BGF106CE6328XTSA1

BGF106CE6328XTSA1 Datasheet

BGF106C

Part	Datasheet
BGF106CE6328XTSA1	BGF106CE6328XTSA1 (pdf)

PDF Datasheet Preview
Hipac High performance passive and actives on chip BGF106C SIM Card Interface Filter and ESD Protection BGF106C Datasheet Power Management & Multimarket Features updated BGF106C Trademarks of Infineon Technologies AG Other Trademarks Advance Design System ADS of Agilent Technologies, AMBA , ARM , MULTI-ICE , KEIL , PRIMECELL , REALVIEW , THUMB , µVision of ARM Limited, UK. AUTOSAR is licensed by AUTOSAR development partnership. Bluetooth of Bluetooth SIG Inc. CAT-iq of DECT Forum. COLOSSUS , FirstGPS of Trimble Navigation Ltd. EMV of EMVCo, LLC Visa Holdings Inc. . EPCOS of Epcos AG. FLEXGO of Microsoft Corporation. FlexRay is licensed by FlexRay Consortium. HYPERTERMINAL of Hilgraeve Incorporated. IEC of Commission Electrotechnique Internationale. IrDA of Infrared Data Association Corporation. ISO of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB of MathWorks, Inc. MAXIM of Maxim Integrated Products, Inc. MICROTEC , NUCLEUS of Mentor Graphics Corporation. MIPI of MIPI Alliance, Inc. MIPS of MIPS Technologies, Inc., USA. muRata of MURATA MANUFACTURING CO., MICROWAVE OFFICE MWO of Applied Wave Research Inc., OmniVision of OmniVision Technologies, Inc. Openwave Systems Inc. RED HAT Red Hat, Inc. RFMD RF Micro Devices, Inc. SIRIUS of Sirius Satellite Radio Inc. SOLARIS of Sun Microsystems, Inc. SPANSION of Spansion LLC Ltd. Symbian of Symbian Software Limited. TAIYO YUDEN of Taiyo Yuden Co. TEAKLITE of CEVA, Inc. TEKTRONIX of Tektronix Inc. TOKO of TOKO KABUSHIKI KAISHA TA. UNIX of X/Open Company Limited. VERILOG , PALLADIUM of Cadence Design Systems, Inc. VLYNQ of Texas Instruments Incorporated. VXWORKS , WIND RIVER of WIND RIVER SYSTEMS, INC. ZETEX of Diodes Zetex Limited. Last Trademarks Update 2011-11-11 Final Datasheet BGF106C SIM Card Interface Filter and ESD Protection SIM Card Interface Filter and ESD Protection • ESD protection circuit and interface filter for SIM cards • ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs • Wafer level package with SnAgCu solder balls • 400 um solder ball pitch • Pb-free RoHS compliant and halogen free package WLP-8-11-N-3D BGF106C is an ESD protection circuit and filtering interface for SIM cards. All external IOs are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green lead-free and halogen-free package with a size of only mm x mm and a total height of mm RST_int A3 CLK_int B3 Data I/O_int C3 R1, 100Ω R2, 47Ω R3, 100Ω Vcc C2 A2 RST_ext B1 CLK_ext C1 Data I/O_ext GND, B2 BGF106_ schematic_app.vsd Figure 1-1 Schematic Diagram and Package Configuration Type BGF106C Package WLP-8-11 Marking 6C Chip N0727 Final Datasheet Characteristics BGF106C Characteristics Table 2-1 Maximum Ratings Parameter Voltage at all pins to GND Operating temperature range Storage temperature range

PDF Datasheet Preview

Hipac

High performance passive and actives on chip

BGF106C

SIM Card Interface Filter and ESD Protection

BGF106C

Datasheet

Power Management & Multimarket

Features updated

BGF106C

Trademarks of Infineon Technologies AG

Other Trademarks

Advance Design System ADS of Agilent Technologies, AMBA , ARM , MULTI-ICE , KEIL , PRIMECELL , REALVIEW , THUMB , µVision of ARM Limited, UK. AUTOSAR is licensed by AUTOSAR development partnership. Bluetooth of Bluetooth SIG Inc. CAT-iq of DECT Forum. COLOSSUS , FirstGPS of Trimble Navigation Ltd. EMV of EMVCo, LLC Visa Holdings Inc. . EPCOS of Epcos AG. FLEXGO of Microsoft Corporation. FlexRay is licensed by FlexRay Consortium. HYPERTERMINAL of Hilgraeve Incorporated. IEC of Commission Electrotechnique Internationale. IrDA of Infrared Data Association Corporation. ISO of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB of MathWorks, Inc. MAXIM of Maxim Integrated Products, Inc. MICROTEC , NUCLEUS of Mentor Graphics Corporation. MIPI of MIPI Alliance, Inc. MIPS of MIPS Technologies, Inc., USA. muRata of MURATA MANUFACTURING CO., MICROWAVE OFFICE MWO of Applied Wave Research Inc., OmniVision of OmniVision Technologies, Inc. Openwave Systems Inc. RED HAT Red Hat, Inc. RFMD RF Micro Devices, Inc. SIRIUS of Sirius Satellite Radio Inc. SOLARIS of Sun Microsystems, Inc. SPANSION of Spansion LLC Ltd. Symbian of Symbian Software Limited. TAIYO YUDEN of Taiyo Yuden Co. TEAKLITE of CEVA, Inc. TEKTRONIX of Tektronix Inc. TOKO of TOKO KABUSHIKI KAISHA TA. UNIX of X/Open Company Limited. VERILOG , PALLADIUM of Cadence Design Systems, Inc. VLYNQ of Texas Instruments Incorporated. VXWORKS , WIND RIVER of WIND RIVER SYSTEMS, INC. ZETEX of Diodes Zetex Limited.

Last Trademarks Update 2011-11-11

Final Datasheet

BGF106C

SIM Card Interface Filter and ESD Protection

SIM Card Interface Filter and ESD Protection
• ESD protection circuit and interface filter for SIM cards
• ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external

IOs
• Wafer level package with SnAgCu solder balls
• 400 um solder ball pitch
• Pb-free RoHS compliant and halogen free package

WLP-8-11-N-3D

BGF106C is an ESD protection circuit and filtering interface for SIM cards. All external IOs are protected against

ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green lead-free
and halogen-free package with a size of only mm x mm and a total height of mm

RST_int A3 CLK_int B3 Data I/O_int C3

R1, 100Ω R2, 47Ω R3, 100Ω

Vcc C2 A2 RST_ext B1 CLK_ext C1 Data I/O_ext

GND, B2

BGF106_ schematic_app.vsd Figure 1-1 Schematic Diagram and Package Configuration

Type BGF106C

Package WLP-8-11

Marking 6C

Chip N0727

Final Datasheet

Characteristics

BGF106C

Characteristics

Table 2-1 Maximum Ratings Parameter

Voltage at all pins to GND

Operating temperature range

Storage temperature range

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Datasheet ID: BGF106CE6328XTSA1 637716