BSP89L6327HTSA1

BSP89L6327HTSA1 Datasheet

BSP89

Part	Datasheet
BSP89L6327HTSA1	BSP89L6327HTSA1 (pdf)

Related Parts	Information
BSP89 E6327	BSP89 E6327

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SIPMOSÒ Small-Signal-Transistor Feature • N-Channel • Enhancement mode • Logic Level • dv/dt rated • Pb-free lead plating RoHS compliant • e4e.5lVearadtepdlating RoHS compliant x Qualified according to AEC Q101 BSP89 Product Summary 240 V RDS on PG-SOT223 VPS05163 Type BSP89 Package PG-SOT223 Tape and Reel Information Marking Packaging L6327 1000 pcs/reel BSP89 Non dry Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Value Continuous drain current TA=25°C TA=70°C Pulsed drain current TA=25°C ID puls dv/dt IS=0.35A, VDS=192V, di/dt=200A/µs, Tjmax=150°C Gate source voltage ESD class JESD22-A114-HBM ±20 1A >250V, <500V Power dissipation TA=25°C Operating and storage temperature IEC climatic category DIN IEC 68-1 Ptot Tj , Tstg +150 55/150/56 Unit A kV/µs V W °C 2009-08-18 Thermal Characteristics Parameter Characteristics Thermal resistance, junction - soldering point Pin 4 SMD version, device on PCB: min. footprint 6 cm2 cooling area 1 BSP89 Values Unit

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SIPMOSÒ Small-Signal-Transistor

Feature
• N-Channel
• Enhancement mode
• Logic Level
• dv/dt rated
• Pb-free lead plating RoHS compliant
• e4e.5lVearadtepdlating RoHS compliant
x Qualified according to AEC Q101

BSP89

Product Summary
240 V

RDS on

PG-SOT223

VPS05163

Type BSP89

Package PG-SOT223

Tape and Reel Information Marking Packaging

L6327 1000 pcs/reel

BSP89 Non dry

Maximum Ratings, at Tj = 25 °C, unless otherwise specified

Parameter

Value

Continuous drain current

TA=25°C TA=70°C

Pulsed drain current

TA=25°C

ID puls dv/dt

IS=0.35A, VDS=192V, di/dt=200A/µs, Tjmax=150°C

Gate source voltage ESD class JESD22-A114-HBM
±20
1A >250V, <500V

Power dissipation

TA=25°C

Operating and storage temperature IEC climatic category DIN IEC 68-1

Ptot Tj , Tstg
+150 55/150/56

Unit A
kV/µs V W °C
2009-08-18

Thermal Characteristics Parameter

Characteristics Thermal resistance, junction - soldering point Pin 4 SMD version, device on PCB:
min. footprint 6 cm2 cooling area 1

BSP89

Values

Unit

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Datasheet ID: BSP89L6327HTSA1 637847