The functional architecture, meaning the memory organisation and authentication of products is the same for both, proximity ISO/IEC 14443 and vicinity

ISO/IEC 18000-3 mode 1 or ISO/IEC This eases the system design and allows simple
adaptation between applications.

All products are available in plain mode with open memory access and in secure mode with memory access controlled by authentication procedures.

Flexible controls within the my-d ICs start with plain mode operation and individual page locking for more complex applications various settings in secure mode can be set for multi user / multi application configurations.

In secure mode a cryptographic algorithm based on 64-bit key is available. Mutual authentication, message authentication codes MAC and customized access conditions protect the memory against unauthorized access. Configurable value counters featuring anti-tearing functionality are suitable for value token applications, such as limited use transportation tickets.

Architectural interoperability of all products enables an easy migration from simple to more demanding applications.

In addition, the light ISO/IEC 18000-3 mode 1 or ISO/IEC 15693 is part of the family. Its optimized command set and memory expands the range of applications to cost sensitive segments.

Short Product Information
2007-07-02
vicinity plain SRF 55V10P

SRF 55V10P vicinity plain

All vicinity products comply with ISO/IEC 18000-3 mode 1 or ISO/IEC 15693 standards for contactless vicinity smart cards. The power supply and data are transferred to the products via an antenna. The vicinity is designed to communicate within the operating distance of up
to 1.5m depending on appropriate reader antenna configurations.

Circuit Description

The vicinity is made up of an EEPROM memory unit, an analog interface for contactless energy and data transmission and a control unit.

Figure 4 Block diagram of the vicinity plain
• Analog Contactless Interface The Analog Contactless Interface comprises the voltage rectifier, voltage regulator and system clock to supply the IC with appropriate power. Additionally the data stream is modulated and demodulated.
• Operational mode The access to the memory depends on the actual mode of the vicinity. The memory is accessed according to plain or secure mode after the VICC is selected.
• Memory Unit The Memory Unit consists of 1280 bytes organised in 128 pages each of 8 user and 2 administration bytes.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived SRF55V10PNB Datasheet file may be downloaded here without warranties.

Datasheet ID: SRF55V10PNB 638670