B57619C473K60

B57619C473K60 Datasheet

B57619 C 619

Part	Datasheet
B57619C473K60	B57619C473K60 (pdf)

Related Parts	Information
B57619C223M60	B57619C223M60
B57619C223K60	B57619C223K60
B57619C473J60	B57619C473J60
B57619C473M60	B57619C473M60
B57619C103J60	B57619C103J60
B57619C103K60	B57619C103K60
B57619C223J60	B57619C223J60

PDF Datasheet Preview
Temperature Measurement SMD NTC Thermistors with Silver Palladium Termination, Size 0603 SMD NTC thermistors with silver palladium termination I Temperature measurement and compensation in hybrid circuits data systems telecom systems automotive electronics 0,8±0,15 B57619 C 619 0,9 max. 1,6±0,15 0,35±0,15 Features I Silver palladium termination AgPd I Cost-effective I Suitable for wave and reflow soldering Options Alternative resistance ratings and resistance tolerance < 5% available on request Termination TNT0396-Y Dimensions in mm Approx. weight 6 mg Delivery mode Cardboard tape, 180-mm reel, PU 4000 pcs Climatic category IEC 60068-1 Max. power at 25 °C on PCB Resistance tolerance Rated temperature B value tolerance Dissipation factor on PCB Thermal cooling time constant on PCB Heat capacity P25 TN Cth1 55/125/21 ± 5 %, ± 10 %, ± 20 % ±3% approx. 3 mW/K approx. 4 approx. 12 mJ/K No. of R/T characteristic 1010 1008 2001 + J for = ± 5 % K for = ± 10 % M for = ± 20 % B25/50 K 3470 3480 3860 B25/85 K 3510 3550 3890 B25/100 K 3530 3560 3920 Ordering code B57619C0103+060 B57619C0223+060 B57619C0473+060 1 Depends on mounting situation 56 05/02 Temperature Measurement SMD NTC Thermistors with Silver Palladium Termination, Size 0603 B57619 C 619 Reliability data SMD NTC thermistors are tested in accordance with IEC The parts are mounted on a standardized PCB in accordance with IEC Test Storage in dry heat Storage in damp heat, steady state Rapid temperature cycling Endurance Solderability Standard IEC 60068-2-2 JIS C 0021 IEC 60068-2-3 JIS C 0022 IEC 60068-2-14 JIS C 0025 IEC 60068-2-58 JIS C 0054 Test conditions typical Storage at upper category temperature T 125 ± 2 °C t 1000 h Temperature of air 40 ± 2 °C Relative humidity of air 93 % Duration 21 days Lower test temperature 55 °C < 3 % Upper test temperature 125 °C Number of cycles 10 Pmax 180 mW T 65 ± 2 °C t 1000 h Solderability 215 ± 3 °C / 3 ± 0,3 s 235 ± 5 °C / 2 ± 0,2 s Remarks No visible damage 95 % of terminations wetted Resistance drift after soldering Resistance to soldering heat 260 ± 5 °C / 10 ± 1 s Reflow soldering profile Wave soldering profile 57 05/02 Herausgegeben von EPCOS AG Unternehmenskommunikation, Postfach 80 17 09, 81617 München, DEUTSCHLAND ++49 89 636 09, FAX 0 89 636-2 26 89 EPCOS AG Vervielfältigung, Veröffentlichung, Verbreitung und Verwertung dieser Broschüre und ihres Inhalts ohne ausdrückliche Genehmigung der EPCOS AG nicht gestattet. Bestellungen unterliegen den vom ZVEI empfohlenen Allgemeinen Lieferbedingungen für Erzeugnisse und Leistungen der Elektroindustrie, soweit nichts anderes vereinbart wird. Diese Broschüre ersetzt die vorige Ausgabe. Fragen über Technik, Preise und Liefermöglichkeiten richten Sie bitte an den Ihnen nächstgelegenen Vertrieb der EPCOS AG oder an unsere Vertriebsgesellschaften im Ausland. Bauelemente können aufgrund technischer Erfordernisse Gefahrstoffe enthalten. Auskünfte darüber bitten wir unter Angabe des betreffenden Typs ebenfalls über die zuständige Vertriebsgesellschaft einzuholen. Published by EPCOS AG Corporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY ++49 89 636 09, FAX 0 89 636-2 26 89 EPCOS AG Reproduction, publication and dissemination of this brochure and the information contained therein without EPCOS’ prior express consent is prohibited. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI German Electrical and Electronic Manufacturers’ Association , unless otherwise agreed. This brochure replaces the previous edition.

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Temperature Measurement SMD NTC Thermistors with Silver Palladium Termination, Size 0603

SMD NTC thermistors with silver palladium termination

I Temperature measurement and compensation in hybrid circuits data systems telecom systems automotive electronics
0,8±0,15

B57619 C 619
0,9 max.
1,6±0,15 0,35±0,15

Features I Silver palladium termination AgPd I Cost-effective I Suitable for wave and reflow soldering

Options Alternative resistance ratings and resistance tolerance < 5% available on request

Termination

TNT0396-Y

Dimensions in mm Approx. weight 6 mg

Delivery mode Cardboard tape, 180-mm reel, PU 4000 pcs

Climatic category IEC 60068-1 Max. power at 25 °C on PCB Resistance tolerance Rated temperature B value tolerance Dissipation factor on PCB Thermal cooling time constant on PCB Heat capacity

P25 TN

Cth1
55/125/21
± 5 %, ± 10 %, ± 20 %
±3%
approx. 3
mW/K
approx. 4
approx. 12
mJ/K

No. of R/T
characteristic
1010
1008
2001
+ J for = ± 5 % K for = ± 10 % M for = ± 20 %

B25/50

K 3470 3480 3860

B25/85

K 3510 3550 3890

B25/100

K 3530 3560 3920
Ordering code

B57619C0103+060 B57619C0223+060 B57619C0473+060
1 Depends on mounting situation
56 05/02

Temperature Measurement SMD NTC Thermistors with Silver Palladium Termination, Size 0603

B57619 C 619

Reliability data

SMD NTC thermistors are tested in accordance with IEC The parts are mounted on a standardized PCB in accordance with IEC

Test Storage in dry heat

Storage in damp heat, steady state

Rapid temperature cycling Endurance

Solderability

Standard

IEC 60068-2-2 JIS C 0021

IEC 60068-2-3 JIS C 0022

IEC 60068-2-14 JIS C 0025

IEC 60068-2-58 JIS C 0054

Test conditions
typical

Storage at upper category temperature T 125 ± 2 °C t 1000 h

Temperature of air 40 ± 2 °C Relative humidity of air 93 % Duration 21 days

Lower test temperature 55 °C < 3 % Upper test temperature 125 °C Number of cycles 10

Pmax 180 mW T 65 ± 2 °C
t 1000 h

Solderability 215 ± 3 °C / 3 ± 0,3 s 235 ± 5 °C / 2 ± 0,2 s

Remarks

No visible damage
95 % of terminations wetted

Resistance drift after soldering

Resistance to soldering heat 260 ± 5 °C / 10 ± 1 s

Reflow soldering profile Wave soldering profile
57 05/02

Herausgegeben von EPCOS AG

Unternehmenskommunikation, Postfach 80 17 09, 81617 München, DEUTSCHLAND ++49 89 636 09, FAX 0 89 636-2 26 89 EPCOS AG Vervielfältigung, Veröffentlichung, Verbreitung und Verwertung dieser Broschüre und ihres Inhalts ohne ausdrückliche Genehmigung der EPCOS AG nicht gestattet.

Bestellungen unterliegen den vom ZVEI empfohlenen Allgemeinen Lieferbedingungen für Erzeugnisse und Leistungen der Elektroindustrie, soweit nichts anderes vereinbart wird.

Diese Broschüre ersetzt die vorige Ausgabe.

Fragen über Technik, Preise und Liefermöglichkeiten richten Sie bitte an den Ihnen nächstgelegenen Vertrieb der EPCOS AG oder an unsere Vertriebsgesellschaften im Ausland. Bauelemente können aufgrund technischer Erfordernisse Gefahrstoffe enthalten. Auskünfte darüber bitten wir unter Angabe des betreffenden Typs ebenfalls über die zuständige Vertriebsgesellschaft einzuholen.

Published by EPCOS AG

Corporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY ++49 89 636 09, FAX 0 89 636-2 26 89 EPCOS AG Reproduction, publication and dissemination of this brochure and the information contained therein without EPCOS’ prior express consent is prohibited.

Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI German Electrical and Electronic Manufacturers’ Association , unless otherwise agreed.

This brochure replaces the previous edition.

More datasheets: M33590 SL002 | M33590 SL005 | M33590 SL001 | DFR0492 | DM7447AN | DM7446AN | 20035 | B57619C223M60 | B57619C223K60 | B57619C473J60

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Datasheet ID: B57619C473K60 511513