B57621C223K62

B57621C223K62 Datasheet


B57621 C 621

Part Datasheet
B57621C223K62 B57621C223K62 B57621C223K62 (pdf)
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B57621C222K62 B57621C222K62 B57621C222K62
B57621C223J62 B57621C223J62 B57621C223J62
PDF Datasheet Preview
Temperature Measurement SMD NTC Thermistors with Silver Palladium Termination, Size 1206

B57621 C 621

I Temperature measurement and compensation in hybrid circuits data systems telecom systems automotive electronics
1,6±0,2
1,3 max.
3,2±0,2 0,5±0,25

I Silver palladium termination AgPd I Cost-effective I Suitable for wave and reflow soldering

Options Alternative resistance ratings and resistance tolerance < 5% available on request

Termination

TNT0398-F

Dimensions in mm/Approx. weight 18 mg

Delivery mode Blister tape, 180-mm reel, PU 4000 or 2000 pcs, depending on chip thickness

Climatic category IEC 60068-1 Max. power at 25 °C on PCB Resistance tolerance Rated temperature B value tolerance Dissipation factor on PCB Thermal cooling time constant on PCB Heat capacity

P25 TN

Cth1
55/125/21
± 5 %, ± 10 %, ± 20 %
±3%
approx. 5
mW/K
approx. 10
approx. 50
mJ/K
2,2 k 3,3 k 4,7 k
10 k 15 k 22 k 33 k 47 k 68 k

No. of R/T characteristic
1308 1309 1010 1008 2003 2001
+ J for = ± 5 % K for = ± 10 % M for = ± 20 %

B25/50

K 3010 3430 3470 3480 3930 3860

B25/85

K 3040 3500 3510 3550 3960 3890

B25/100

K 3060 3520 3530 3560 3980 3920
Ordering code

B57621C0222+062 B57621C0332+062 B57621C0472+062 B57621C0103+062 B57621C0153+062 B57621C0223+062 B57621C0333+062 B57621C0473+062 B57621C0683+062
1 Depends on mounting situation
60 05/02

Temperature Measurement SMD NTC Thermistors with Silver Palladium Termination, Size 1206

B57621 C 621
100 k 150 k 220 k 330 k 470 k

No. of R/T characteristic
4901 2903 1014
+ J for = ± 5 % K for = ± 10 % M for = ± 20 %

B25/50

K 3870 4120 4090

B25/85

K 3930 4190 4210

B25/100

K 3950 4200 4250
Ordering code

B57621C0104+062 B57621C0154+162 B57621C0224+062 B57621C0334+062 B57621C0474+062

Reliability data

SMD NTC thermistors are tested in accordance with IEC The parts are mounted on a standardized PCB in accordance with IEC

Test Storage in dry heat

Storage in damp heat, steady state

Rapid temperature cycling Endurance

Solderability

Standard

IEC 60068-2-2 JIS C 0021

IEC 60068-2-3 JIS C 0022

IEC 60068-2-14 JIS C 0025

IEC 60068-2-58 JIS C 0054

Test conditions
typical

Storage at upper category temperature T 125 ± 2 °C t 1000 h

Temperature of air 40 ± 2 °C Relative humidity of air 93 % Duration 21 days

Lower test temperature 55 °C < 3 % Upper test temperature 125 °C Number of cycles 10

Pmax 300 mW T 65 ± 2 °C
t 1000 h

Solderability 215 ± 3 °C / 3 ± 0,3 s 235 ± 5 °C / 2 ± 0,2 s

Remarks

No visible damage
95 % of terminations wetted

Resistance drift after soldering

Resistance to soldering heat 260 ± 5 °C / 10 ± 1 s

Reflow soldering profile Wave soldering profile
61 05/02

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Published by EPCOS AG

Corporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY ++49 89 636 09, FAX 0 89 636-2 26 89 EPCOS AG Reproduction, publication and dissemination of this brochure and the information contained therein without EPCOS’ prior express consent is prohibited.

Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI German Electrical and Electronic Manufacturers’ Association , unless otherwise agreed.

This brochure replaces the previous edition.

For questions on technology, prices and delivery please contact the Sales Offices of EPCOS AG or the international Representatives.

Due to technical requirements components may contain dangerous substances. For information on the type in question please also contact one of our Sales Offices.
More datasheets: B57621C224M62 | B57621C223M62 | B57621C473J62 | B57621C333J62 | B57621C332J62 | B57621C474J62 | B57621C472J62 | B57621C224J62 | B57621C222J62 | B57621C333K62


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Datasheet ID: B57621C223K62 511515