BGA 700L16 E6327

BGA 700L16 E6327 Datasheet

BGA700L16

Part	Datasheet
BGA 700L16 E6327	BGA 700L16 E6327 (pdf)

PDF Datasheet Preview
BGA700L16 Low Noise Amplifier for IEEE 802.11a/b/g/n T h e B G A 7 0 L 1 6 is a Wireless LAN dual band Low Noise Amplifier. The amplifier comprises a single stage amplifier for the GHz band and a twostage amplifier to meet the requirements of the to GHz band. The complete circuitry, including a temperature stabilization block, fits on one die and needs no external matching elements. One of the challenges of Wireless LAN application designers is to maximize network coverage and data throughput. The receiver system noise figure determines sensitivity, network coverage and data throughput. The BGA700L16 uses a combination of Silicon Germanium Carbon epitaxy proprietary process and a low ohmic on chip ground contact from Infineon Technologies to deliver the word best-in class noise figure for wireless LAN systems. The BGA700L16 ships as bare die or in a low profile Tiny Small Leadless Package code-named TSLP-16. The package dimensions are x mm3. Applications • 802.11a/b/g/n Features • Input/output 50 W matched internally • SiGe:C process • Shut down mode • Temperature stabilization Benefits • Extended coverage • Ultra-low noise figure • Small form factor • High level of integration • Low cost TSLP-16 Package x mm3 Small Signal Discretes Application Circuit LNA_ON_52 VCC2 1 µF 13 RF_IN_52 9 RF_IN_24 15 Bandgap Reference and Biasing Circuit LNA_ON_24 Backside_GND RF_OUT_52 1 µF VCC1 RF_OUT_24 Performance Band [GHz] Supply Voltage [V] Supply Current [mA] Gain [dB] Noise Figure [dB] Input P1dB [dB] -10 -10 How to reach us: Published by Infineon Technologies AG 81726 Munich, Germany Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this Product Brief shall in no event be regarded as a guarantee of conditions or characteristics “Beschaffenheitsgarantie” . With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office Published by Infineon Technologies AG Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Ordering No. B132-H8884-X-X-7600 Printed in Germany PS nb

PDF Datasheet Preview

BGA700L16

Low Noise Amplifier for IEEE 802.11a/b/g/n

T h e B G A 7 0 L 1 6 is a Wireless LAN dual band Low Noise Amplifier. The amplifier comprises a single stage amplifier for the GHz band and a twostage amplifier to meet the requirements of the to GHz band. The complete circuitry, including a temperature stabilization block, fits on one die and needs no external matching elements.

One of the challenges of Wireless LAN application designers is to maximize network coverage and data throughput. The receiver system noise figure determines sensitivity, network coverage and data throughput.

The BGA700L16 uses a combination of Silicon Germanium Carbon epitaxy proprietary process and a low ohmic on chip ground contact from Infineon Technologies to deliver the word best-in class noise figure for wireless LAN systems.

The BGA700L16 ships as bare die or in a low profile Tiny Small Leadless Package code-named TSLP-16. The package dimensions are x mm3.

Applications
• 802.11a/b/g/n

Features
• Input/output 50 W matched internally
• SiGe:C process
• Shut down mode
• Temperature stabilization

Benefits
• Extended coverage
• Ultra-low noise figure
• Small form factor
• High level of integration
• Low cost

TSLP-16 Package x mm3

Small Signal Discretes

Application Circuit

LNA_ON_52

VCC2 1 µF
13 RF_IN_52
9 RF_IN_24
15 Bandgap Reference and

Biasing Circuit

LNA_ON_24 Backside_GND

RF_OUT_52
1 µF

VCC1

RF_OUT_24

Performance Band [GHz]

Supply Voltage [V] Supply Current [mA] Gain [dB]

Noise Figure [dB]

Input P1dB [dB] -10 -10

How to reach us:

Published by Infineon Technologies AG 81726 Munich, Germany

Infineon Technologies AG All Rights Reserved.

Legal Disclaimer

The information given in this Product Brief shall in no event be regarded as a guarantee of conditions or characteristics “Beschaffenheitsgarantie” . With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office

Published by Infineon Technologies AG

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Ordering No. B132-H8884-X-X-7600 Printed in Germany PS nb

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived BGA700L16E6327 Datasheet file may be downloaded here without warranties.

Datasheet ID: BGA700L16E6327 637700