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832202B00000 (pdf) |
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Board Level Heat Sinks P/N: TO-220 Temp Rise Above Ambient -oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 • Size x mm • Material Aluminum, mm thick • Type Stamped • Finish Black Anodized • PCB Mounting Device Leads • IC Mounting Integrated Spring • Package Bulk • No Hardware Device Attachment • Constant Spring Force Tension • Device Alignment Rails • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 60 40 Air Velocity - LFM Heat Dissipated - Watts 1000 20 COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
More datasheets: 55-00083 | 55-00005 | 55-00048 | 55-00043 | 55-00084 | 55-00097 | 55-00098 | 55-00004 | 3548 | 948 |
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