JPW200S52R51-BHZ

JPW200S52R51-BHZ Datasheet


JPW200S52R5-BH Power Module dc-dc Converter 38 Vdc - 75 Vdc Input, Vdc Output 200W

Part Datasheet
JPW200S52R51-BHZ JPW200S52R51-BHZ JPW200S52R51-BHZ (pdf)
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Data Sheet March 26, 2008

JPW200S52R5-BH Power Module dc-dc Converter 38 Vdc - 75 Vdc Input, Vdc Output 200W
n Enterprise Networks n Distributed power architectures n Voice Over IP n Local Area Networks n Isolated Bus Voltage applications.

Options
n Choice of Remote On/Off option
n Compatible with RoHS EU Directive 2002/95/EC -Z Versions
n Compatible in RoHS EU Directive 2002/95/EC with lead solder exemption non -Z versions
n High efficiency typical
n Industry standard Half Brick 61.0mm x mm x mm in x in x in
n Industry standard pinout
n Isolation voltage:2250 Vdc
n Open-frame construction
n 2:1 input voltage range
n Remote Sense/Remote On/Off
n Auto restart after fault shutdown
n Constant switching frequency
n Output overvoltage and Overcurrent protection
n Overtemperature protection
n Adjustable output voltage trim
n Meets the voltage and current requirements for ETSI 300-132-2 and complies with and is approved for Basic Insulation rating per EN60950-1 n UL* 60950 Recognized, CSA† C22.2 No. 60950-00 Certi-
fied, and 0805 IEC60950, 3rd edition Licensed n CE mark meets 73/23/EEC and 93/68/EEC directives§
n ISO** 9001 certified manufacturing facilities

The JPW200S52R5-BH Power Module is a dc-dc converter that operates over an input voltage range of 38 Vdc to 75 Vdc and provides a precisely regulated dc output. The output is fully isolated from the input, allowing versatile polarity configurations and grounding connections. The module has a maximum power rating of 200 W at a typical full-load efficiency of

The open-frame module offers direct cooling of dissipative components for excellent thermal performance. The optional baseplate is offered to provide easy mounting of a heat sink, for high-temperature applications. The standard feature set includes remote sensing, output trim, and remote on/off for convenient flexibility in distributed power applications.
* UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. § This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed. The CE mark is placed on selected products. ** ISO is a registered trademark of the Internation Organization of Standards

Document Name:DS03-090 ver. PDF Name:jpw200s52r5-bh.pdf

Data Sheet March 26, 2008

JPW200S52R5-BH Power Module dc-dc Converter 38 Vdc - 75 Vdc Input, Vdc Output 200W

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliabiltiy.

Parameter Input Voltage:Continuous Operating Ambient Temperature See Thermal Considerations section Storage Temperature I/O Isolation Voltage

Device

Tstg

Unit
2250

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

Parameter

Operating Input Voltage

Under Voltage Lock-out turn on turn off

Maximum Input Current VI = 0 V to 75 V IO = IO, max
The temperature at this location should not exceed 100 °C. The output power of the module should not exceed the rated power for the module as listed in the Ordering Information table.

Although the maximum case temperature of the power modules is 100 °C, you can limit this temperature to a lower value for extremely high reliability.

Heat Transfer Without Heat Sinks

Increasing airflow over the module enhances the heat transfer via convection. Figure 17 shows the maximum output current that can be delivered by the module without exceeding the maximum case temperature versus local ambient temperature TA for natural convection through 3 m/s 600 ft./min. .

Note that the natural convection condition was measured at m/s to m/s 10 ft./min. to 20 ft./min. however, systems in which these power modules may be used typically generate natural convection airflow rates of m/s 60 ft./ min. due to other heat dissipating components in the system. The use of Figure 17 is shown in the following example.

O U T P U T C U R E N T, IO A
20 30 40 50 60 70 80 90

LOCAL AMBIENT TEMPERATURE, TA °C

Figure Derating Curve for JPW200S52R5-BH Vo = 52.5V with base plate Vin = 52V.

EMC Considerations

For assistance with designing for EMC compliance, please refer to the FLTR100V10 data sheet FDS01-043EPS .

Layout Considerations

Copper paths must not be routed beneath the power module mounting inserts. For additional layout guidelines, refer to the FLTR100V10 data sheet DS98-152EPS .

Lineage Power

Data Sheet March 26, 2008

JPW200S52R5-BH Power Module dc-dc Converter 38 Vdc - 75 Vdc Input, Vdc Output 200W

Through-Hole Lead-Free Soldering Information

The RoHS-compliant through-hole products use the SAC Sn/Ag/Cu Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3°C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210°C. For Pb solder, the recommended pot temperature is 260°C, while the Pb-free solder pot is 270°C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Tyco Electronics Power System representative for more details.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules Soldering and Cleaning Application Note AP01-056EPS .

Lineage Power

Data Sheet March 26, 2008

JPW200S52R5-BH Power Module dc-dc Converter 38 Vdc - 75 Vdc Input, Vdc Output 200W

Outline Diagram

Dimensions are in millimeters and inches Tolerences x.x mm x.xx in. in.
x.xx mm x.xxx in. in.

X 45°

CASE

ON/ OFF
2 PLCS

SEN -

TRIM

SEN +
7 PLCS
*Bottom Side label includes Lineage Power name, product designation, and data code.

Lineage Power

Data Sheet March 26, 2008

JPW200S52R5-BH Power Module dc-dc Converter 38 Vdc - 75 Vdc Input, Vdc Output 200W

Recommended Hole Pattern

Component side footprint. Dimensions are in millimeters and inches .

ON/OFF CASE
Ordering Information
For assistance in ordering, please contact your Lineage Power Account Manager or Field Application Engineer for pricing and availability.

Input Voltage

Output Voltage
52.5V 52.5V

Output Current
200W

Remote On/Off Logic

Connector Type

Negative

Through hole Through hole

Device Code

Comcodes

JPW200S52R51-BH 108982851 JPW200S52R51-BHZ CC109121456

Optional features can be ordered using the suffixes shown in table below. The suffixes follow the last letter of the device code and are placed in descending order. For example, the device codes for a JPW200S52R5-BH module with the following options are shown below:

Negative Logic remote on/off JPW200S52R51-BH

Option

Negative Logic remote on/off Base plate version for Heat Sink attachment Pin Length mm ± mm
in. ± in RoHS compliant

Suffix 1 6

A sia-Pacific Head qu art ers T el +65 6 41 6 4283

Europe, Middle-East and Africa Headquarters

Tyco Electronics UK Ltd

Eu ro peTe, lM +i4d4d l0e -1E3a4s4t4a6n9 d30A0,frFiacxa +H4e4a d0 q1u3a44rt4e6r9s 301

World W ide Headq u arters Lin eag e Po wer Co rp oratio n T X 75149, U SA +T1yc-8o0E0le-5c2tr6o-n7ic8s1P9ower Systems, Inc. 8T4X-725612469 , USA w+1e-9r.7c2o-2m84-2900

T el +4C9e8n9tra6l0A8m9e2ri8c6a-Latin America Headquarters

Tyco Electronics Power Systems

Tel +54 11 4316 2866, Fax +54 11 4312 9508 Ind ia Head qu arters T el +9A1s8ia0-P2a8c4if1ic1H6e3a3dquarters

Tyco Electronics Singapore Pte Ltd

Tel +65 482 0311, Fax 65 480 9299
e-mail:

Lineage Power reserves the right to make changes to the produc t s or information contained herein without notice. No liability is ass umed as a res ult of their use or
oatrioinnfocromnatatiinoend. herein without notice. No liability is assumed as a result of their use or application.

No rights under any patent accompany the sale of any such product s or information. 2008 Lineage Power Corpor ation, Mesquite, Texas All International Rights Res er ved.
2001 Tyco Electronics Power Systems, Inc. Mesquite, Texas All International Rights Reserved.

Printed in U.S.A.

Document No:DS03-090 ver. PDF Name:jpw200s52r5-bh.pdf
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Datasheet ID: JPW200S52R51-BHZ 645685