BSP298 E6327

BSP298 E6327 Datasheet

BSP298

Part	Datasheet
BSP298 E6327	BSP298 E6327 (pdf)

Related Parts	Information
BSP298L6327HUSA1	BSP298L6327HUSA1

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BSP298 SIPMOS Small-Signal Transistor • N channel • Enhancement mode • Avalanche rated • VGS th = V • Pb-free lead plating RoHS compliant • Qualified according to AEC Q101 Pin 1 G Pin 2 D Pin 3 S Pin 4 D Type BSP298 Type BSP298 VDS 400 V Pb-free Yes RDS on Package PG-SOT223 Marking BSP298 Tape and Reel Information Packaging L6327 Maximum Ratings Parameter Continuous drain current TA = 26 °C DC drain current, pulsed TA = 25 °C Avalanche energy, single pulse ID = A, VDD = 50 V, RGS = 25 L = 125 mH, Tj = 25 °C Gate source voltage Power dissipation TA = 25 °C ESD Class JESD22-A114-HBM Symbol ID IDpuls EAS VGS Ptot Values Unit ± 20 Class 1b 2008-03-25 BSP298 Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air Therminal resistance, junction-soldering point 1 DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Tj Tstg RthJA RthJS 1 Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection Values Unit -55 + 150 °C -55 + 150 55 / 150 / 56 Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Values Unit min. typ.

PDF Datasheet Preview

BSP298

SIPMOS Small-Signal Transistor
• N channel
• Enhancement mode
• Avalanche rated
• VGS th = V
• Pb-free lead plating RoHS compliant
• Qualified according to AEC Q101

Pin 1 G

Pin 2 D

Pin 3 S

Pin 4 D

Type BSP298

Type BSP298

VDS 400 V

Pb-free Yes

RDS on

Package PG-SOT223

Marking BSP298

Tape and Reel Information Packaging

L6327

Maximum Ratings Parameter Continuous drain current TA = 26 °C DC drain current, pulsed TA = 25 °C Avalanche energy, single pulse

ID = A, VDD = 50 V, RGS = 25

L = 125 mH, Tj = 25 °C Gate source voltage Power dissipation TA = 25 °C ESD Class JESD22-A114-HBM

Symbol ID IDpuls EAS

VGS Ptot

Values

Unit
± 20

Class 1b
2008-03-25

BSP298

Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air Therminal resistance, junction-soldering point 1 DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1

Tj Tstg RthJA RthJS
1 Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection

Values

Unit
-55 + 150 °C
-55 + 150
55 / 150 / 56

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter

Values

Unit
min.
typ.

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Datasheet ID: BSP298E6327 637830