19-213UBC/C430/TR8

19-213UBC/C430/TR8 Datasheet


19-213UBC/C430/TR8

Part Datasheet
19-213UBC/C430/TR8 19-213UBC/C430/TR8 19-213UBC/C430/TR8 (pdf)
PDF Datasheet Preview
EVERLIGHT ELECTRONICS CO.,LTD.

Technical Data Sheet 0603 Package Chip LED mm Height
․Package in 8mm tape on reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow
19-213UBC/C430/TR8
solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain with in RoHS complaint version

Descriptions
․The 19-213 SMD LED Taping is much smaller
than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for
miniature applications. etc.
․Backlighting in dashboard and switch. ․Telecommunication indicator and backlighting in
telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use.

Device Selection Guide

Part No. 19-213UBC/C430/TR8

Chip Material InGaN/SiC

Emitted Color Blue

Resin Color Water Clear

Everlight Electronics Co., Ltd. Device No:SZDSE-193-016

Prepared date:7-Apr-2009

Page 1 of 9

Prepared by Huang yongxin

EVERLIGHT ELECTRONICS CO.,LTD.

Package Outline Dimensions
19-213UBC/C430/TR8

Note The tolerances unless mentioned is ±0.1mm ,Unit = mm

Everlight Electronics Co., Ltd. Device No:SZDSE-193-016

Prepared date:7-Apr-2009

Page 2 of 9

Prepared by Huang yongxin

EVERLIGHT ELECTRONICS CO.,LTD.

Absolute Maximum Ratings Ta=25℃

Parameter

Forward Current

Peak Forward Current IFP

Duty 1/10

Power Dissipation

Electrostatic Discharge HBM

Operating Temperature

Topr

Storage Temperature

Tstg

Soldering Temperature
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Datasheet ID: 19-213UBC/C430/TR8 512065