EPCDESIGNTOOL_MD-EM

EPCDESIGNTOOL_MD-EM Datasheet

EPCDESIGNTOOL_MD-EM Mechanical Die for Electromigration Testing

Part	Datasheet
EPCDESIGNTOOL_MD-EM	EPCDESIGNTOOL_MD-EM (pdf)

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EPCDESIGNTOOL_MD-EM Mechanical Die for Electromigration Testing EPCDESIGNTOOL_MD-EM are sized equivalent to EPC device EPC2016C with die size mm x mm. These devices have internal metal layers shorted for electromigration reliability testing. Figure 1 Die Photo for EPCDESIGNTOOL_MD-EM Figure 2 Die Outline Solder Bar View Pad 1 is Gate Pads 3, 5 are Drain Pads 4, 6 are Source Pad 2 is Substrate NOTE Drain and Source are internally shorted at Metal 1 to create a metal resistor Figure 3 Side View Subject to Change without Notice COPYRIGHT 2017 EPCDESIGNTOOL_MD-EM Mechanical Die for Electromigration Testing Figure 4 Recommended Land Pattern units in um Land pattern is solder mask defined. Solder mask opening is 180 µm. Recommended stencil should be 4mil 100 um thick, must be laser cut, Stencil opening can be per the bump drawing. Pad 1 is Gate Pads 3, 5 are Drain Pads 4, 6 are Source Pad 2 is Substrate Additional assembly resources available at epc-co.com/epc/DesignSupport/ AssemblyBasics.aspx Efficient Power Conversion Corporation EPC reserves the right to make changes without further notice to any products herein. EPC does not assume any liability arising out of the application or use of any product or circuit described herein neither does it convey any license under its patent rights, nor the rights of other. is a registered trademark of Efficient Power Conversion Corporation. EPC Patent Listing epc-co.com/epc/AboutEPC/Patents.aspx Subject to Change without Notice COPYRIGHT 2017

PDF Datasheet Preview

EPCDESIGNTOOL_MD-EM Mechanical Die for Electromigration Testing

EPCDESIGNTOOL_MD-EM are sized equivalent to EPC device EPC2016C with die size mm x mm. These devices have internal metal layers shorted for electromigration reliability testing. Figure 1 Die Photo for EPCDESIGNTOOL_MD-EM

Figure 2 Die Outline Solder Bar View

Pad 1 is Gate Pads 3, 5 are Drain Pads 4, 6 are Source Pad 2 is Substrate NOTE Drain and Source are internally shorted at Metal 1 to create a metal resistor

Figure 3 Side View

Subject to Change without Notice

COPYRIGHT 2017

EPCDESIGNTOOL_MD-EM Mechanical Die for Electromigration Testing

Figure 4 Recommended Land Pattern units in um Land pattern is solder mask defined. Solder mask opening is 180 µm. Recommended stencil should be 4mil 100 um thick, must be laser cut, Stencil opening can be per the bump drawing.

Pad 1 is Gate Pads 3, 5 are Drain Pads 4, 6 are Source Pad 2 is Substrate Additional assembly resources available at epc-co.com/epc/DesignSupport/ AssemblyBasics.aspx

Efficient Power Conversion Corporation EPC reserves the right to make changes without further notice to any products herein. EPC does not assume any liability arising out of the application or use of any product or circuit described herein neither does it convey any license under its patent rights, nor the rights of other.
is a registered trademark of Efficient Power Conversion Corporation. EPC Patent Listing epc-co.com/epc/AboutEPC/Patents.aspx

Subject to Change without Notice

COPYRIGHT 2017

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived EPCDESIGNTOOL_MD-EM Datasheet file may be downloaded here without warranties.

Datasheet ID: EPCDESIGNTOOL_MD-EM 510927