IMT4-7-F

IMT4-7-F Datasheet

IMT4

Part	Datasheet
IMT4-7-F	IMT4-7-F (pdf)

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OBSOLETE PART DISCONTINUED PART OBSOLETE USE DMMT5401 IMT4 DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR • Epitaxial Planar Die Construction • Complementary NPN Type Available IMX8 • Small Surface Mount Package • Lead Free/RoHS Compliant Note 3 • "Green" Device, Note 4 and 5 Mechanical Data • Case SOT-26 • Case Material Molded Plastic, "Green" Molding Compound, Note UL Flammability Classification Rating 94V-0 • Moisture Sensitivity Level 1 per J-STD-020C • Terminal Connections See Diagram • Terminals Solderable per MIL-STD-202, Method 208 • Lead Free Plating Matte Tin Finish annealed over Copper leadframe . • Marking Information KX7 - See Page 3 • Ordering & Date Code Information See Page 3 • Weight grams approximate SOT-26 Dim Min Max Typ A B C D F H J K L M α 0° 8° All Dimensions in mm Maximum Ratings = 25°C unless otherwise specified Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous Power Dissipation Note 1 Thermal Resistance, Junction to Ambient Note 1 Operating and Storage Temperature Range Symbol VCBO VCEO VEBO IC Pd Tj, TSTG Value -120 -120 -50 225 555 -55 to +150 Unit V mA mW °C/W Electrical Characteristics = 25°C unless otherwise specified Characteristic OFF CHARACTERISTICS Note 2 Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current ON CHARACTERISTICS Note 2 DC Current Gain Collector-Emitter Saturation Voltage SMALL SIGNAL CHARACTERISTICS Current Gain-Bandwidth Product Symbol Min Typ Max Unit Test Condition V BR CBO -120 V IC = -50uA V BR CEO -120 V IC = -1.0mA V BR EBO V IE = -50uA ICBO uA VCB = -100V IEBO uA VEB = -4.0V 180 820 IC = -2.0mA, VCE = -6.0V VCE SAT V IC = -10mA, IB = -1.0mA VCE = -12V, IC = -2.0mA, f = 100MHz Device mounted on FR-5 PCB x inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our website at 200mW per element must not be exceeded. Short duration pulse test used to minimize self-heating effect. No purposefully added lead. Diodes Inc.'s "Green" policy can be found on our website at Product manufactured with Date Code 0627 week 27, 2006 and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 1 of 3 IMT4 Diodes Incorporated Pd, POWER DISSIPATION mW OBSOLETE PART DISCONTINUED IC, COLLECTOR CURRENT mA PART OBSOLETE USE DMMT5401 Ordering Information Note 5 & 6 Device IMT4-7-F Packaging SOT-26 For packaging details, go to our website at Marking Information Shipping 3000/Tape & Reel Date Code Key Year Code Month Code KX7 = Product Type Marking Code YM = Date Code Marking Y =Year ex T = 2006 M = Month ex 9 = September YM = Date Code Marking 2002 N Jan 1 2003 P Feb 2 2004 R 2005 S 2006 T 2007 U 2008 V 2009 W 2010 X 2011 Y Nov N 2012 Z Dec D IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. 3 of 3 IMT4 Diodes Incorporated

PDF Datasheet Preview

OBSOLETE PART DISCONTINUED

PART OBSOLETE USE DMMT5401

IMT4

DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
• Epitaxial Planar Die Construction
• Complementary NPN Type Available IMX8
• Small Surface Mount Package
• Lead Free/RoHS Compliant Note 3
• "Green" Device, Note 4 and 5

Mechanical Data
• Case SOT-26
• Case Material Molded Plastic, "Green" Molding
Compound, Note UL Flammability Classification Rating 94V-0
• Moisture Sensitivity Level 1 per J-STD-020C
• Terminal Connections See Diagram
• Terminals Solderable per MIL-STD-202, Method 208
• Lead Free Plating Matte Tin Finish annealed over Copper leadframe .
• Marking Information KX7 - See Page 3
• Ordering & Date Code Information See Page 3
• Weight grams approximate

SOT-26 Dim Min Max Typ

A B C D F H

J K L M α 0° 8° All Dimensions in mm

Maximum Ratings = 25°C unless otherwise specified

Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous Power Dissipation Note 1 Thermal Resistance, Junction to Ambient Note 1 Operating and Storage Temperature Range

Symbol VCBO VCEO VEBO IC Pd

Tj, TSTG

Value -120 -120 -50 225 555
-55 to +150

Unit V mA
mW °C/W

Electrical Characteristics = 25°C unless otherwise specified

Characteristic OFF CHARACTERISTICS Note 2 Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current ON CHARACTERISTICS Note 2 DC Current Gain Collector-Emitter Saturation Voltage SMALL SIGNAL CHARACTERISTICS

Current Gain-Bandwidth Product

Symbol Min Typ Max Unit

Test Condition

V BR CBO -120

V IC = -50uA

V BR CEO -120

V IC = -1.0mA

V BR EBO

V IE = -50uA

ICBO
uA VCB = -100V

IEBO
uA VEB = -4.0V
180 820 IC = -2.0mA, VCE = -6.0V

VCE SAT

V IC = -10mA, IB = -1.0mA

VCE = -12V, IC = -2.0mA, f = 100MHz

Device mounted on FR-5 PCB x inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our website at 200mW per element must not be exceeded.

Short duration pulse test used to minimize self-heating effect. No purposefully added lead. Diodes Inc.'s "Green" policy can be found on our website at Product manufactured with Date Code 0627 week 27, 2006 and newer are built with Green Molding Compound. Product manufactured prior to Date

Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
1 of 3

IMT4

Diodes Incorporated

Pd, POWER DISSIPATION mW

OBSOLETE PART DISCONTINUED

IC, COLLECTOR CURRENT mA

PART OBSOLETE USE DMMT5401
Ordering Information Note 5 & 6

Device IMT4-7-F

Packaging SOT-26

For packaging details, go to our website at

Marking Information

Shipping 3000/Tape & Reel

Date Code Key Year Code

Month Code

KX7 = Product Type Marking Code YM = Date Code Marking Y =Year ex T = 2006 M = Month ex 9 = September YM = Date Code Marking
2002 N

Jan 1
2003 P

Feb 2
2004 R
2005 S
2006 T
2007 U
2008 V
2009 W
2010 X
2011 Y

Nov N
2012 Z

Dec D

IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.

LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.
3 of 3

IMT4

Diodes Incorporated

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived IMT4-7-F Datasheet file may be downloaded here without warranties.

Datasheet ID: IMT4-7-F 509970