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833702T00000 (pdf) |
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Board Level Heat Sinks P/N: TO-220 Temp Rise Above Ambient -oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 • Size x 28.0mmm • Material Copper, 0.6mm thick • Type Stamped • Finish Tin Plate • PCB Mounting Solderable Tabs • IC Mounting Integrated Spring • Package Bulk • No Hardware Device Attachment • Constant Spring Force Tension • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 60 40 Air Velocity - LFM 1000 10 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
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