EPCDESIGNTOOL_XL-DC

EPCDESIGNTOOL_XL-DC Datasheet

EPCDESIGNTOOL_XL-DC Mechanical Die for Daisy Chain Testing

Part	Datasheet
EPCDESIGNTOOL_XL-DC	EPCDESIGNTOOL_XL-DC (pdf)

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EPCDESIGNTOOL_XL-DC Mechanical Die for Daisy Chain Testing EPCDESIGNTOOL_XL-DC are sized equivalent to EPC family of devices EPC2020, EPC2021, EPC2022, EPC2023, EPC2024 with die size mm x mm. Daisy chain test devices are suitable for a wide variety of process-related testing, such as life cycle testing, drop testing, thermal testing, and optimizing the assembly process. Daisy-chained packages are wired to provide a continuous path through the package for easy testing as shown in Figure 1 below. Figure 1 Daisy Chain Connections for EPCDESIGNTOOL_XL-DC Subject to Change without Notice COPYRIGHT 2017 EPCDESIGNTOOL_XL-DC Mechanical Die for Daisy Chain Testing Figure 2 Die Outline Solder Bar View Pads 1 is Gate Pads 2, 5, 6, 9, 10, 13, 14, 17, 18, 21, 22, 25, 26, 29 are Source Pads 3, 4, 7, 8, 11, 12, 15, 16, 19, 20, 23, 24, 27, 28 are Drain Pad 30 is Substrate Figure 3 Side View MICROMETERS MIN Nominal MAX 6020 6050 6080 2270 2300 2330 2047 2050 2053 Subject to Change without Notice COPYRIGHT 2017 EPCDESIGNTOOL_XL-DC Mechanical Die for Daisy Chain Testing Figure 4 Recommended Land Pattern units in um When a daisy-chained package is assembled on the PCB, a complete circuit is formed, which allows continuity testing. The circuit includes the solder balls, the metal pattern on the die, the bond wires, and the PCB traces. Land pattern is solder mask defined Solder mask opening is 180 µm It is recommended to have on-Cu trace PCB vias Pads 1 is Gate Pads 2, 5, 6, 9, 10, 13, 14, 17, 18, 21, 22, 25, 26, 29 are Source Pads 3, 4, 7, 8, 11, 12, 15, 16, 19, 20, 23, 24, 27, 28 are Drain Pad 30 is Substrate Figure 5 Recommended Stencil Pattern units in um Intended for use with SAC305 Type 3 solder. Recommended stencil should be 4mil 100 um thick, must be laser cut, openings per drawing. Additional assembly resources available at epc-co.com/epc/DesignSupport/ AssemblyBasics.aspx Efficient Power Conversion Corporation EPC reserves the right to make changes without further notice to any products herein. EPC does not assume any liability arising out of the application or use of any product or circuit described herein neither does it convey any license under its patent rights, nor the rights of other. is a registered trademark of Efficient Power Conversion Corporation. EPC Patent Listing epc-co.com/epc/AboutEPC/Patents.aspx Subject to Change without Notice COPYRIGHT 2017

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EPCDESIGNTOOL_XL-DC Mechanical Die for Daisy Chain Testing

EPCDESIGNTOOL_XL-DC are sized equivalent to EPC family of devices EPC2020, EPC2021, EPC2022, EPC2023, EPC2024 with die size mm x mm. Daisy chain test devices are suitable for a wide variety of process-related testing, such as life cycle testing, drop testing, thermal testing, and optimizing the assembly process. Daisy-chained packages are wired to provide a continuous path through the package for easy testing as shown in Figure 1 below.

Figure 1 Daisy Chain Connections for EPCDESIGNTOOL_XL-DC

Subject to Change without Notice

COPYRIGHT 2017

EPCDESIGNTOOL_XL-DC Mechanical Die for Daisy Chain Testing

Figure 2 Die Outline Solder Bar View

Pads 1 is Gate Pads 2, 5, 6, 9, 10, 13, 14, 17, 18, 21, 22, 25, 26, 29 are Source Pads 3, 4, 7, 8, 11, 12, 15, 16, 19, 20, 23, 24, 27, 28 are Drain Pad 30 is Substrate Figure 3 Side View

MICROMETERS

MIN Nominal MAX
6020 6050 6080
2270 2300 2330
2047 2050 2053

Subject to Change without Notice

COPYRIGHT 2017

EPCDESIGNTOOL_XL-DC Mechanical Die for Daisy Chain Testing

Figure 4 Recommended Land Pattern units in um When a daisy-chained package is assembled on the PCB, a complete circuit is formed, which allows continuity testing. The circuit includes the solder balls, the metal pattern on the die, the bond wires, and the PCB traces.

Land pattern is solder mask defined Solder mask opening is 180 µm It is recommended to have on-Cu trace PCB vias

Pads 1 is Gate Pads 2, 5, 6, 9, 10, 13, 14, 17, 18, 21, 22, 25, 26, 29 are Source Pads 3, 4, 7, 8, 11, 12, 15, 16, 19, 20, 23, 24, 27, 28 are Drain Pad 30 is Substrate

Figure 5 Recommended Stencil Pattern units in um Intended for use with SAC305 Type 3 solder. Recommended stencil should be 4mil 100 um thick, must be laser cut, openings per drawing. Additional assembly resources available at epc-co.com/epc/DesignSupport/ AssemblyBasics.aspx

Efficient Power Conversion Corporation EPC reserves the right to make changes without further notice to any products herein. EPC does not assume any liability arising out of the application or use of any product or circuit described herein neither does it convey any license under its patent rights, nor the rights of other.
is a registered trademark of Efficient Power Conversion Corporation. EPC Patent Listing epc-co.com/epc/AboutEPC/Patents.aspx

Subject to Change without Notice

COPYRIGHT 2017

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived EPCDESIGNTOOL_XL-DC Datasheet file may be downloaded here without warranties.

Datasheet ID: EPCDESIGNTOOL_XL-DC 510930