831502B03700
831502B03700 Datasheet
P/N 831502B03700
| Part | Datasheet |
|---|---|
831502B03700 |
831502B03700 (pdf) |
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| Board Level Heat Sinks P/N 831502B03700 TO-220, TO-262 Temp Rise Above Ambient - 0C Mounting Surface Thermal Resistance -0C/Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 & TO-262 • Size x mm • Material Aluminum, mm Thick • Type Stamped • IC Mounting Integrated Spring • PCB Mounting Solderable Step Tab • Finish Black Anodized • Package Bulk • No Hardware Device Attachment • Constant Spring Force Tension • Vertical Mounting via Solderable Tab • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 60 40 Air Velocity - LFM Heat Dissapated - Watts 1000 10 COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
| More datasheets: CY7C1018CV33-12VXI | CY7C1018CV33-12VXIT | 10324 | B32559C8102K289 | B32559C8102K001 | B32559C8102K000 | CS220-10D | CS220-10M | CS220-10N | CS220-10B |
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