B30931D7020Y918
B30931D7020Y918 Datasheet
R078 WL1837 / D7020 B30931D7020Y918
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B30931D7020Y918 |
B30931D7020Y918 (pdf) |
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| Complementary wireless module WLAN / BT Standard Laminate SiP Module Series/Type Ordering code: Date Version: R078 WL1837 / D7020 B30931D7020Y918 2014-12-9 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears invisible for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 header 1 + top left bar : Complementary wireless module WLAN / BT Identification/Classification 2 header 2 + bottom left header bar : Standard Laminate SiP Module Ordering code top right header bar B30931D7020Y918 Series/Type bottom right header bar R078 WL1837 / D7020 Preliminary data optional if necessary Department: SAW IT Date: 2014-12-9 Version: EPCOS AG Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 WL1837 / D7020 Overview This document details the specifications and features of R078 WL1837 / D7020 SiP module. The R078 WL1837 / D7020 SiP module is based on Texas Instruments WL1837 IC, specifically WL183x Data Sheet version such that the SiP module specification is subject to any subsequent changes in applicable Texas Instruments documentation and software. The R078 WL1837 / D7020 contains the WL1837 SoC, 2.4GHz and 5 GHz SPDT switches, 2.4GHz and 5GHz band pass filters / diplexer and necessary passive components for WLAN and BT in a highly integrated solution. WLAN, BT, BLE on a single chip provide universal connectivity in small PCB footprint. Provides efficient direct connection to battery by employing several integrated switched mode power supplies DC2DC . Based on 45nm CMOS technology using proven core technology. Seamless integration with TI OMAP Application Processors. WLAN and Bluetooth cores software and hardware are compatible with prior WL127x and WL128x offerings, for smooth migration to Device. Shared HCI transport for BT/BLE over UART and SDIO for WLAN. Downloadable patches and firmware enables new features to be added for all functional block's. Temperature detection and compensation mechanism ensures minimal variation in the RF performance over the entire temperature range. Bluetooth BLE and all audio processing features work in parallel and include full coexistence with WLAN Mobile phone and mobile computer device applications. The R078 WL1837 / D7020 is a highly integrated WLAN, BT, BLE device that forms a complete standalone communication system. The WL1837 is a highly integrated single-chip CMOS 45-nm process incorporates the core functionality of the WL1271/3 and WL1281/3 devices. The device is the 8th-generation WLAN/BT/BLE devices from Texas Instruments. As such, the WL1837 is based upon proven core technology and complements the TI integrated devices for connectivity portfolio. R078 WL1837 / D7020 is ideal for use in mobile phone and mobile computer device applications due to its low current, small area and cellular phone coexistence-friendly features. SAW IT Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 51 2014-12-9 Complementary wireless module WLAN / BT Standard Laminate SiP Module Terms and abbreviations BPF Band-Pass Filter BT Bluetooth FE Front-End refers to FE IC and BPF GND Ground HCI Host Controller Interface IC Integrated Circuit I/O Input/Output interfaces LDO Low Drop-Out voltage regulator PCB Printed Circuit Board Q Quality factor RF Radio Frequency RX Receive SiP System in Package SoC System on Chip TX Transmit Vbat Battery Voltage VIO external pre-existing 1.8V IO power supply WLAN Wireless Local Area Network Reference documents Texas Instruments WL183x_Data_Manual_Rev_1_4.pdf B30931D7020Y918 R078 WL1837 / D7020 SAW IT Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 51 2014-12-9 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 WL1837 / D7020 OVERVIEW FEATURES GENERAL DESCRIPTION TERMS AND REFERENCE DOCUMENTS DISPLAY OF ORDERING CODES FOR EPCOS PRODUCTS SAW IT Please read Cautions and warnings and Important notes at the end of this document. Page 4 of 51 2014-12-9 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 WL1837 / D7020 2 Functional Block Features Functional Block Diagram Figure 2-1 shows a high-level view of R078 WL1837 / D7020 along with its various configurations. The flexibility of the R078 WL1837 / D7020 based on WL1837 enables easy integration with various hostsystem topologies. Figure 2-1 High-Level System Diagram SAW IT Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 51 2014-12-9 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 WL1837 / D7020 WLAN Features Integrated & 5GHz power amplifiers for complete WLAN solution WLAN MAC Baseband Processor and RF transceiver - IEEE802.11a/b/g/n compliant WLAN / 5 GHz SISO 20 / 40 MHz channels , GHz MIMO 20 MHz channels . Baseband Processor IEEE Std 802.11a/b/g data rates and IEEE Std 802.11n data rates with 20 or 40 MHz SISO and 20 MHz MIMO. Fully calibrated system. No production calibration required. Medium-Access Controller MAC Embedded ARM Central Processing Unit CPU Hardware-Based Encryption/Decryption Using 64-, 128-, and 256-Bit WEP, TKIP or AES Keys, Supports requirements for Wi-Fi Protected Access WPA and WPA2.0 and IEEE Std 802.11i [Includes Hardware-Accelerated Advanced-Encryption Standard AES ] Designed to work with IEEE Std 802.1x New advanced co-existence scheme with BT/BLE GHz Radio Internal LNA, PA and RF switch Supports IEEE Std 802.11a, 802.11b, 802.11g and 802.11n Supports 4 bit SDIO host interface, including high speed HS and V3 modes Bluetooth Features Supports Bluetooth BLE Includes concurrent operation and built-in coexistence and prioritization handling of BT, BLE, audio processing and WLAN Dedicated Audio processor supporting on chip SBC encoding + A2DP: Assisted A2DP A3DP support - SBC Encoding implemented internally Assisted WB-Speech AWBS support - modified SBC codec implemented internally BLE Features Fully compliant with BT4.0 BLE dual mode standard Support for all roles and role-combinations, mandatory as well as optional Supports up to 10BLE connection Independent buffering for LE allows having large number of multiple connections without affecting BR/EDR performance SAW IT Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 51 2014-12-9 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 WL1837 / D7020 3 Detailed Description Host Interfaces Device Host Interface Options The following table summarizes the Host Controller interface options. All interfaces operate independently. Table 3-1 Host Controller Interface options Display of ordering codes for EPCOS products The ordering code for one and the same EPCOS product can be represented differently in data sheets, data books, other publications, on the EPCOS website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under SAW IT Please read Cautions and warnings and Important notes at the end of this document. Page 50 of 51 2014-12-9 Important notes The following applies to all products named in this publication: Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health e.g. in accident prevention or life-saving systems , it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer e.g. installation of protective circuitry or redundancy that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. The warnings, cautions and product-specific notes must be observed. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions e.g. because they are classed as hazardous . Useful information on this will be found in our Material Data Sheets on the Internet Should you have any more detailed questions, please contact our sales offices. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the Terms of Delivery for Products and Services in the Electrical Industry‖ published by the German Electrical and Electronics Industry Association ZVEI . The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPlas, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at Page 51 of 51 |
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