SPB80N03S2L-06 G

SPB80N03S2L-06 G Datasheet


SPI80N03S2L-06 SPP80N03S2L-06,SPB80N03S2L-06

Part Datasheet
SPB80N03S2L-06 G SPB80N03S2L-06 G SPB80N03S2L-06 G (pdf)
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SPB80N03S2L06T SPB80N03S2L06T SPB80N03S2L06T
SPI80N03S2L-06 SPI80N03S2L-06 SPI80N03S2L-06
PDF Datasheet Preview
SPI80N03S2L-06 SPP80N03S2L-06,SPB80N03S2L-06

Power-Transistor

Feature
• N-Channel
• Enhancement mode
• Logic Level
• Low On-Resistance RDS on
• Excellent Gate Charge x RDS on
product FOM
• Superior thermal resistance
• 175°C operating temperature
• Avalanche rated
• dv/dt rated

P- TO262 -3-1

Product Summary

RDS on max. SMD version

P- TO263 -3-2

P- TO220 -3-1

Type SPP80N03S2L-06 SPB80N03S2L-06 SPI80N03S2L-06

Package P- TO220 -3-1 P- TO263 -3-2 P- TO262 -3-1
Ordering Code Q67042-S4088 Q67042-S4089 Q67042-S4092

Marking 2N03L06

Maximum Ratings, at Tj = 25 °C, unless otherwise specified

Parameter

Continuous drain current 1

TC=25°C

Pulsed drain current

TC=25°C

Avalanche energy, single pulse

ID=20A, VDD=25V,

IS=80A, VDS=24V, di/dt=200A/µs, Tjmax=175°C

Gate source voltage Power dissipation

TC=25°C

Operating and storage temperature IEC climatic category DIN IEC 68-1

ID puls

EAS EAR dv/dt

VGS Ptot

Tj , Tstg

Value
80 320
±20 150
+175 55/175/56

Unit A
kV/µs V W °C
2003-05-09

Thermal Characteristics Parameter

Characteristics Thermal resistance, junction - case SMD version, device on PCB:
min. footprint 6 cm2 cooling area 3

SPI80N03S2L-06 SPP80N03S2L-06,SPB80N03S2L-06

Values

Unit
min. typ. max.

RthJC RthJA
- 1 K/W

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified

Parameter

Values

Unit
min. typ. max.

Static Characteristics

Drain-source breakdown voltage
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Datasheet ID: SPB80N03S2L-06G 638270