BGF104CE6328XTSA1
BGF104CE6328XTSA1 Datasheet
BGF104C
| Part | Datasheet |
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BGF104CE6328XTSA1 |
BGF104CE6328XTSA1 (pdf) |
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| Data Sheet, V2.0, November 2009 BGF104C HSMMC Interface Filter and ESD Protection RF & Protection Devices Edition 2009-11-12 Published by Infineon Technologies AG 81726 München, Germany Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics “Beschaffenheitsgarantie” . With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF104C HSMMC Interface Filter and ESD Protection BGF104C Previous Version 2009-09-14, V1.0 3D-figure of package updated Figure 2 updated Footprint Figure 3 added Tape specification Figure 4 added Target status removed Data Sheet V2.0, 2009-11-12 BGF104C BGF104C HSMMC Interface Filter and ESD Protection BGF104C Features • ESD protection and filter for High Speed Multi Media Card interface • ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs • 16 pin green wafer level package with SnAgCu solder balls • RoHS and WEEE compliant package • 500 µm solder ball pitch • 300 µm solder ball diameter WLP-16-3-N BGF104C is an ESD protection and filter circuit for a high speed multi media card interface. External pins are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of only mm x mm and a total height of mm. Int. IOs V MMC A4 MMCclk B4 MMCcmd C4 MMCdat0 C3 MMCdat1 D4 MMCdat2 D3 MMCdat3 R10, R11, R12, R13, R14, R2, R3, R4, R5, R6, R7, Ext. IOs Vdd A3 clk A2 cmd A1 dat0 B2 dat1 B1 dat2 C1 dat3 D1 Figure 1 Schematic Type BGF104C Package WLP-16-3 B3, C2, D2 GND |
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