833302B02800
833302B02800 Datasheet
P/N 833302B02800
| Part | Datasheet |
|---|---|
833302B02800 |
833302B02800 (pdf) |
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| Board Level Heat Sinks P/N 833302B02800 TO-220, TO-262 Temp Rise Above Ambient -oC Mounting Surface Thermal Resistance - oC / Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 & TO-262 • Size x mm • Material Aluminum, mm thick • Type Stamped • Finish Black Anodized • PCB Mounting Solderable Spring Tab • IC Mounting Integrated Spring • Package Bulk • No Hardware Device Attachment • Constant Spring Force Tension • Vertical Mounting via Solderable Tab • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 60 40 Air Velocity - LFM 1000 20 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
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