FX11LB-120S/12-SV

FX11LB-120S/12-SV Datasheet

FX11L Series

Part	Datasheet
FX11LB-120S/12-SV	FX11LB-120S/12-SV (pdf)

Related Parts	Information
FX11LB-100S/10-SV	FX11LB-100S/10-SV
FX11LB-140S-SV	FX11LB-140S-SV
FX11LB-80S/8-SV	FX11LB-80S/8-SV
FX11LB-120P/12-SV	FX11LB-120P/12-SV
FX11LB-100P/10-SV	FX11LB-100P/10-SV
FX11LB-80P/8-SV	FX11LB-80P/8-SV
FX11LB-60P/6-SV	FX11LB-60P/6-SV
FX11LB-60S/6-SV	FX11LB-60S/6-SV

PDF Datasheet Preview
0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections FX11L Series sFeatures qCross-Section of Mating Low Profile Design The board to board mating height of 2 mm suits smaller,thinner case designs. Improved Transmission Efficiency Between Boards Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle. 10 Signal:1 Ground Arrangement Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise. Reinforced Fittings for Added Solder Weld Strength Reinforced fittings provide greater adhesion to the board,protecting against peeling.The unique connector design provides a connection between the fitting and the ground plate for a stronger ground. Suited to High-Density Applications The signal contact pitch of 0.5mm produces a smaller connector utilizing less board area for mounting. Detailed Figure of Solder Gap Structure Prevents Solder Wicking A solder gap has been designed into the contact SMT portion to prevent solder wicking. Optional Ground Plate An alternate style without the ground plate is available.The space provided by the ground plate removal has been filled with additional signal contacts. Note The thickness of the solder paste is not included in the 2 mm board-to-board stack height. sApplications Notebook computers, PDA, and other miniature electronic equipment. sProduct Specifications Rated current A Note 1 Operating temperature range -55 to 85ç Storage temperature range -10 to +60ç Note 2 Rating Rated voltage 50 V AC Operating humidity range Relative humidity 95% or less Storage humidity range -40 to -70% Note 2 No condensation Item Insulation resistance Voltage proof Contact resistance Vibration Requirements 100 or greater No flashover or breakdown 60 or less No electrical discontinuity for 1µs or greater No damage, cracks, or parts looseness Conditions Measured at 100 V DC 150 V AC applied for one minute Measured at 100 mA Frequency 10 to 55 Hz, amplitude of mm in 3 directions, 10 cycles each Shock No electrical discontinuity for 1µs or longer No damage, cracks, or parts looseness Acceleration of 490 m/s2, 11ms duration, sine half-wave waveform,for 3 cycles in the both directions of each of the 3 axes Damp heat Steady state Rapid change of temperature Contact resistance of 70 or less, insulation resistance of 100 or greater, no damage, cracks, or parts looseness Contact resistance of 70 or less, insulation resistance of 100 or greater, no damage, cracks, or parts looseness

PDF Datasheet Preview

0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections

FX11L Series
sFeatures
qCross-Section of Mating

Low Profile Design

The board to board mating height of 2 mm suits smaller,thinner case designs.

Improved Transmission Efficiency Between Boards

Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle.
10 Signal:1 Ground Arrangement

Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise.

Reinforced Fittings for Added Solder Weld Strength

Reinforced fittings provide greater adhesion to the board,protecting against peeling.The unique connector design provides a connection between the fitting and the ground plate for a stronger ground.

Suited to High-Density Applications

The signal contact pitch of 0.5mm produces a smaller connector utilizing less board area for mounting.

Detailed Figure of Solder Gap

Structure Prevents Solder Wicking

A solder gap has been designed into the contact SMT portion to prevent solder wicking.

Optional Ground Plate

An alternate style without the ground plate is available.The space provided by the ground plate removal has been filled with additional signal contacts.

Note The thickness of the solder paste is not included in the 2 mm board-to-board stack height.
sApplications

Notebook computers, PDA, and other miniature electronic equipment.
sProduct Specifications

Rated current A Note 1 Operating temperature range -55 to 85ç

Storage temperature range -10 to +60ç Note 2

Rating Rated voltage 50 V AC

Operating humidity range Relative humidity 95% or less Storage humidity range -40 to -70% Note 2

No condensation

Item Insulation resistance Voltage proof Contact resistance

Vibration

Requirements 100 or greater No flashover or breakdown 60 or less

No electrical discontinuity for 1µs or greater No damage, cracks, or parts looseness

Conditions Measured at 100 V DC 150 V AC applied for one minute Measured at 100 mA

Frequency 10 to 55 Hz, amplitude of mm in 3 directions, 10 cycles each

Shock

No electrical discontinuity for 1µs or longer No damage, cracks, or parts looseness

Acceleration of 490 m/s2, 11ms duration, sine half-wave waveform,for 3 cycles in the both directions of each of the 3 axes

Damp heat Steady state

Rapid change of temperature

Contact resistance of 70 or less, insulation resistance of 100 or greater, no damage, cracks, or parts looseness

Contact resistance of 70 or less, insulation resistance of 100 or greater, no damage, cracks, or parts looseness

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Datasheet ID: FX11LB-120S/12-SV 636153