833802T00000
833802T00000 Datasheet
| Part | Datasheet |
|---|---|
833802T00000 |
833802T00000 (pdf) |
| PDF Datasheet Preview |
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| Board Level Heat Sinks P/N: TO-220 Temp Rise Above Ambient -oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 • Size x 24.0MM • Material Copper, 0.6MM Thick • Type Stamped • Finish Tin Plate • IC Mounting Integrated Spring • PCB Mounting Solderable Device Leads • Package Bulk • No Hardware Device Attachment • Constant Spring Force Tension • RoHS Compliant CUSTOMIZED HEAT SINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 80 60 40 20 Air Velocity - LFM Heat Dissipated - Watts 1000 20 16 12 8 4 0 COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
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