CY7C1352F-133AC

CY7C1352F-133AC Datasheet


CY7C1352F

Part Datasheet
CY7C1352F-133AC CY7C1352F-133AC CY7C1352F-133AC (pdf)
Related Parts Information
CY7C1352F-100AC CY7C1352F-100AC CY7C1352F-100AC
PDF Datasheet Preview
CY7C1352F
4-Mbit 256Kx18 Pipelined SRAM with NoBL Architecture

Functional Description[1]
• Pin compatible and functionally equivalent to ZBT devices
• Internally self-timed output buffer control to eliminate the need to use OE
• Byte Write capability
• 256K x 18 common I/O architecture
• Single 3.3V power supply
• 2.5V / 3.3V I/O Operation
• Fast clock-to-output times
ns for 250-MHz device ns for 225-MHz device ns for 200-MHz device ns for 166-MHz device ns for 133-MHz device ns for 100-MHz device
• Clock Enable CEN pin to suspend operation
• Synchronous self-timed writes
• Asynchronous output enable OE
• JEDEC-standard 100 TQFP package
• Burst or interleaved burst order
• “ZZ” Sleep Mode Option and Stop Clock option

Logic Block Diagram

The CY7C1352F is a 3.3V, 256K x 18 synchronous-pipelined Burst SRAM designed specifically to support unlimited true back-to-back Read/Write operations without the insertion of wait states. The CY7C1352F is equipped with the advanced No Bus Latency NoBL logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of the SRAM, especially in systems that require frequent Write/Read transitions.

All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable CEN signal, which, when deasserted, suspends operation and extends the previous clock cycle. Maximum access delay from the clock rise is ns 200-MHz device

Write operations are controlled by the two Byte Write Select BW[A:B] and a Write Enable WE input. All writes are conducted with on-chip synchronous self-timed write circuitry.

Three synchronous Chip Enables CE1, CE2, CE3 and an asynchronous Output Enable OE provide for easy bank selection and output three-state control. In order to avoid bus contention, the output drivers are synchronously three-stated during the data portion of a write sequence.

CLK CEN

A0, A1, A

MODE C

ADDRESS REGISTER 0

WRITE ADDRESS REGISTER 1

A1 D1

Q1 A1'

A0 D0 BURST Q0 A0'

LOGIC

ADV/LD

WRITE ADDRESS REGISTER 2

ADV/LD BWA BWB

WRITE REGISTRY AND DATA COHERENCY

CONTROL LOGIC

WRITE DRIVERS

MEMORY

ARRAY A

R E G I S T E

INPUT REGISTER 1 E

INPUT REGISTER 0 E

DQs DQPA DQPB

OE CE1 CE2 CE3

READ LOGIC

Sleep Control

Note For recommendations, please refer to the Cypress application note System Design Guidelines on

Cypress Semiconductor Corporation
• 3901 North First Street
• San Jose, CA 95134
• 408-943-2600

CY7C1352F

Selection Guide
250 MHz 225 MHz 200 MHz 166 MHz 133 MHz
Ordering Information

Speed MHz
Ordering Code

Package Name

Package Type

Operating Range
250 CY7C1352F-250AC

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Commercial

CY7C1352F-250AI

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Industrial
225 CY7C1352F-225AC

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Commercial

CY7C1352F-225AI

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Industrial
200 CY7C1352F-200AC

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Commercial

CY7C1352F-200AI

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Industrial
166 CY7C1352F-166AC

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Commercial

CY7C1352F-166AI

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Industrial
133 CY7C1352F-133AC

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Commercial

CY7C1352F-133AI

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Industrial
100 CY7C1352F-100AC

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Commercial

CY7C1352F-100AI

A101 100-Lead Thin Quad Flat Pack 14 x 20 x 1.4mm Industrial
Shaded areas contain advance information. Please contact your local cypress sales representative to order parts that are not listed in the ordering information table.

Package Diagram
100-Pin Thin Plastic Quad Flatpack 14 x 20 x mm A101
51-85050-*A 51-85050-*A

ZBT is a trademark of Integrated Device Technology. NoBL and No Bus Latency are trademarks of Cypress Semiconductor. All product and company names mentioned in this document are trademarks of their respective holders.

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Cypress Semiconductor Corporation, The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

CY7C1352F

Document History Page

Orig. of ECN NO. Issue Date Change

Description of Change
119826 12/16/02 HGK New Data Sheet
123116 01/18/03

RBI Added power-up requirements to AC test loads and waveforms information
200662 See ECN SWI Final Data Sheet
225487 See ECN VBL Update Ordering Info section unshade active part numbers.

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More datasheets: APX803-44SAG-7 | APX803-31SAG-7 | APX803-40SAG-7 | APX803-29SRG-7 | APX803-23SRG-7 | APX803D-29SRG-7 | APX803-23SAG-7 | APX803-26SRG-7 | APX803-29SAG-7 | CY7C1352F-100AC


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Datasheet ID: CY7C1352F-133AC 507979