MHSL10055

MHSL10055 Datasheet

1/4 IN. MHSL02555

Part	Datasheet
MHSL10055	MHSL10055 (pdf)

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Technical Note July 1996 Thermal Management for FC- and FW-Series 250 W Board-Mounted Power Modules Introduction Basic Thermal Management Board-mounted power modules BMPMs enhance the capabilities of advanced computer and communications systems by providing power architectures however, proper cooling of the power modules is required for reliable and consistent operation. Maintaining the operating case temperature Tc within the range keeps internal component temperatures within their This, in turn, helps keep the expected mean time between failures MTBF from falling below the rating. Tyco's FC- and FW- Series 250 W to 300 W BMPMs are designed with high as a primary goal. The 5 V output units have typical full load of 83%, which result in less heat dissipation and lower operating temperatures. Also, these modules use temperature resistant components, such as ceramic capacitors, that do not exhibit wearout behavior during prolonged exposure to high temperatures, as do aluminum electrolytic capacitors. This application note provides the necessary information to verify that adequate cooling is present in a given operating environment. This information is applicable to all Tyco 250 W to 300 W BMPMs in the in. x in. x in. package. Proper cooling can be by measuring the case temperature of the module Tc at the location indicated in Figure Note that the view in Figure 1 is of the metal surface of the module the pin locations shown are for reference . Tc must not exceed 100 °C while operating in the system After the module has reached thermal equilibrium, the measurement can be made with a thermocouple or surface probe. If a heat sink is mounted to the case, make the measurement as close as possible to the indicated position, taking into account the contact resistance between the mounting surface and the heat sink see Heat Sink section . ON/OFF SYNC IN SYNC OUT CASE MEASURE CASE TEMPERATURE HERE 8-1303a Figure Case Temperature Measurement Metal Side While this is a valid method of checking for proper thermal management, it is only usable if the system exists and can be used as a test environment. The graphs on the accompanying pages provide guidelines to predict the thermal performance of the module for typical that include heat sinks in natural or forced environments. However, due to differences between the test setup and the system environment, the module case temperature must always be checked in the system to verify proper operation. Thermal Management for FC- and FW-Series 250 W Board-Mounted Power Modules Technical Note July 1996 Basic Thermal Management continued Module Derating The goal of thermal management is to transfer the heat dissipated by the module to the surrounding environment. The amount of power dissipated by the module as heat PD is the difference between the input power PI and the output power Po as shown by the equation below: PD = PI Po Also, module η is as the ratio of output power to input power as shown by the equation below: η = Po / PI The input power term can be eliminated by the combination of these two equations to yield the equation below: PD = Po 1 η / η This equation can be used to calculate the module power dissipation. However, is a nonlinear function of the module input voltage VI and output current Io . Typically, a plot of power dissipation versus output current over three different line voltages is given in each data sheet. This is because each module has a different power dissipation curve. A typical curve of this type is shown below in Figure 2 for a FW300A1 Power Module 5 V output voltage . POWER DISSIPATION, PD W 70 60 V = 72 V V = 54 V V = 36 V 30 OUTPUT CURRENT, IO A 8-1313 Figure FW300A1 Power Dissipation vs. Output Current Experimental Setup The derating curves in the following were obtained from measurements obtained in an experimental apparatus shown in Figure Note that the module and the printed-wiring board PWB onto which it was mounted were vertically oriented. The passage has a rectangular cross-section. The clearance between the top of the module and the facing PWB was kept constant at in. FACING PWB AIR VELOCITY AND AMBIENT TEMPERATURE MEASURED HERE AIRFLOW Figure Experimental Test Setup 8-690a Tyco Electronics Corp.

PDF Datasheet Preview

Technical Note July 1996

Thermal Management for FC- and FW-Series 250 W Board-Mounted Power Modules

Introduction

Basic Thermal Management

Board-mounted power modules BMPMs enhance the capabilities of advanced computer and communications systems by providing power architectures however, proper cooling of the power modules is required for reliable and consistent operation. Maintaining the operating case temperature Tc within the range keeps internal component temperatures within their This, in turn, helps keep the expected mean time between failures MTBF from falling below the rating.

Tyco's FC- and FW- Series 250 W to 300 W BMPMs are designed with high as a primary goal. The 5 V output units have typical full load of 83%, which result in less heat dissipation and lower operating temperatures. Also, these modules use temperature resistant components, such as ceramic capacitors, that do not exhibit wearout behavior during prolonged exposure to high temperatures, as do aluminum electrolytic capacitors.

This application note provides the necessary information to verify that adequate cooling is present in a given operating environment. This information is applicable to all Tyco 250 W to 300 W BMPMs in the in. x in. x in. package.

Proper cooling can be by measuring the case temperature of the module Tc at the location indicated in Figure Note that the view in Figure 1 is of the metal surface of the module the pin locations shown are for reference . Tc must not exceed 100 °C while operating in the system After the module has reached thermal equilibrium, the measurement can be made with a thermocouple or surface probe. If a heat sink is mounted to the case, make the measurement as close as possible to the indicated position, taking into account the contact resistance between the mounting surface and the heat sink see Heat Sink section .

ON/OFF SYNC IN SYNC OUT CASE

MEASURE CASE TEMPERATURE HERE
8-1303a

Figure Case Temperature Measurement Metal Side

While this is a valid method of checking for proper thermal management, it is only usable if the system exists and can be used as a test environment. The graphs on the accompanying pages provide guidelines to predict the thermal performance of the module for typical that include heat sinks in natural or forced environments. However, due to differences between the test setup and the system environment, the module case temperature must always be checked in the system to verify proper operation.

Thermal Management for FC- and FW-Series 250 W Board-Mounted Power Modules

Technical Note July 1996

Basic Thermal Management continued

Module Derating

The goal of thermal management is to transfer the heat dissipated by the module to the surrounding environment. The amount of power dissipated by the module as heat PD is the difference between the input power PI and the output power Po as shown by the equation below:

PD = PI Po

Also, module η is as the ratio of output power to input power as shown by the equation below:
η = Po / PI

The input power term can be eliminated by the combination of these two equations to yield the equation below:

PD = Po 1 η / η

This equation can be used to calculate the module power dissipation. However, is a nonlinear function of the module input voltage VI and output current Io . Typically, a plot of power dissipation versus output current over three different line voltages is given in each data sheet. This is because each module has a different power dissipation curve. A typical curve of this type is shown below in Figure 2 for a FW300A1 Power Module 5 V output voltage .

POWER DISSIPATION, PD W
70 60

V = 72 V

V = 54 V

V = 36 V 30

OUTPUT CURRENT, IO A
8-1313

Figure FW300A1 Power Dissipation vs. Output Current

Experimental Setup

The derating curves in the following were obtained from measurements obtained in an experimental apparatus shown in Figure Note that the module and the printed-wiring board PWB onto which it was mounted were vertically oriented. The passage has a rectangular cross-section. The clearance between the top of the module and the facing PWB was kept constant at in.

FACING PWB

AIR VELOCITY AND AMBIENT TEMPERATURE

MEASURED HERE

AIRFLOW

Figure Experimental Test Setup
8-690a

Tyco Electronics Corp.

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Datasheet ID: MHSL10055 645644