BGM1034N7
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BGM1034N7E6327XUSA1 (pdf) |
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BGM1034N7 GPS and GLONASS Front-End Module Data Sheet RF & Protection Devices Edition 2011-07-18 Published by Infineon Technologies AG 81726 Munich, Germany 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGM1034N7 GPS and GLONASS Front-End Module BGM1034N7 GPS and GLONASS Front-End Module Package drawing updated Marking defined Maximum voltage at Pin AI to GND changed Maximum value of ESD contact discharge capability of RF Input pin changed ESD capability HBM for pins 3 and 4 added Updated value for Out-of-band 3rd Order Intercept Point Parts list changed description for inductor L1 Pin description for pin 7 changed Cross-section view updated Updated carrier tape drawing Trademarks of Infineon Technologies AG Other Trademarks Advance Design System ADS of Agilent Technologies, AMBA , ARM , MULTI-ICE , KEIL , PRIMECELL , REALVIEW , THUMB , µVision of ARM Limited, UK. AUTOSAR is licensed by AUTOSAR development partnership. Bluetooth of Bluetooth SIG Inc. CAT-iq of DECT Forum. COLOSSUS , FirstGPS of Trimble Navigation Ltd. EMV of EMVCo, LLC Visa Holdings Inc. . EPCOS of Epcos AG. FLEXGO of Microsoft Corporation. FlexRay is licensed by FlexRay Consortium. HYPERTERMINAL of Hilgraeve Incorporated. IEC of Commission Electrotechnique Internationale. IrDA of Infrared Data Association Corporation. ISO of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB of MathWorks, Inc. MAXIM of Maxim Integrated Products, Inc. MICROTEC , NUCLEUS of Mentor Graphics Corporation. Mifare of NXP. MIPI of MIPI Alliance, Inc. MIPS of MIPS Technologies, Inc., USA. muRata of MURATA MANUFACTURING CO., MICROWAVE OFFICE MWO of Applied Wave Research Inc., OmniVision of OmniVision Technologies, Inc. Openwave Systems Inc. RED HAT Red Hat, Inc. RFMD RF Micro Devices, Inc. SIRIUS of Sirius Satellite Radio Inc. SOLARIS of Sun Microsystems, Inc. SPANSION of Spansion LLC Ltd. Symbian of Symbian Software Limited. TAIYO YUDEN of Taiyo Yuden Co. TEAKLITE of CEVA, Inc. TEKTRONIX of Tektronix Inc. TOKO of TOKO KABUSHIKI KAISHA TA. UNIX of X/Open Company Limited. VERILOG , PALLADIUM of Cadence Design Systems, Inc. VLYNQ of Texas Instruments Incorporated. VXWORKS , WIND RIVER of WIND RIVER SYSTEMS, INC. ZETEX of Diodes Zetex Limited. Last Trademarks Update 2011-02-24 Data Sheet BGM1034N7 GPS and GLONASS Front-End Module Table of Contents Table of Contents Table of Contents 4 Features 5 Electrical Characteristics 7 Absolute Maximum Ratings 7 ESD Integrity 8 RF Characteristics 9 Application Circuit and Block Diagram 11 Application Circuit Schematic 11 |
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