832700T00000
832700T00000 Datasheet
| Part | Datasheet |
|---|---|
832700T00000 |
832700T00000 (pdf) |
| PDF Datasheet Preview |
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| Board Level Heat Sinks P/N & Temp Rise Above Ambient -oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient D2 PAK, TO-263 PRODUCT SPECIFICATIONS • Devices D2 PAK, TO-263 • Size x mm • Copper, mm Thick • Type Stamped • PCB Mounting Surface Mount Technology • Finish Tin Plate • Package Bulk or Tape & Reel • No Hardware Device Attachment • Direct SMT Contact to PCB • Solderable Legs • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Body Configurations • Contact Applications Engineering 0 50 40 30 20 10 Air Velocity - LFM Heat Dissipated - Watts 1000 20 16 12 8 4 0 Packaging Bulk Tape & Reel Notes Contact Factory for Tape and Reel Specs COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
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