19-213UBC/C430/TR8

19-213UBC/C430/TR8 Datasheet

19-213UBC/C430/TR8

Part	Datasheet
19-213UBC/C430/TR8	19-213UBC/C430/TR8 (pdf)

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EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 0603 Package Chip LED mm Height ․Package in 8mm tape on reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow 19-213UBC/C430/TR8 solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain with in RoHS complaint version Descriptions ․The 19-213 SMD LED Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc. ․Backlighting in dashboard and switch. ․Telecommunication indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide Part No. 19-213UBC/C430/TR8 Chip Material InGaN/SiC Emitted Color Blue Resin Color Water Clear Everlight Electronics Co., Ltd. Device No:SZDSE-193-016 Prepared date:7-Apr-2009 Page 1 of 9 Prepared by Huang yongxin EVERLIGHT ELECTRONICS CO.,LTD. Package Outline Dimensions 19-213UBC/C430/TR8 Note The tolerances unless mentioned is ±0.1mm ,Unit = mm Everlight Electronics Co., Ltd. Device No:SZDSE-193-016 Prepared date:7-Apr-2009 Page 2 of 9 Prepared by Huang yongxin EVERLIGHT ELECTRONICS CO.,LTD. Absolute Maximum Ratings Ta=25℃ Parameter Forward Current Peak Forward Current IFP Duty 1/10 Power Dissipation Electrostatic Discharge HBM Operating Temperature Topr Storage Temperature Tstg Soldering Temperature

PDF Datasheet Preview

EVERLIGHT ELECTRONICS CO.,LTD.

Technical Data Sheet 0603 Package Chip LED mm Height
․Package in 8mm tape on reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow
19-213UBC/C430/TR8
solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain with in RoHS complaint version

Descriptions
․The 19-213 SMD LED Taping is much smaller
than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for
miniature applications. etc.
․Backlighting in dashboard and switch. ․Telecommunication indicator and backlighting in
telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use.

Device Selection Guide

Part No. 19-213UBC/C430/TR8

Chip Material InGaN/SiC

Emitted Color Blue

Resin Color Water Clear

Everlight Electronics Co., Ltd. Device No:SZDSE-193-016

Prepared date:7-Apr-2009

Page 1 of 9

Prepared by Huang yongxin

EVERLIGHT ELECTRONICS CO.,LTD.

Package Outline Dimensions
19-213UBC/C430/TR8

Note The tolerances unless mentioned is ±0.1mm ,Unit = mm

Everlight Electronics Co., Ltd. Device No:SZDSE-193-016

Prepared date:7-Apr-2009

Page 2 of 9

Prepared by Huang yongxin

EVERLIGHT ELECTRONICS CO.,LTD.

Absolute Maximum Ratings Ta=25℃

Parameter

Forward Current

Peak Forward Current IFP

Duty 1/10

Power Dissipation

Electrostatic Discharge HBM

Operating Temperature

Topr

Storage Temperature

Tstg

Soldering Temperature

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 19-213UBC/C430/TR8 Datasheet file may be downloaded here without warranties.

Datasheet ID: 19-213UBC/C430/TR8 512065