834000T00000
834000T00000 Datasheet
| Part | Datasheet |
|---|---|
834000T00000 |
834000T00000 (pdf) |
| PDF Datasheet Preview |
|---|
| Board Level Heat Sinks P/N & Temp Rise Above Ambient - oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient D2 PAK, TO-263 PRODUCT SPECIFICATIONS • Devices D2 PAK, TO-263 • Size x mm • Material Copper, mm Thick • Type Stamped • PCB Mounting Surface Mount Technology • Finish Tin Plate • Package Bulk or Tape & Reel • No Hardware Device Attachment • Direct SMT Contact to PCB • Solderable Legs • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Body Configurations • Contact Applications Engineering 0 100 60 40 Air Velocity - LFM Heat Dissipated - Watts 1000 5 Packaging Notes Bulk Tape & Reel Contact Factory for Tape and Reel Specs COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
| More datasheets: PT7C5006ANEWE | PT7C5006ANEWEX | PT7C5006ANDWEX | PT7C5006ANDWE | AS1539-TS_EK_ST | AS1539-BTST | AS1539-BTSU | AS1541-BQFT | 264-10SURD/S530-A3 | FMS7G10US60S |
Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 834000T00000 Datasheet file may be downloaded here without warranties.