EPCDESIGNTOOL_XL-EM Mechanical Die for Electromigration Testing
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EPCDESIGNTOOL_XL-EM (pdf) |
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EPCDESIGNTOOL_XL-EM Mechanical Die for Electromigration Testing EPCDESIGNTOOL_XL-EM are sized equivalent to EPC family of devices EPC2020, EPC2021, EPC2022, EPC2023, EPC2024 with die size mm x mm. These devices have internal metal layers shorted for electromigration reliability testing. Figure 1 Die Photo for EPCDESIGNTOOL_XL-EM Figure 2 Die Outline Solder Bar View A B c d e f g Pad 1 is Gate Pads 2, 5, 6, 9, 10, 13, 14, 17, 18, 21, 22, 25, 26, 29 are Source Pads 3, 4, 7, 8, 11, 12, 15, 16, 19, 20, 23, 24, 27, 28 are Drain Pad 30 is Substrate NOTE Drain and Source are internally shorted at Metal 1 to create a metal resistor Figure 3 Side View MICROMETERS MIN Nominal MAX 6020 6050 6080 2270 2300 2330 2047 2050 2053 Subject to Change without Notice COPYRIGHT 2017 EPCDESIGNTOOL_XL-EM Mechanical Die for Electromigration Testing Figure 4 Recommended Land Pattern units in um Land pattern is solder mask defined Solder mask opening is 180 µm It is recommended to have on-Cu trace PCB vias Pads 1 is Gate Pads 2, 5, 6, 9, 10, 13, 14, 17, 18, 21, 22, 25, 26, 29 are Source Pads 3, 4, 7, 8, 11, 12, 15, 16, 19, 20, 23, 24, 27, 28 are Drain Pad 30 is Substrate Figure 5 Recommended Stencil Pattern units in um Intended for use with SAC305 Type 3 solder. Recommended stencil should be 4mil 100 um thick, must be laser cut, openings per drawing. Additional assembly resources available at epc-co.com/epc/DesignSupport/ AssemblyBasics.aspx Efficient Power Conversion Corporation EPC reserves the right to make changes without further notice to any products herein. EPC does not assume any liability arising out of the application or use of any product or circuit described herein neither does it convey any license under its patent rights, nor the rights of other. is a registered trademark of Efficient Power Conversion Corporation. EPC Patent Listing epc-co.com/epc/AboutEPC/Patents.aspx Subject to Change without Notice COPYRIGHT 2017 |
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