SIDC01D120H6

SIDC01D120H6 Datasheet


SIDC01D120H6

Part Datasheet
SIDC01D120H6 SIDC01D120H6 SIDC01D120H6 (pdf)
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SIDC01D120H6

Fast switching diode chip in EMCON-Technology

FEATURES
• 1200V EMCON technology 120 µm chip
• soft, fast switching

This chip is used for:
• EUPEC power modules and discrete devices
• small temperature coefficient

Applications:
• SMPS, resonant applications,
drives

Chip Type SIDC01D120H6

Die Size
1200V 0.6A
x mm2
Package Ordering Code
sawn on foil

Q67050-A4171A001

MECHANICAL PARAMETER Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallisation

Cathode metallisation

Die bond Wire bond Reject Ink Dot Size

Recommended Storage Environment
11812 pcs

Photoimide
3200 nm AlSiCu
1400 nm Ni Ag suitable for epoxy and soft solder die bonding
electrically conductive glue or solder

Al, 250µm
mm store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C

Edited by INFINEON Technologies AI PS DD HV3, L 4002S, Edition 1,

SIDC01D120H6

Maximum Ratings

Parameter

VRRM

Continuous forward current limited by Tjmax Single pulse forward current
depending on wire bond configuration

IF IFSM

Maximum repetitive forward current
limited by Tjmax Operating junction and storage temperature

I FRM Tj , Tstg

Condition tP = 10 ms sinusoidal

Value

Unit
1200

A tbd

Static Electrical Characteristics tested on chip , Tj=25 °C, unless otherwise specified

Parameter

Conditions

Value Unit
min. Typ. max.

Cathode -Anode breakdown Voltage

VR=1200V IR= m A

Tj=25 °C Tj=25°C
1200
27 µA V

Forward voltage drop
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Datasheet ID: SIDC01D120H6 638557