EPCDESIGNTOOL_LG-EM Mechanical Die for Electromigration Testing
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EPCDESIGNTOOL_LG-EM (pdf) |
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EPCDESIGNTOOL_LG-EM Mechanical Die for Electromigration Testing EPCDESIGNTOOL_LG-EM are sized equivalent to EPC device EPC2001C with die size mm x mm. These devices have internal metal layers shorted for electromigration reliability testing. Figure 1 Die Photo for EPCDESIGNTOOL_LG-EM Figure 2 Die Outline Solder Bar View Pad 1 is Gate Pads 3, 5, 7, 9, 11 are Drain Pads 4, 6, 8, 10 are Source Pad 2 is Substrate NOTE Drain and Source are internally shorted at Metal 1 to create a metal resistor Figure 3 Side View Subject to Change without Notice COPYRIGHT 2017 EPCDESIGNTOOL_LG-EM Mechanical Die for Electromigration Testing Figure 4 Recommended Land Pattern units in um Land pattern is solder mask defined. Solder mask opening is 180 µm. Recommended stencil should be 4mil 100 um thick, must be laser cut, Stencil opening can be per the bump drawing. Pad 1 is Gate Pads 3, 5, 7, 9, 11 are Drain Pads 4, 6, 8, 10 are Source Pad 2 is Substrate Additional assembly resources available at epc-co.com/epc/DesignSupport/ AssemblyBasics.aspx Efficient Power Conversion Corporation EPC reserves the right to make changes without further notice to any products herein. EPC does not assume any liability arising out of the application or use of any product or circuit described herein neither does it convey any license under its patent rights, nor the rights of other. is a registered trademark of Efficient Power Conversion Corporation. EPC Patent Listing epc-co.com/epc/AboutEPC/Patents.aspx Subject to Change without Notice COPYRIGHT 2017 |
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