HSP-7

HSP-7 Datasheet

HSP-7

Part	Datasheet
HSP-7	HSP-7 (pdf)

PDF Datasheet Preview
DataSAhcceessoeriets HSP-7 • Thermal Pad suitable for NOVA22 Panel Mount SSRs • Easy to use thermal interface material • Excellent alternative to thermal grease TYPICAL PROPERTIES Material Color Thickness [inch mm ] Adhesive Thermal Impedance 1 Thermal Conductivity [W/m-K] 1 Flame Rating Continuous Temperature Range [°C] Volume Resistivity [Ohm-cm] Parameters Chomerics T725 Pink 25 psi V0 -55 to 125 > MOUNTING SURFACE PREPARATION The mounting surface, usually the heat sink, should be clean and free from machining oils and aluminum dust, and may be cleaned with any common solvent, such as isopropyl alcohol IPA if necessary. The surface of the heat sink may be anodized, chromate coated or aluminum. INSTALLATION OF HSP-7 PADS HSP-7 material does not require pre-heating of the heat sink prior to installing the HSP-7 pad onto the heat sink, because of the phase change nature of the HSP-7 material, please follow the process temperature/pressure guidelines below to ensure the best results for a assembly process: Temperature/Pressure Process Step Recommended Range Removing pad from clear carrier liner Installing pad onto “cold” heat sink Installing pad onto “warm” heat sink Removing protective blue release liner Temp. of Roll less than 38°C 100°F Heat Sink Temp 16°C to 38°C 60°F to 100°F Roll Temp 21°C to 38°C 70°F to 100°F Installation Pressure 25 to 50 psi 2 Heat Sink Temp 24°C to 38°C 75°F to 100°F Roll Temp 21°C to 38°C 70°F to 100°F Installation Pressure 25 to 50 psi 2 Temp of Heat Sink/Pad Assembly Less than 38°C 100°F When removing the pull-tab, use a quick, lifting motion. This is preferable over peeling the pull-tab from the HSP-7 pad and heat sink. To ensure optimal “wetting” of the HSP-7 pad to the heat sink. It is recommended that the parts be allowed to dwell one hour prior to attempting release liner removal. Do not forget to visit us at: Copyright 2015 Crydom Inc. Specifications subject to change without notice. MECHANICAL SPECIFICATIONS Tolerances in / mm All dimensions are in inches [Millimeters] DataSAhcceessoeriets [17] GENERAL NOTES 1 This value is provided for reference only. Follow installation instructions for accurate thermal performance. 2 Apply pressure to the HSP-7 pad with a soft “press-pad” for 2 to 3 seconds. Do not forget to visit us at: Copyright 2015 Crydom Inc. Specifications subject to change without notice. DataSAhcceessoeriets ANNEX - ENVIROMENTAL INFORMATION The environmental information disclosed in this annex including the EIP Pollution logo are in compliance with People’s Republic of China Electronic Industry Standard SJ/T11364 2006, Marking for Control of Pollution Caused by Electronic Information Products. Part Name Toxic or hazardous Substance and Elements Lead Mercury Cadmium Hexavalent Chromium Cr VI Semiconductor die Solder Polybrominated biphenyls PBB Polybrominated diphenyl ethers PBDE Cr VI

PDF Datasheet Preview

DataSAhcceessoeriets

HSP-7
• Thermal Pad suitable for NOVA22 Panel Mount SSRs
• Easy to use thermal interface material
• Excellent alternative to thermal grease

TYPICAL PROPERTIES

Material Color Thickness [inch mm ] Adhesive Thermal Impedance 1 Thermal Conductivity [W/m-K] 1 Flame Rating Continuous Temperature Range [°C] Volume Resistivity [Ohm-cm]

Parameters

Chomerics T725 Pink
25 psi V0
-55 to 125 >

MOUNTING SURFACE PREPARATION

The mounting surface, usually the heat sink, should be clean and free from machining oils and aluminum dust, and may be cleaned with any common solvent, such as isopropyl alcohol IPA if necessary. The surface of the heat sink may be anodized, chromate coated or aluminum.

INSTALLATION OF HSP-7 PADS

HSP-7 material does not require pre-heating of the heat sink prior to installing the HSP-7 pad onto the heat sink, because of the phase change nature of the HSP-7 material, please follow the process temperature/pressure guidelines below to ensure the best results for a assembly process:

Temperature/Pressure

Process Step

Recommended Range

Removing pad from clear carrier liner Installing pad onto “cold” heat sink

Installing pad onto “warm” heat sink Removing protective blue release liner

Temp. of Roll less than 38°C 100°F Heat Sink Temp 16°C to 38°C 60°F to 100°F Roll Temp 21°C to 38°C 70°F to 100°F Installation Pressure 25 to 50 psi 2 Heat Sink Temp 24°C to 38°C 75°F to 100°F Roll Temp 21°C to 38°C 70°F to 100°F Installation Pressure 25 to 50 psi 2 Temp of Heat Sink/Pad Assembly Less than 38°C 100°F

When removing the pull-tab, use a quick, lifting motion. This is preferable over peeling the pull-tab from the HSP-7 pad and heat sink. To ensure optimal “wetting” of the HSP-7 pad to the heat sink. It is recommended that the parts be allowed to dwell one hour prior to attempting release liner removal.

Do not forget to visit us at:

Copyright 2015 Crydom Inc. Specifications subject to change without notice.

MECHANICAL SPECIFICATIONS

Tolerances in / mm All dimensions are in inches [Millimeters]

DataSAhcceessoeriets
[17]

GENERAL NOTES
1 This value is provided for reference only. Follow installation instructions for accurate thermal performance. 2 Apply pressure to the HSP-7 pad with a soft “press-pad” for 2 to 3 seconds.

Do not forget to visit us at:

Copyright 2015 Crydom Inc. Specifications subject to change without notice.

DataSAhcceessoeriets

ANNEX - ENVIROMENTAL INFORMATION

The environmental information disclosed in this annex including the EIP Pollution logo are in compliance with People’s Republic of China Electronic Industry Standard SJ/T11364 2006, Marking for Control of Pollution Caused by Electronic Information Products.

Part Name

Toxic or hazardous Substance and Elements

Lead Mercury Cadmium

Hexavalent Chromium Cr VI

Semiconductor die Solder

Polybrominated biphenyls PBB

Polybrominated diphenyl ethers PBDE

Cr VI

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived HSP-7 Datasheet file may be downloaded here without warranties.

Datasheet ID: HSP-7 507241