B82464A2473K

B82464A2473K Datasheet


B82464A2 March 2008

Part Datasheet
B82464A2473K B82464A2473K B82464A2473K (pdf)
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PDF Datasheet Preview
SMT power inductors

Size x mm

Series/Type Date:

B82464A2 March 2008

Data Sheet

EPCOS AG Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.

SMT power inductors Size x mm

Rated inductance 1 µH to 330 µH Rated current A to A

Construction
• Ferrite core
• Winding enamel copper wire
• Winding welded to terminals
• Temperature range up to 150 °C
• High rated current
• Low DC resistance
• Suitable for lead-free reflow soldering
as referenced in JEDEC J-STD 020C
• Qualified to AEC-Q200
• RoHS-compatible
• Filtering of supply voltages
• Coupling, decoupling
• DC/DC converters
• Automotive electronics
• Industrial electronics

Terminals
• Base material CuFe2P
• Layer composition Ag, Sn lead-free
• Electro-plated

Marking
• Marking on component Manufacturer, L value nH, coded , L tolerance coded , manufacturing date YWWD , two last digits of work order
• Minimum data on reel Manufacturer, ordering code, L value, quantity, date of packing

Delivery mode and packing unit
• 16-mm blister tape, wound on 330-mm reel
• Packing unit 1250 pcs./reel

Please read Cautions and warnings and Important notes at the end of this document.
2 03/08

B82464A2
330 _+20

SMT power inductors Size x mm

Dimensional drawing and layout recommendation

B82464A2

Marking
3 max.

IND0474-K
max.
max.
1 Soldering area

IND0473-E-E

Dimensions in mm

Component tolerances mm unless otherwise noted.

Taping and packing Blister tape

Reel max.
max.
max.

Component

Dimensions in mm

Direction of unreeling

IND0829-B-E

IND0351-A

Please read Cautions and warnings and Important notes at the end of this document.
3 03/08

SMT power inductors Size x mm

B82464A2

Technical data and measuring conditions

Rated inductance LR

Measured with impedance analyzer Agilent 4294A at frequency fL, V, 20 °C

Rated temperature TR Rated current IR
85 °C

Max. permissible DC with temperature increase of 40 K at rated temperature

Saturation current Isat DC resistance Rmax Solderability lead-free

Max. permissible DC with inductance decrease of approx. 10% Measured at 20 °C

Dip and look method Sn95.5Ag3.8Cu0.7 245 ±5 °C, 5 s Wetting of soldering area 90% based on IEC 60068-2-58
Characteristics and ordering codes

Tolerance fL
±20% M
±10% K

Isat A

Rmax
Ordering code

B82464A2102M000 B82464A2152M000 B82464A2222M000 B82464A2362M000 B82464A2472M000 B82464A2682M000 B82464A2103M000 B82464A2153K000 B82464A2223K000 B82464A2333K000 B82464A2473K000 B82464A2683K000 B82464A2104K000 B82464A2154K000 B82464A2224K000 B82464A2334K000

Please read Cautions and warnings and Important notes at the end of this document.
4 03/08

SMT power inductors Size x mm

B82464A2

Impedance |Z| versus frequency f measured with impedance analyzer Agilent 4294A, typical values at 20 °C
10 6 B82464A2
|Z| 10 5

IND0865-A
10 1 330 µH
100 µH
10 µH
1 µH
10 7 Hz 10 8

Current derating Iop/IR versus ambient temperature TA rated temperature TR = 85 °C

Iop IR

IND0602-K

Inductance L versus DC load current IDC measured with LCR meter Agilent 4275A,
typical values at 20 °C
10 3 µH

IND0848-T

B82464A2

A 10 2
0 20 40 60 80 100 120 150
5 03/08

Cautions and warnings
• Please note the recommendations in our Inductors data book latest edition and in the data sheets. Particular attention should be paid to the derating curves given there. The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing.
• If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation.
• The following points must be observed if the components are potted in customer applications Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. The effect of the potting material can change the high-frequency behaviour of the components.
• Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core.
• Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer.

Please read Cautions and warnings and Important notes at the end of this document.
6 03/08

Important notes

The following applies to all products named in this publication:

Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application.

As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application.

We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health e.g. in accident prevention or life-saving systems , it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer e.g. installation of protective circuitry or redundancy that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component.

The warnings, cautions and product-specific notes must be observed.

In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions e.g. because they are classed as hazardous . Useful information on this will be found in our Material Data Sheets on the Internet Should you have any more detailed questions, please contact our sales offices.
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Datasheet ID: B82464A2473K 511668