S72XS256RE0AHBH10

S72XS256RE0AHBH10 Datasheet

S72XS-R MCP

Part	Datasheet
S72XS256RE0AHBH10	S72XS256RE0AHBH10 (pdf)

PDF Datasheet Preview
S72XS-R MCP 256 Mb 16M x 16 bit , 1.8V Flash and DDR DRAM • Power supply voltage 1.7V to 1.95V • Burst speed Flash = 83 MHz, 104 MHz or 108 MHz DDR DRAM = 166 MHz • Packages mm, 133-ball MCP • Temperature range Wireless °C to +85 °C Industrial °C to +85 °C Table Memory Density Flash Density 256 Mb This datasheet contains information on the S72XS-R Multi-Chip Product MCP stacked products. Refer to the S29VS256R, S29VS128R, S29XS256R, S29XS128R datasheet 002-00833 for full electrical specifications of the Flash memory component. The S72XS series is a product line of stacked products MCPs , and consists of • S29XS family Address-High, Address-Low, Data Multiplexed Flash memory die • DDR DRAM Table 1 and Table 2 lists the products covered in this datasheet. DRAM Density S72XS256RE0 Table DDR DRAM Specification Reference Density 256 Mb Reference Name 256 Mb 16M 16-bit DDR DRAM Document Identification Number SDM256D166D1R/D3R Block Diagram F-RS T# F-V P F-CE # F-OE # F-W E # F-A V D# RST# CE# O E# W E# A V D# A DQ15-A DQ0 A max-A 16 No Connect FLASH XS-R AADM V CC V CCQ V SSQ A DQ15-A DQ0 F -C L K F -R D Y F-V CC F-V CCQ VSS D-RA S # D-CA S # D-B A 0 D-B A 1 D-CK E D-W E # D-CE # D-A m ax - D-A 0 D-V CC D-V CCQ RA S# CA S# BA 0 BA 1 CKE W E# CS# A max-A 0 V DD V DDQ DDR DRAM MEMORY CK# LDQS UDQS LDM UDM DQ15-DQ0 V SS V SSQ D-CLK D-CLK # D -LD Q S D -U D Q S D -LD Q M D -U D Q M D-DQ15 - D-DQ0 VSS Notes Amax indicates highest address bit for memory component Amax = A12 for 256 Mb DDR DRAM. For Flash, A15 - A0 is tied to DQ15 - DQ0. • San Jose, CA 95134-1709 • 408-943-2600 S72XS-R MCP Ordering Information The order number Valid Combination is formed by the following: S72XS 256 R E0 AH 3 Packing Type 0 = Tray 3 = 13-inch Tape and Reel Model Number See Valid Combinations Table 5 Package Modifier B = 133-ball, 8x8 mm, FBGA MCP Package and Material Type AH = Thin profile Fine-pitch BGA Pb-free Low-Halogen MCP mm pitch DDR DRAM and Data Flash Density E0 = 256 Mb DDR, No Data Flash Process Technology R = 65 nm, MirrorBit Technology Code Flash Density 256 = 256 Mb Product Family S72XS Multi-Chip Product MCP 1.8V Address-High, Address-Low, Data Multiplexed, SRW, Burst Mode Flash and DDR DRAM on Split Bus Valid Combinations Valid combinations in Table 5 list the configurations planned to be supported in volume for this device. Contact your local sales office to confirm the availability of specific valid combinations and to check on newly released combinations. Table Valid Combinations Base OPN[4] S72XS256RE0 Package Model Packing Flash Number Type[3, 4] Boot Bottom Bottom Bottom Temperature Range Wireless Industrial Electronic Serial Number Flash Density DDR DRAM Density Flash Speed MHz 256 Mb 256 Mb 108 DRAM Speed MHz DRAM Specification SDM256D166 D1R SDM256D166 D3R Package mm 133-ball MCP RSC133 Electronic Serial Number For applicable devices, the Factory Secured Silicon Area contains a random, 128-bit ESN, stored in the address range Notes Packing Type 0 is standard. Specify other options as required. BGA package marking omits leading “S” and packing type designator from ordering part number. Page 4 of 7 S72XS-R MCP Package Diagram Figure RSC133 Fine-Pitch Ball Grid Array FBGA mm Page 5 of 7 S72XS-R MCP Document History Page Document Title S72XS-R MCP, 256 Mb 16M x 16 bit , 1.8V Flash and DDR DRAM Document Number 002-00772 ** *A Orig. of Change BWHA BWHA Submission Date Description of Change 10/07/2008 Initial release 01/13/2009 Global Added section Electronic Serial Number Global Added SDM128D166D1K OPN BWHA 12/18/2009 Product Block Diagram Figure Updated D-VSS and D-VSSQ connections. Removed D-TEST signal Physical Dimensions Updated with RSC133 BWHA 02/01/2010 Connection Diagrams Updated figure changed Ball A2 with DNU Global Updated references for Low Power DDR SDRAM to SDM128D166D1R DDR Specification Reference Added reference for 256 Mb DDR DRAM Product Selector Guide: Added “not recommended for new designs” note to OPN S72XS128RD0AHBH60 Added OPN S72XS256RE0AHBH1 Removed OPN S72XS256RD0AHBHE Product Block Diagram Updated block diagram to show common Ground. Updated Note 1b. BWHA Connection Diagrams 08/19/2010 Updated connection diagram to show common Ground Updated to show D-A12 Added table to show D-Amax value for related MCP Balls F1, M2 and M12 changed from NC to RFU Input/Output Descriptions Replaced F-VSS, D-VSS, D-VSSQ with VSS Corrected F-ACC to F-VPP Refreshed descriptions for DNU, NC, RFU Ordering Information/Valid Combinations Updated for new OPN S72XS256RE0AHBH1 BWHA 12/10/2010 Global Updated 256 Mb DRAM specification reference BWHA Global 03/17/2011 Removed SDM128D166D1K references Removed OPN S72XS128RD0AHBH60, Added OPN S72XS256RE0AHBJ1 Ordering Information Replaced Product Selector Guide section BWHA 10/05/2011 Valid Combinations Made a separate section Added OPNs S72XS128RD0AHBHD, S72XS256RE0AHBHH/JH BWHA 04/17/2012 Ordering Information Added ESN support for S72XS256RE0AHBH1 4960467 BWHA 10/13/2015 Updated to new template. 5181007 03/18/2016 Removed S72XS128RD0 as it is EOL’d. Page 6 of 7 S72XS-R MCP Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products Microcontrollers Automotive Clocks & Buffers Interface Lighting & Power Control Memory PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/arm cypress.com/automotive cypress.com/clocks cypress.com/interface cypress.com/powerpsoc cypress.com/memory cypress.com/psoc cypress.com/touch cypress.com/usb cypress.com/wireless Solutions cypress.com/psoc 1 \| PSoC 3 \| PSoC 4 \| PSoC 5LP Cypress Developer Community \| Forums \| Blogs \| Video \| Training Technical Support cypress.com/support Cypress Semiconductor Corporation This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC "Cypress" . This document, including any software or firmware included or referenced in this document "Software" , is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you under its copyright rights in the Software, a personal, non-exclusive, nontransferable license without the right to sublicense a for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and b to distribute the Software in binary code form externally to end users either directly or indirectly through resellers and distributors , solely for use on Cypress hardware product units. Cypress also grants you a personal, non-exclusive, nontransferable, license without the right to sublicense under those claims of Cypress's patents that are infringed by the Software as provided by Cypress, unmodified to make, use, distribute, and import the Software solely to the minimum extent that is necessary for you to exercise your rights under the copyright license granted in the previous sentence. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited. CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems including resuscitation equipment and surgical implants , pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage "Unintended Uses" . A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and Company shall and hereby does release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. Company shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. PSoC Designer is a trademark and are registered trademarks of Cypress Semiconductor Corporation. Page 7 of 7 Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors.

PDF Datasheet Preview

S72XS-R MCP
256 Mb 16M x 16 bit , 1.8V Flash and DDR DRAM
• Power supply voltage 1.7V to 1.95V
• Burst speed Flash = 83 MHz, 104 MHz or 108 MHz DDR DRAM = 166 MHz
• Packages mm, 133-ball MCP
• Temperature range Wireless °C to +85 °C Industrial °C to +85 °C

Table Memory Density

Flash Density 256 Mb

This datasheet contains information on the S72XS-R Multi-Chip Product MCP stacked products. Refer to the S29VS256R, S29VS128R, S29XS256R, S29XS128R datasheet 002-00833 for full electrical specifications of the Flash memory component. The S72XS series is a product line of stacked products MCPs , and consists of
• S29XS family Address-High, Address-Low, Data Multiplexed

Flash memory die
• DDR DRAM Table 1 and Table 2 lists the products covered in this datasheet.

DRAM Density S72XS256RE0

Table DDR DRAM Specification Reference

Density 256 Mb

Reference Name 256 Mb 16M 16-bit DDR DRAM

Document Identification Number SDM256D166D1R/D3R

Block Diagram

F-RS T#

F-V P

F-CE # F-OE # F-W E # F-A V D#

RST#

CE# O E# W E# A V D#

A DQ15-A DQ0

A max-A 16 No Connect

FLASH

XS-R

AADM V CC

V CCQ

V SSQ

A DQ15-A DQ0 F -C L K F -R D Y

F-V CC F-V CCQ VSS

D-RA S # D-CA S # D-B A 0 D-B A 1 D-CK E D-W E # D-CE # D-A m ax - D-A 0 D-V CC D-V CCQ

RA S# CA S# BA 0 BA 1 CKE W E# CS# A max-A 0 V DD V DDQ

DDR DRAM MEMORY

CK# LDQS UDQS LDM UDM

DQ15-DQ0 V SS

V SSQ

D-CLK D-CLK # D -LD Q S D -U D Q S D -LD Q M D -U D Q M

D-DQ15 - D-DQ0 VSS

Notes Amax indicates highest address bit for memory component Amax = A12 for 256 Mb DDR DRAM. For Flash, A15 - A0 is tied to DQ15 - DQ0.
• San Jose, CA 95134-1709
• 408-943-2600

S72XS-R MCP
Ordering Information

The order number Valid Combination is formed by the following:

S72XS
256 R E0 AH
3 Packing Type 0 = Tray 3 = 13-inch Tape and Reel

Model Number See Valid Combinations Table 5

Package Modifier B = 133-ball, 8x8 mm, FBGA MCP

Package and Material Type AH = Thin profile Fine-pitch BGA Pb-free Low-Halogen MCP mm pitch

DDR DRAM and Data Flash Density E0 = 256 Mb DDR, No Data Flash

Process Technology R = 65 nm, MirrorBit Technology

Code Flash Density 256 = 256 Mb

Product Family

S72XS Multi-Chip Product MCP 1.8V Address-High, Address-Low, Data Multiplexed, SRW, Burst Mode Flash and DDR DRAM on Split Bus

Valid Combinations Valid combinations in Table 5 list the configurations planned to be supported in volume for this device. Contact your local sales office to confirm the availability of specific valid combinations and to check on newly released combinations.

Table Valid Combinations

Base OPN[4] S72XS256RE0

Package

Model Packing Flash Number Type[3, 4] Boot

Bottom

Bottom

Bottom

Temperature Range Wireless

Industrial

Electronic Serial

Number

Flash Density

DDR DRAM Density

Flash Speed MHz
256 Mb 256 Mb 108

DRAM Speed MHz

DRAM Specification SDM256D166 D1R

SDM256D166 D3R

Package
mm 133-ball MCP

RSC133

Electronic Serial Number

For applicable devices, the Factory Secured Silicon Area contains a random, 128-bit ESN, stored in the address range
Notes Packing Type 0 is standard. Specify other options as required. BGA package marking omits leading “S” and packing type designator from ordering part number.

Page 4 of 7

S72XS-R MCP

Package Diagram Figure RSC133 Fine-Pitch Ball Grid Array FBGA mm

Page 5 of 7

S72XS-R MCP

Document History Page

Document Title S72XS-R MCP, 256 Mb 16M x 16 bit , 1.8V Flash and DDR DRAM Document Number 002-00772
** *A

Orig. of Change

BWHA

BWHA

Submission Date

Description of Change
10/07/2008 Initial release
01/13/2009 Global Added section Electronic Serial Number

Global Added SDM128D166D1K OPN

BWHA
12/18/2009

Product Block Diagram Figure Updated D-VSS and D-VSSQ connections. Removed D-TEST signal

Physical Dimensions Updated with RSC133

BWHA 02/01/2010 Connection Diagrams Updated figure changed Ball A2 with DNU

Global Updated references for Low Power DDR SDRAM to SDM128D166D1R

DDR Specification Reference Added reference for 256 Mb DDR DRAM

Product Selector Guide:

Added “not recommended for new designs” note to OPN S72XS128RD0AHBH60

Added OPN S72XS256RE0AHBH1

Removed OPN S72XS256RD0AHBHE

Product Block Diagram Updated block diagram to show common Ground. Updated Note 1b.

BWHA

Connection Diagrams 08/19/2010 Updated connection diagram to show common Ground

Updated to show D-A12

Added table to show D-Amax value for related MCP
Balls F1, M2 and M12 changed from NC to RFU Input/Output Descriptions Replaced F-VSS, D-VSS, D-VSSQ with VSS Corrected F-ACC to F-VPP Refreshed descriptions for DNU, NC, RFU Ordering Information/Valid Combinations Updated for new OPN S72XS256RE0AHBH1

BWHA 12/10/2010 Global Updated 256 Mb DRAM specification reference

BWHA

Global 03/17/2011 Removed SDM128D166D1K references

Removed OPN S72XS128RD0AHBH60, Added OPN S72XS256RE0AHBJ1
Ordering Information Replaced Product Selector Guide section

BWHA
10/05/2011

Valid Combinations Made a separate section

Added OPNs S72XS128RD0AHBHD, S72XS256RE0AHBHH/JH
BWHA 04/17/2012 Ordering Information Added ESN support for S72XS256RE0AHBH1
4960467 BWHA 10/13/2015 Updated to new template.
5181007
03/18/2016 Removed S72XS128RD0 as it is EOL’d.

Page 6 of 7

S72XS-R MCP

Sales, Solutions, and Legal Information

Worldwide Sales and Design Support

Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations.

Products Microcontrollers Automotive Clocks & Buffers Interface Lighting & Power Control Memory PSoC Touch Sensing USB Controllers Wireless/RF
cypress.com/arm cypress.com/automotive
cypress.com/clocks cypress.com/interface cypress.com/powerpsoc cypress.com/memory
cypress.com/psoc cypress.com/touch
cypress.com/usb cypress.com/wireless

Solutions cypress.com/psoc 1 | PSoC 3 | PSoC 4 | PSoC 5LP

Cypress Developer Community | Forums | Blogs | Video | Training

Technical Support cypress.com/support

Cypress Semiconductor Corporation This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC "Cypress" . This document, including any software or firmware included or referenced in this document "Software" , is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you under its copyright rights in the Software, a personal, non-exclusive, nontransferable license without the right to sublicense a for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and b to distribute the Software in binary code form externally to end users either directly or indirectly through resellers and distributors , solely for use on Cypress hardware product units. Cypress also grants you a personal, non-exclusive, nontransferable, license without the right to sublicense under those claims of Cypress's patents that are infringed by the Software as provided by Cypress, unmodified to make, use, distribute, and import the Software solely to the minimum extent that is necessary for you to exercise your rights under the copyright license granted in the previous sentence. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited.

CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems including resuscitation equipment and surgical implants , pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage "Unintended Uses" . A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and Company shall and hereby does release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. Company shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.

Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.

PSoC Designer is a trademark and are registered trademarks of Cypress Semiconductor Corporation.

Page 7 of 7

Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived S72XS256RE0AHBH10 Datasheet file may be downloaded here without warranties.

Datasheet ID: S72XS256RE0AHBH10 508324